21 October 2025 | 9:13PM CST Equity Research We expect substrate suppliers with higher exposure to BT substrates to outperform Goldman Sachs does and seeks to do business with companies covered in its research reports. As a result, investors should be aware that the firm may have a conflict of interest that could affect the objectivity of this report. Investors should consider this report as only a single factor in making their investment decision. For Reg AC certification and other important disclosures, s ...

Summary of Conference Call Notes Industry Overview - The conference call discusses the Taiwan ABF (Ajinomoto Build-up Film) and BT (Bismaleimide Triazine) substrate industry, focusing on pricing trends and supply chain dynamics. Key Companies Mentioned - NYPCB (Nanya PCB) - Unimicron Technology - Kinsus - Ibiden Core Insights and Arguments 1. **Pricing Hike Expectations**: - A pricing hike for both ABF and BT substrates is anticipated in October, driven by a ~30% increase in T-glass related raw material costs, which accounts for ~5% of ABF and ~15% of BT substrate COGS [1][4] - Expected pricing increases: ABF substrate by 10%+ and BT substrate by 15%+ [1][4] 2. **Demand and Supply Dynamics**: - Solid demand for AI ABF substrates is expected, aligning with capacity expansion plans from Ibiden [2] - A supply shortage for ABF and BT substrates is projected due to lengthening raw material lead times and low inventory levels among suppliers [4][7] 3. **Earnings and Price Target Revisions**: - NYPCB's price target raised from NT$280 to NT$310, reflecting a positive outlook on revenue and gross margin improvements [3][14] - Unimicron's price target increased from NT$130 to NT$144, maintaining a Neutral rating due to high exposure to LTA business [3][20] 4. **Market Share and Competitive Position**: - NYPCB is expected to benefit significantly from the pricing uptrend, with a projected earnings CAGR of 175% from 2025 to 2027 [21][22] - Unimicron holds a 27% market share in ABF substrates but may lose market share in the AI server PCB segment due to production yield issues [24] 5. **Long-term Supply Constraints**: - T-glass supply is expected to remain tight until new capacity comes online in 1Q27, leading to sustained pricing pressure [11][12] - The shift in T-glass usage from BT to ABF substrates is anticipated due to higher demand from AI applications [8][9] Additional Important Points 1. **Raw Material Shortages**: - The shortage of T-glass could limit growth in BT applications and impact AI ASIC shipments, as T-glass is crucial for high-layer count ABF substrates [8][10] 2. **Earnings Estimates**: - NYPCB's 2025 earnings estimate revised down by 7% due to higher production costs, despite a 2% increase in revenue expectations [14] - Unimicron's earnings estimates for 2025-2027 revised up by 1-7% based on improved pricing outlook [19][20] 3. **Risks and Methodology**: - Key risks for NYPCB include slower-than-expected demand recovery and pricing upgrades [23] - Unimicron faces risks related to market share loss and demand recovery in the PC segment [25] 4. **Valuation Metrics**: - NYPCB's target price based on a 3.8x 2026E P/B, while Unimicron's target price based on a 2.1x blended 2026E P/B [22][25] This summary encapsulates the critical insights from the conference call, highlighting the dynamics of the ABF and BT substrate market, the performance outlook for key players, and the implications of raw material shortages on future growth.

Summary of Conference Call Notes Industry Overview - **Industry Focus**: Taiwan Technology, specifically AI power applications and related components such as PCBs and substrates [1][2][3][4] Key Company Insights Delta Electronics - **Positive Investor Sentiment**: Investors are optimistic about Delta's AI power business, driven by solid growth in average selling price (ASP) per watt and product shipments, despite concerns regarding profitability and valuation [2][6] - **Revenue Growth**: Delta's revenue increased by 5% month-over-month and 27% year-over-year, reaching NT$47.9 billion, attributed to strong demand for AI power supply units (PSUs) [9] - **Market Share and Product Upgrades**: Delta is expected to maintain a high market share in the AI server PSU market, with AI power revenue projected to grow from 12% of total revenue in 2025 to 31% and 47% in 2026 and 2027, respectively [15][9] - **Long-term Growth Drivers**: The company is well-positioned to benefit from trends in EV, 5G infrastructure, and data center power needs, with a projected revenue CAGR of over 20% from 2023 to 2030 [35] NYPCB - **Substrate Market Position**: NYPCB is expected to benefit from favorable pricing trends in BT and non-LTA ABF substrates, with a significant portion of revenue (70%+) coming from these segments [38] - **Earnings Growth Outlook**: Anticipated earnings growth of 175% from 2025 to 2027, driven by increasing demand and pricing power in the substrate market [38] Zhen Ding Technology (ZDT) - **Market Share Expansion**: ZDT is projected to capture over 40% of the ABF substrate market in China by 2027, benefiting from the growing demand for AI computing components [40] - **Revenue Contribution from New Products**: The company is expected to see foldable smartphones contribute significantly to revenue, accounting for over 55% by 2027 [40] Competitive Landscape - **PCB and Substrate Competition**: Concerns exist regarding aggressive expansion plans from PCB players, which may lead to unfavorable competition dynamics. However, demand for AI PCBs is expected to grow at a CAGR of 40-50% from 2025 to 2027, while tier 1 suppliers' capacity growth is projected at 25-30% [3][4] - **Pricing Trends**: BT substrate prices have already increased by 20-25% since July, with further hikes expected due to T-glass shortages. ABF substrate pricing is anticipated to rise by 5-10% per quarter starting from Q4 2025 [20][22] Investment Ratings - **Delta Electronics**: Maintained a Buy rating with a target price of NT$670, reflecting a favorable long-term outlook despite valuation concerns [5][36] - **NYPCB**: Also rated Buy, with a target price of NT$280, supported by strong earnings growth potential [39] - **ZDT**: Rated Buy, with a target price of NT$220, driven by positive market dynamics in the ABF substrate sector [42] Risks and Considerations - **Market Risks**: Key risks include slower-than-expected growth in AI server power consumption, potential market share loss, and currency fluctuations impacting profitability [36][39][43] - **Valuation Concerns**: Some investors express discomfort with Delta's current valuation compared to historical averages, suggesting a need for caution [11] Conclusion - The Taiwan technology sector, particularly in AI power and related components, presents significant growth opportunities. Companies like Delta, NYPCB, and ZDT are well-positioned to capitalize on these trends, although investors should remain aware of competitive pressures and market risks.

Summary of Key Points from the Conference Call Industry Overview - **Industry**: China PCB (Printed Circuit Board) Sector - **Key Focus**: AI demand and its impact on PCB design and production Core Insights 1. **AI Demand**: AI remains the most significant driver of demand in the PCB sector, particularly for High Density Interconnect (HDI) and High Layer Count (HLC) PCBs, with strong order visibility extending into Q3 and Q425 [2][3] 2. **Midplane Adoption**: Discussions indicate a potential shift towards midplane designs replacing copper cables in future AI systems, with clearer visibility expected by Q425 [2] 3. **Material Trends**: M9-grade high-speed Copper Clad Laminate (CCL) is anticipated for midplane PCBs, while interest in PTFE is declining due to its thermal expansion issues and processing challenges [2] 4. **Capacity Expansion**: Chinese PCB manufacturers are experiencing extended lead times for critical equipment due to aggressive capacity expansions, which are on schedule as orders were placed in advance [2] Company-Specific Insights Shennan 1. **Growth Drivers**: AI has significantly contributed to Shennan's growth in both data and wire communication sectors [3] 2. **Capacity Management**: Shennan is cautious about capacity expansion, resolving bottlenecks through technology upgrades and planning new capacity in Nantong and Thailand for late 2026 [3] 3. **Order Visibility**: Demand from domestic memory customers has kept order visibility strong, although there are concerns about potential double bookings due to raw material shortages [3] Dongshan 1. **Earnings Pressure**: Dongshan anticipates pressure on earnings for 2025 due to limited growth in smartphone FPC content and losses from a disposal of a non-profitable LED business [4] 2. **Consolidation Benefits**: The upcoming consolidation with Source Photonics and GMD is expected to enhance profitability through debt restructuring and operational synergies, with benefits starting in 2026 [4] Victory Giant (VGT) 1. **Capacity Expansion**: VGT is aggressively expanding its capacity, adding 15,000 sqm/month for HDI and 50,000 sqm/month for HLC in Huizhou and Thailand [5] 2. **Demand-Driven Growth**: The expansion is backed by demand from a major North American AI customer for next-gen PCB designs [5] Risks and Considerations 1. **Global AI Deployment**: Risks include slower-than-expected AI deployment both globally and in China, which could impact demand [7] 2. **CAPEX Plans**: Weaker-than-expected capital expenditure plans from hyperscalers for data centers and servers could pose risks [7] 3. **Tariffs and Regulations**: Higher tariffs affecting consumer electronics and potential tightening of environmental regulations in China are additional risks [7] Valuation and Risk Statements - **Shennan**: Valuation based on a sum-of-the-parts method, with risks including slower server demand and pricing pressures [8] - **Dongshan**: Valuation based on target PE multiples, with risks from ASP cuts and iPhone procurement challenges [8] This summary encapsulates the key points discussed in the conference call, highlighting the dynamics within the China PCB sector, company-specific developments, and associated risks.

Summary of Conference Call Notes Industry Overview - **Industry**: China PCB Sector - **Key Focus**: AI demand and its impact on PCB (Printed Circuit Board) and CCL (Copper Clad Laminate) sectors Core Insights 1. **AI Demand**: AI remains the most significant driver of demand in the PCB sector, particularly for High Density Interconnect (HDI) and High Layer Count (HLC) PCBs, with strong order visibility extending into Q3 and Q425 [2][3] 2. **Midplane Adoption**: Discussions indicate a potential shift towards midplane designs replacing copper cables in future AI systems, with clearer visibility expected by Q425 [2] 3. **Material Preferences**: M9-grade high-speed CCL is anticipated for midplane PCBs, while interest in PTFE is declining due to its thermal expansion issues and processing challenges [2] 4. **Capacity Expansion**: Chinese PCB manufacturers are experiencing extended lead times for critical equipment due to aggressive capacity expansions, which are reportedly on schedule as orders were placed in advance [2] Company-Specific Insights Shennan Circuit 1. **Growth Drivers**: AI has significantly contributed to Shennan's growth in 1H25, particularly in data and wire communication sectors [3] 2. **Capacity Management**: Shennan is cautious about capacity expansion, having resolved bottlenecks in drilling and electroplating, with new capacity expected to come online in late 2026 [3] 3. **Order Visibility**: Demand for BT substrates from domestic memory customers is strong, but Shennan is conservative about the sustainability of BT orders into 2026 due to potential double bookings [3] Dongshan 1. **Earnings Pressure**: Dongshan anticipates pressure on earnings for 2025 due to limited growth in smartphone FPC content and losses from a disposal of a loss-making LED business [4] 2. **Consolidation Benefits**: The consolidation of Source Photonics and GMD is expected to enhance profitability through debt restructuring and operational synergies, with benefits starting in 2026 [4] Victory Giant (VGT) 1. **Capacity Expansion**: VGT is aggressively expanding capacity with plans for 15k sqm/month HDI and 50k sqm/month HLC in Huizhou and Thailand, driven by demand from a major North American AI customer [5] 2. **Production Utilization**: Current capacity is fully allocated, but production utilization may be slightly affected as the company transitions to next-gen products [5] Risks and Considerations 1. **Global AI Deployment**: Risks include slower-than-expected AI deployment both globally and in China, which could impact demand [7] 2. **CAPEX Plans**: Weaker-than-expected capital expenditure plans from hyperscalers for IDCs and servers could pose risks to the PCB sector [7] 3. **Tariffs and Regulations**: Higher-than-expected tariffs and tightening environmental regulations in China could adversely affect demand for consumer electronics and automobiles [7] Valuation and Risk Statements - **Shennan Circuit**: Valuation based on sum-of-the-parts method; risks include slower server demand and pricing pressures [8] - **Dongshan**: Valuation based on target PE multiple; risks include ASP cuts and iPhone procurement challenges [8] Conclusion The China PCB sector is poised for growth driven by AI demand, with specific companies like Shennan and Dongshan navigating challenges and opportunities through strategic capacity management and consolidation efforts. However, external risks related to global deployment of AI and regulatory changes remain critical factors to monitor.

Investment Rating - The report maintains a "Buy" rating for Shennan Circuits with a 12-month target price of Rmb132, up from Rmb116.92, reflecting a positive outlook on the company's performance [1][15][21]. Core Insights - Shennan Circuits is expected to see a revenue growth of 19% YoY to Rmb5.2 billion in 2Q25, with net profit remaining relatively flat at -1% YoY due to a high base effect. The gross margin is projected to be 25.3%, slightly increasing QoQ due to product mix improvements [1][3]. - The growth in AI PCB is anticipated to be a significant driver for the company's revenue, with contributions expected to reach 18% and 20% of total revenue in 2025E and 2026E, respectively [12][15]. - The report highlights the optimization of BT substrate pricing, which is expected to positively impact earnings in 3Q25, driven by rising demand and higher raw material costs [7][15]. Summary by Sections Revenue and Profit Forecast - For 2Q25E, revenue is estimated at Rmb5,194 million, representing a 19% YoY increase and a 9% QoQ increase. The net income is projected at Rmb600 million, reflecting a -1% YoY change [3][14]. - The gross margin is expected to be 25.3%, with operating profit at Rmb635 million, indicating an 18% QoQ increase [3][14]. AI PCB Outlook - The demand for AI PCB is confirmed to remain strong, supported by increasing orders from domestic AI customers and steady overseas demand. Shennan's PCB utilization is reported to be close to 90% [2][12]. - AI PCB is projected to be the primary driver of incremental profits for Shennan in 2025E, with significant contributions to gross profit expected [18][15]. Market Position and Competitive Advantage - Shennan Circuits is well-positioned to benefit from the domestic AI infrastructure cycle in China, capturing demand overflow from PCB peers that primarily serve US customers [6][15]. - The company has been expanding its capacity both domestically and internationally to leverage opportunities in the overseas market [6][15].