Core Viewpoint - Samsung Electronics is intensifying its recruitment of experienced high-bandwidth memory (HBM) experts to regain leadership in the semiconductor industry, betting on a market rebound after a weak second quarter [2][3]. Group 1: Recruitment and Focus - Samsung is targeting experienced engineers in next-generation semiconductor and chip packaging technologies, particularly in hybrid bonding technology, which is crucial for enhancing AI and computing application performance [2]. - The company plans to hire professionals across six of its nine major business divisions, including storage chip business, foundry, semiconductor research center, global manufacturing and infrastructure, testing and system packaging, and AI center [2]. - The recruitment application deadline is August 19, with industry observers expecting a significant increase in hiring, indicating a recovery in the storage chip market [2]. Group 2: HBM Development and Market Position - Samsung is seeking packaging development experts for advanced HBM designs and product planners to communicate with customers interested in customized HBM, which features vertically stacked DRAM products [3]. - The company aims to launch customized HBM as early as next year to close the gap with HBM pioneer SK Hynix [3]. - Samsung is working on improving hybrid bonding technology, which connects chips directly without using bumps, essential for manufacturing products with 16 or more DRAM layers [3]. Group 3: Production Timeline and Challenges - Samsung has delayed the mass production of its next-generation HBM chips to 2026, indicating a more cautious approach in ongoing DRAM redesign efforts [4]. - The company initially planned to start mass production of 12-inch HBM4 modules based on 10nm-class sixth-generation 1c DRAM in the second half of 2025, but now aims to deliver early samples to major customers in Q3 2025 [4]. - Internal testing has shown progress, with a yield of about 65% for a small number of wafers as of early July, although these samples are not specifically designed for HBM applications [4]. Group 4: Financial Performance and Strategic Adjustments - Samsung's DS department, responsible for non-memory products, will halt senior employee recruitment due to expanded losses in Q2, with an operating profit of 400 billion KRW (approximately 288 million USD) [5]. - The DS department's performance has been a significant factor in Samsung's quarterly results, alongside the foundry division [5]. Group 5: Competitive Landscape - SK Hynix is aggressively expanding its HBM offerings, anticipating strong demand driven by AI model training and new product launches, with plans to double HBM sales by 2025 [6]. - The company is preparing for the next generation HBM4, aiming for commercialization in 2026 after distributing early samples in March [6]. - SK Hynix is also focusing on expanding its GDDR7 product line for AI graphics cards and maintaining a cautious investment strategy in NAND memory [6].

Core Viewpoint - Samsung Electronics is intensifying its recruitment of experienced high-bandwidth memory (HBM) experts to regain leadership in the semiconductor industry, particularly after a weak second quarter, while simultaneously reducing hiring in its underperforming foundry division [1][3]. Group 1: Recruitment Strategy - The recruitment aims to attract senior engineers proficient in next-generation semiconductor and chip packaging technologies, including hybrid bonding technology, which is crucial for enhancing AI and other computing applications [3]. - Samsung's Device Solutions (DS) division plans to hire experienced professionals across six of its nine major business units, including storage chip business, foundry, semiconductor research center, global manufacturing and infrastructure, testing and system packaging, and AI center [3]. - The company will open applications for the second half of the year by August 19, with industry observers expecting a significant increase in recruitment scale, indicating a recovery in the storage chip market [3]. Group 2: HBM Development - Samsung is seeking packaging development experts to design new architectures for advanced HBM, while product planners will communicate with customers interested in customized HBM [3]. - Customized HBM refers to versions of vertically stacked DRAM products with customer-specified functionalities, with Samsung aiming to launch this by 2026 to close the gap with SK Hynix [3]. Group 3: Technology Advancements - Samsung is working on improving hybrid bonding technology, which connects chips directly without using bumps, essential for producing products with 16 or more DRAM layers, reducing stack thickness and heat generation [4]. - The current leading AI memory chip in mass production is the 12-layer HBM3E, while SK Hynix is set to showcase the 16-layer HBM3E chip in early 2025 [4]. Group 4: Business Adjustments - Samsung plans to halt senior recruitment in its system LSI business by the second half of 2025, which is responsible for developing non-storage chip products like Exynos application processors and image sensors, as this division has seen an increase in losses [4]. - Both the foundry and system LSI divisions have been significant factors dragging down Samsung's quarterly performance [4].