Core Viewpoint - The U.S. Department of Commerce's BIS has added 23 Chinese entities to the Entity List, primarily affecting 13 semiconductor companies, prompting China to initiate an anti-discrimination investigation against U.S. measures in the integrated circuit sector [1][2][4] Group 1: U.S. Entity List and Its Implications - The U.S. has cited "violations of U.S. national security or foreign policy interests" as the reason for placing 23 Chinese entities on the Entity List [2] - Entities on the list require licenses for all items governed by EAR, with a presumption of denial for these licenses [2] - Notable companies on the list include Fudan Microelectronics Group, which is a leader in MCU, security and identification chips, and non-volatile memory [3] Group 2: China's Response - China has launched an anti-discrimination investigation into U.S. measures affecting the integrated circuit sector, focusing on discriminatory bans and restrictions since 2018 [4] - The investigation will begin on September 13, 2025, and typically lasts for three months, with potential follow-up measures based on the findings [4] Group 3: Investment Strategy and Focus Areas - The company maintains that U.S. restrictions on semiconductor exports will continue to strengthen but their effectiveness will gradually diminish, accelerating domestic substitution in China's AI and semiconductor industries [6] - Key areas for investment focus include: 1. Wafer foundries as core strategic assets for domestic semiconductor substitution [6] 2. Computing chip design firms that are rapidly building local technology systems [6] 3. Companies with low domestic production rates in advanced manufacturing equipment [6] 4. Advanced packaging technologies in AI chips, particularly in 2.5D/3D/HBM areas [6]

Investment Rating - The report maintains a "Recommended" rating for the company, indicating a potential upside of over 15% relative to the benchmark index [6][12]. Core Insights - The company reported a revenue of 1.839 billion yuan for the first half of 2025, a year-on-year increase of 2.49%, but the net profit attributable to shareholders decreased by 44.38% to 194 million yuan [1][2]. - The decline in net profit is attributed to reduced government subsidies and increased inventory impairment losses, totaling approximately 172 million yuan, with 143 million yuan specifically for inventory [2][3]. - The FPGA product line showed significant growth, with a year-on-year increase of 23.15%, contributing positively to the company's operations [2][3]. - The company is a leading domestic FPGA supplier and is actively developing new products, including FPAI chips, which integrate CPU, FPGA, and NPU technologies [3]. Financial Performance Summary - For the first half of 2025, the company achieved a gross margin of 56.80%, an increase of 0.31 percentage points year-on-year [2]. - The revenue breakdown for various product lines includes approximately 393 million yuan from security and identification chips, 440 million yuan from non-volatile memory, 248 million yuan from smart meter chips, and 681 million yuan from FPGA and other products [2]. - The company expects net profits for 2025, 2026, and 2027 to reach 641 million yuan, 1.077 billion yuan, and 1.505 billion yuan, respectively, with corresponding price-to-earnings ratios of 83, 50, and 36 [3][5].

Core Viewpoint - Fudan Microelectronics (688385.SH) is actively developing AI-related chips, focusing on FPGA and PSoC products for various applications in communication, industrial control, and high-reliability sectors [1] Group 1: AI Chip Development - The company identifies key AI chips as GPU, FPGA, and ASIC [1] - Current AI applications primarily utilize FPGA and PSoC products [1] - The company is advancing the development of next-generation edge computing chips PSoC and smart communication chips RFSoC [1] Group 2: Application Areas - The company’s reconfigurable chips (FPAI) are designed for AI applications [1] - These chips can be applied in multiple fields including smart security, smart industry, smart agriculture, and smart logistics [1]

Core Viewpoint - Fudan Microelectronics (688385.SH) is actively developing AI-related chips, focusing on FPGA and PSoC products for various applications in communication, industrial control, and high-reliability sectors [1] Group 1: AI Chip Development - The company identifies key AI chips as GPU, FPGA, and ASIC, with current applications primarily in FPGA and PSoC categories [1] - Fudan Microelectronics is advancing the development of next-generation edge computing chips, specifically PSoC and smart communication chips RFSoC [1] - The company has developed reconfigurable chips (FPAI) for AI applications, applicable in smart security, smart industry, smart agriculture, and smart logistics [1]