Market Performance - The main board led the gains with notable increases in stocks such as Jinyi Film (+10.04%), Ciwen Media (+10.00%), and Changfei Fiber (+10.00%) [1] - The ChiNext board saw significant growth, particularly in Xifeng Blue Sea (+20.00%) and Ashi Innovation (+11.82%) [1] - The Sci-Tech Innovation board was also strong, with Dongxin Co. (+17.33%) and Danghong Technology (+15.79%) leading the way [1] - Active sub-industries included SW Film and Animation Production (+2.43%) and SW Games III (+1.22%) [1] Domestic News - A semiconductor project by China Electronics Technology Group focusing on silicon carbide substrates has been launched, aiming to add 1 million mm of silicon carbide single crystal and 300,000 pieces of silicon carbide substrate capacity [1] - Huajin Technology announced plans to acquire a 6% stake in Crystal Integrated for approximately 2.393 billion yuan, aiming to enhance industry chain collaboration and strategic investment [1] - According to CINNO, the installation of central control CID in China's passenger cars reached 12.84 million units in the first half of 2025, a year-on-year increase of 12%, with a high installation rate of 98% [1] - Akita Micro's production base in Thailand has been established, focusing on core business areas including new flat panel display devices and embedded software development [1] Company Announcements - Haitai Ruisheng reported a reduction in shares by major shareholders, with a total of 399,950 shares sold, accounting for 0.66% of the total share capital [3] - Zhuoyi Information disclosed a reduction of 2,259,989 shares by a shareholder, representing 1.87% of the current total share capital [3] - Zhongke Software completed a share reduction plan, selling 16,620,800 shares, which is 2% of the total shares [3] - Fudan Microelectronics projected a revenue of approximately 1.82 billion to 1.85 billion yuan for the first half of 2025, reflecting a year-on-year increase of 1.44% to 3.12%, while net profit is expected to decrease by 39.67% to 48.29% [3] Overseas News - Hanmi Semiconductor expressed confidence in dominating the HBM4 market for high bandwidth memory bonding machines amid increasing competition [2] - Japan Display Inc. (JDI) has decided to sell its manufacturing equipment at the Mobara factory and terminate production operations early [2] - Canalys reported a 1% increase in U.S. smartphone shipments in Q2 2025 due to tariff concerns, with the proportion of U.S. smartphones assembled in China dropping from 61% to 25% [2] - EssilorLuxottica announced a 5.5% revenue growth to 14 billion euros (approximately 16.2 billion USD) in the first half of 2025, driven by a doubling in sales of Ray-Ban Meta AI glasses [2]

Core Viewpoint - Hanmi Semiconductor is confident in dominating the increasingly competitive HBM4 (High Bandwidth Memory) TC bonding machine market and has received orders for the next-generation Fluxless Bonder, expected to be delivered in the second half of the year [1][2]. Group 1: Company Performance and Market Position - Hanmi Semiconductor reported a projected sales revenue of 180 billion KRW and an operating profit of 86.3 billion KRW for Q2 2025, representing year-on-year growth of 45.8% and 55.7% respectively, with an operating profit margin of 47.9% [2]. - The company anticipates that if the growth trend continues in the second half of the year, total sales for the year could reach between 800 billion and 1.1 trillion KRW [2]. Group 2: Market Strategy and Customer Base - Hanmi Semiconductor aims to secure all major customers' orders for HBM4 TC bonding machines, leveraging long-term partnerships and accumulated mass production experience [3]. - The company is actively expanding its overseas sales of TC bonding machines, with profit margins in international markets being 30-40% higher than domestic ones [3]. Group 3: Technological Advancements - The company is preparing to deliver Fluxless Bonding machines this year, which will reduce bonding gaps and enable thinner HBM packaging structures [4]. - Hanmi Semiconductor is also developing Hybrid Bonding equipment, which does not use bump connections, aiming to further reduce packaging thickness and improve heat dissipation [4]. - A planned investment of 100 billion KRW is set for a new factory to produce next-generation products, with the Hybrid Bonding machine expected to launch in 2027 [4].