Core Viewpoint - Hanmi Semiconductor is confident in dominating the increasingly competitive HBM4 (High Bandwidth Memory) TC bonding machine market and has received orders for the next-generation Fluxless Bonder, expected to be delivered in the second half of the year [1][2]. Group 1: Company Performance and Market Position - Hanmi Semiconductor reported a projected sales revenue of 180 billion KRW and an operating profit of 86.3 billion KRW for Q2 2025, representing year-on-year growth of 45.8% and 55.7% respectively, with an operating profit margin of 47.9% [2]. - The company anticipates that if the growth trend continues in the second half of the year, total sales for the year could reach between 800 billion and 1.1 trillion KRW [2]. Group 2: Market Strategy and Customer Base - Hanmi Semiconductor aims to secure all major customers' orders for HBM4 TC bonding machines, leveraging long-term partnerships and accumulated mass production experience [3]. - The company is actively expanding its overseas sales of TC bonding machines, with profit margins in international markets being 30-40% higher than domestic ones [3]. Group 3: Technological Advancements - The company is preparing to deliver Fluxless Bonding machines this year, which will reduce bonding gaps and enable thinner HBM packaging structures [4]. - Hanmi Semiconductor is also developing Hybrid Bonding equipment, which does not use bump connections, aiming to further reduce packaging thickness and improve heat dissipation [4]. - A planned investment of 100 billion KRW is set for a new factory to produce next-generation products, with the Hybrid Bonding machine expected to launch in 2027 [4].

申请入围"中国IC独角兽" 半导体高质量发展创新成果征集 2024年，HBM成为半导体产业最炙手可热的产品之一。 随着AI大模型和高性能计算的狂飙突进，英伟达等巨头对HBM的需求水涨船高，内存厂的HBM订单早 已售卖一空，尤其是SK海力士，其在HBM市场占有率高达70%，更是赚得盆满钵满。 然而，就在这股浪潮背后，名为"TCB（Thermal Compression Bonding）键合机"的设备，正在悄然决定 HBM产业链的上限，不论是SK海力士，还是美光三星，都在过去一年时间里加大了设备方面的投入， 也让更多设备厂商有机会吃上这波AI红利。 什么是TCB？ 先来了解一下目前HBM芯片的键合技术。在传统的倒装芯片键合中，芯片被"翻转"，以便其焊料凸块 （也称为 C4 凸块）与半导体基板上的接合焊盘对齐。整个组件被放置在回流炉中，并根据焊料材料均 匀加热至 200ºC-250ºC 左右。焊料凸块熔化，在接合和基板之间形成电气互连。 随着互连密度的增加和间距缩小到 50µm 以下，倒装芯片工艺面临一些挑战。由于整个芯片封装都放入 烤箱中，芯片和基板会因热量而以不同的速率膨胀（即不同的热膨胀系数，CTE），从而产 ...

Core Viewpoint - The article discusses Micron's strategic move to establish a dedicated High Bandwidth Memory (HBM) business unit in response to the growing demand for artificial intelligence, aiming to close the gap with HBM leader SK Hynix [1][2]. Group 1: Organizational Changes - Micron has created a new organizational structure consisting of four departments: Cloud Memory Business Unit (CMBU), Core Data Center Business Unit (CDBU), Mobile and Client Business Unit (MCBU), and Automotive and Embedded Business Unit (AEBU) [1]. - The CMBU will focus on providing memory solutions for hyperscale cloud service providers, including customized memory for key clients like Microsoft and AWS [1][2]. Group 2: HBM Product Development - Micron's 12-layer HBM3E has begun shipping, powering Nvidia's B300, indicating progress in their HBM offerings [2]. - The next generation HBM4 is expected to enter mass production in 2026, followed by HBM4E production between 2027 and 2028 [2]. Group 3: Bonding Technology Innovations - Micron is considering the introduction of a new bonding technology called "Fluxless," which is being evaluated by competitors like Samsung [4][7]. - The current manufacturing process uses Non-Conductive Film (NCF) technology, but there are challenges with applying NCF effectively as the number of HBM stacks increases [5][6]. - The industry is moving towards fluxless bonding technology to address reliability issues associated with traditional methods, with various companies participating in quality testing [6][5]. Group 4: Competitive Landscape - Samsung is also testing fluxless bonding technology, aiming for HBM4 completion by the end of the year, indicating a competitive race in HBM advancements [7].