Q&A 当前 AI 电子布的需求情况如何？未来价格走势如何？ 从 2025 年第四季度开始，AI 电子布的需求显著提升，特别是下游产品方案逐 渐转向二代布。2026 年，这一趋势预计将持续。客户订单近期迅速增加，但 供给端仍然紧缺，只有少数企业能够突破这一瓶颈，包括国际复材在内的供给 量尚未能完全满足市场需求。因此，二代布的价格有看涨预期，具体涨幅取决 于后续订单情况。 普通电子布当前紧缺的原因是什么？未来价格走势如何？ 普通电子布紧缺主要由于下游电子领域需求上升，从 2025 年第三、四季度开 始明显增加，尤其是超细纱和极薄布。同时，一些产能挤压也导致了设备紧缺。 虽然各个玻纤纱和玻纤织物工厂正在调整产能以应对市场需求，但短期内供需 仍然紧张。因此，普通电子布价格预计在未来几个月内持续攀升。 国际复材 20260121 摘要 二代布供应紧张，仅少数企业如国际复材能突破瓶颈，预计价格上涨， 涨幅取决于后续订单量。国际复材虽有新增产能，但仍面临纱线短缺。 普通电子布因下游需求增加，特别是超细纱和极薄布，以及产能挤压导 致设备紧缺，预计未来数月价格持续攀升。各工厂虽调整产能，但短期 内供需紧张难缓解。 丰田织机因 ...

Summary of Conference Call Records Industry Overview - The focus is on the AI-PCB (Printed Circuit Board) industry chain, which is experiencing significant growth driven by the surge in AI server demand. The PCB demand for AI servers is expected to double by 2026, primarily benefiting from ASEC demand and increased shipments of Nvidia racks, leading to an overall supply-demand imbalance in the market [1][2]. Key Points and Arguments - **Market Demand**: The AI PEB (Printed Electronic Board) industry is projected to see a doubling in demand from 2025 to 2026, with major contributions from Meta, Google, and Amazon, which collectively require approximately 600,000 PEBs in 2026, up from 300,000 in 2025. Nvidia's rack shipments are also expected to increase from 30,000 in 2025 to 60,000 in 2026, indicating a strong market outlook [2]. - **Material Price Trends**: The prices of upstream materials such as fiberglass cloth, resin, and copper foil are on the rise, contributing to an upward trend in the overall market landscape. This is expected to lead to a tightening of mid-to-low-end production capacities and potential price increases due to overseas manufacturers shifting towards high-end capacities [1][4]. - **Technological Advancements**: The development of AI servers necessitates higher performance requirements for PCBs. Nvidia's new architecture utilizes high-frequency, low-dielectric PCBs, which rely on advanced materials like HVLP copper foil and LDK electronic cloth to enhance data efficiency and reduce power consumption [1][6]. - **Future Trends**: The PCB market is expected to trend upwards, particularly with the increasing value of ASIC-related PCBs. The anticipated demand resonance could push stock valuations to 20 times earnings. New materials such as HVLP copper foil and LDK electronic cloth are seen as having significant potential [5][6]. Additional Important Insights - **LODK Material Market**: The current monthly shipment of LODK materials is approximately 7.4 million meters, projected to rise to 11.5 million meters by the end of 2025, corresponding to a market space of 5 billion yuan. By the end of 2026, shipments are expected to reach 18 million meters, with a market space of 8.4 billion yuan. The shortage of second-generation products is driving customers to switch to Q cloth [7]. - **High-Performance Materials**: High-frequency and high-speed resins are crucial for CCL (Copper Clad Laminate) PCBs. Companies like Shengquan Group and Dongcai Technology are performing well in this sector, with significant growth in high-frequency resin business expected [10]. - **Key Companies to Watch**: In the LODK materials sector, companies such as Zhongcai Technology, Honghe Technology, and Feilihua are noteworthy. In the high-end copper foil sector, attention is drawn to Tongguan Copper Foil, which is set to reach a total capacity of 80,000 tons by the end of 2024, along with other companies like Jiayuan Technology and Nord Technology [11].