外媒称，目前传闻的新功能有六项，包括 OLED 显示屏、触控功能、灵动岛、采用台积电2nm制程工艺 的 M6 Pro 和 M6 Max 芯片、更薄的设计以及内置蜂窝网络连接。 外媒表示，确切的发布时间尚未可知。苹果过去曾一年内两次更新 MacBook Pro，M2 Pro 和 M2 Max 机型于 2023 年 1 月发布，M3 Pro 和 M3 Max 机型则于 2023 年 10 月发布。因此，M5 Pro 和 M5 Max 机 型有可能很快发布，而配备 OLED 显示屏的机型则可能在今年晚些时候推出。不过，目前来看，2027 年似乎是更稳妥的选择。（思瀚） 来源：环球网 【环球网科技综合报道】1月23日消息，据MacRumors报道，苹果预计很快将发布搭载 M5 Pro 和 M5 Max 芯片的 MacBook Pro 机型，但更大的变化即将到来——下一代MacBook Pro将于 2026 年底或 2027 年迎来重大改款。 ...

Core Viewpoint - Apple is advancing its self-developed chip strategy with the upcoming launch of the iPhone 17 series, new Mac models, and Apple Watch, indicating a significant shift in its hardware differentiation and vertical integration approach [1][2]. Group 1: Chip Development - Apple is developing at least seven new chips, including A19, A19 Pro, M5, M5 Pro, a new Apple Watch chip, a second-generation 5G modem (C2), and a combined Bluetooth and Wi-Fi chip (Proxima) [1][2]. - The A19 chip will be used in the iPhone 17 Air, while the A19 Pro will be featured in the iPhone 17 Pro and Pro Max, reinforcing Apple's strategy of using differentiated processors for high-end models [1]. - The M5 and M5 Pro processors are expected to be introduced in the updated 14-inch and 16-inch MacBook Pro series following the iPhone launch, continuing Apple's chip upgrade rhythm in its laptop product line [1]. Group 2: Enhancements in Wearable Technology - The Apple Watch Series 11 is anticipated to introduce a new processor (Bora), likely based on the A18 architecture, which will enhance the watch's performance and AI capabilities, solidifying Apple's leadership in the wearable market [2]. - The integration of Bluetooth and Wi-Fi into a single chip (Proxima) is expected to improve space utilization and power management across devices [2]. Group 3: 5G Technology and Future Outlook - The second-generation 5G modem (C2) is set to replace the current C1 chip used in the iPhone 16e, with expectations for it to debut in the iPhone 17e by 2025, showcasing Apple's efforts to reduce reliance on Qualcomm and strengthen its own connectivity solutions [2]. - This chip strategy reflects Apple's ongoing commitment to vertical integration and paves the way for enhanced collaboration among diverse devices, AI applications, and integrated communication technologies [2].