Proxima芯片

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曝光:苹果内部正开发的七款自研芯片
是说芯语· 2025-07-10 06:39
Core Viewpoint - Apple is advancing its self-developed chip strategy with the upcoming launch of the iPhone 17 series, new Mac models, and Apple Watch, indicating a significant shift in its hardware differentiation and vertical integration approach [1][2]. Group 1: Chip Development - Apple is developing at least seven new chips, including A19, A19 Pro, M5, M5 Pro, a new Apple Watch chip, a second-generation 5G modem (C2), and a combined Bluetooth and Wi-Fi chip (Proxima) [1][2]. - The A19 chip will be used in the iPhone 17 Air, while the A19 Pro will be featured in the iPhone 17 Pro and Pro Max, reinforcing Apple's strategy of using differentiated processors for high-end models [1]. - The M5 and M5 Pro processors are expected to be introduced in the updated 14-inch and 16-inch MacBook Pro series following the iPhone launch, continuing Apple's chip upgrade rhythm in its laptop product line [1]. Group 2: Enhancements in Wearable Technology - The Apple Watch Series 11 is anticipated to introduce a new processor (Bora), likely based on the A18 architecture, which will enhance the watch's performance and AI capabilities, solidifying Apple's leadership in the wearable market [2]. - The integration of Bluetooth and Wi-Fi into a single chip (Proxima) is expected to improve space utilization and power management across devices [2]. Group 3: 5G Technology and Future Outlook - The second-generation 5G modem (C2) is set to replace the current C1 chip used in the iPhone 16e, with expectations for it to debut in the iPhone 17e by 2025, showcasing Apple's efforts to reduce reliance on Qualcomm and strengthen its own connectivity solutions [2]. - This chip strategy reflects Apple's ongoing commitment to vertical integration and paves the way for enhanced collaboration among diverse devices, AI applications, and integrated communication technologies [2].
苹果下一代芯片曝光:包括蓝牙和WiFi
半导体行业观察· 2025-07-09 01:26
公众号记得加星标⭐️,第一时间看推送不会错过。 来源:内容 编译自 appleinsider 。 根据 AppleInsider 获得的独家信息, 几款未发布的Apple Silicon芯片最近出现在 iOS 18 的内部版本中,包括 A19、M5 和 C2。 7 月 3 日,AppleInsider 独家分享了一份设备标识符列表,其中包含十几款未发布的Mac配置,其中许多配置将搭载苹果 即将发布的 M5 芯片的变体。在我们发布该报道后,我们获悉iOS 18的内部版本中提到了多款未发布的 Apple Silicon 芯 片,适用于各种硬件平台。 该操作系统的内部版本号为22A91871y,是iOS 18 的非 UI 版本。因此,它缺乏标准的面向消费者的iOS用户界面,而是 仅包含主要用于硬件测试的基本应用程序。 这是有道理的,因为该版本是在 2025 年 3 月在iPhone 16的EVT 阶段原型上发现的,尽管该设备已经更新了一年。 视频本身解释了该设备的操作系统如何包含与几款未发布的 Apple Silicon 芯片相对应的代号和标识符,包括 M 系列 SoC、下一代 Apple 调制解调器、Apple ...