Core Viewpoint - The AI industry is driving an increase in demand and prices for high-speed materials, leading to a supply shortage of upstream high-end materials such as Low Dk electronic cloth, quartz cloth, and HVLP copper foil [1] Group 1: High-End Materials - The value of high-end CCL used in AI servers is 5-7 times higher than traditional CCL due to more layers and larger areas on AI server motherboards, as well as higher material prices [1] - The transition to M9-level CCL will require the use of Q-glass to meet dielectric performance requirements, with significant demand expected to surge starting in 2026 [2] - The supply shortage of high-end materials is expected to persist at least until the second half of 2027, prompting companies like Nitto Denko, Taishan Glass Fiber, and others to expand production [2] Group 2: HVLP Copper Foil - HVLP copper foil has evolved to HVLP4 and is expected to become the mainstream for GPU and ASIC AI PCB applications by 2026, with a significant supply gap for high-end copper foil [3] - Major suppliers in mainland China, Taiwan, and Japan are raising prices due to the supply-demand imbalance, making high-end products more valuable [3] Group 3: Electronic Resins - The new generation of resins is becoming the mainstream direction for upgrades, with a significant increase in the value of resins used in M9 CCL, particularly with a 2:1 ratio of hydrocarbon resin to PPO [4] Group 4: Fillers - The proportion of spherical silica micro-powder in M9 is expected to exceed 40%, with liquid-phase silica preparation meeting the requirements for M7 and above [5] Group 5: Other Upstream PCB Materials - Electronic-grade copper powder is essential for high-end PCB upgrades, while PCB-specific electronic chemicals are crucial for key processes like chemical copper deposition and electroplating, driving product updates and domestic substitution [6] Group 6: Investment Targets - Suggested companies to focus on include: 1) Low dielectric electronic cloth: Honghe Technology (603256.SH), Feilihua (300395.SZ), Zhongcai Technology (002080.SZ) [7] 2) HVLP copper foil: Tongguan Copper Foil (301217.SZ), Defu Technology (301511.SZ), Longyang Electronics (301389.SZ) [7] 3) Electronic resins: Dongcai Technology (601208.SH), Shengquan Group (605589.SH), Hongchang Electronics (603002.SH), Tongyu New Materials (301630.SZ) [7] 4) Fillers: Lianrui New Materials (688300.SH) [8] 5) Other upstream PCB materials: Jiangnan New Materials (603124.SH) for electronic-grade copper powder, and Tiancheng Technology (688609.SH) for PCB-specific electronic chemicals [8]