Investment Rating - The investment rating for the company is "Buy" (maintained) [7] Core Views - The company's performance in Q2 2025 reached a new high, with revenue of 2.63 billion yuan, a year-on-year increase of 58%, and a net profit of 1.159 billion yuan, up 95% year-on-year. The interconnect chip product revenue was 2.46 billion yuan, growing 61% year-on-year, with a gross margin of 64%, an increase of 1.91 percentage points year-on-year [1] - The rapid penetration of DDR5 memory modules is expected to exceed 50% in 2024 and 85% in 2025, driving significant growth in the company's revenue and profit due to strong demand from data centers [2] - The company is well-positioned to benefit from the AI trend, with a comprehensive product layout in high-speed interconnects, including PCIe/CXL interconnect chips and Ethernet/optical interconnect chips, which are crucial for data center networking [3][4] Financial Summary - The company is projected to achieve revenues of 5.49 billion yuan, 7.91 billion yuan, and 9.48 billion yuan for 2025, 2026, and 2027 respectively, representing year-on-year growth of 50.9%, 44.1%, and 19.9%. The net profit is expected to be 2.51 billion yuan, 3.56 billion yuan, and 4.40 billion yuan for the same years, with growth rates of 77.5%, 42.0%, and 23.5% respectively [5][11]

Investment Rating - The report assigns a "Buy" rating for the company, with a target price of 160.00 CNY [1][8]. Core Insights - The company experienced a significant revenue growth of 50% in Q2 2025, with a net profit increase of over 80%, reflecting strong demand in the memory industry and an increase in production and sales scale [8]. - The company is positioned to benefit from the rapid growth in AI demand, with expectations of a substantial increase in domestic computing power needs over the next three years [8]. - The company's three high-performance chips generated a sales revenue of 290 million CNY in the first half of 2025, marking a significant year-on-year increase [8]. - The overall gross margin improved to 60.44%, up 2.66 percentage points from the previous year, driven by increased sales of DDR5 memory interface chips and high-performance chips [12]. Financial Summary - For the fiscal year ending December 31, 2023, the company is projected to achieve a net profit of 451 million CNY, with a year-on-year growth of 205.74% expected in 2024 [11]. - The earnings per share (EPS) is forecasted to grow from 0.40 CNY in 2023 to 2.27 CNY in 2025, reflecting a significant increase in profitability [11]. - The price-to-earnings (P/E) ratio is expected to decrease from 311.12 in 2023 to 36.27 by 2027, indicating a more attractive valuation as earnings grow [11].

Core Viewpoint - The company is experiencing significant growth in revenue and net profit, driven by the booming AI industry and increased demand for its products, particularly DDR5 memory interface and module supporting chips [1][3]. Financial Performance - The company expects to achieve approximately 2.633 billion yuan in revenue, representing a year-on-year increase of about 58.17% [1]. - The net profit attributable to the parent company is projected to be between 1.1 billion and 1.2 billion yuan, reflecting a year-on-year growth of 85.50% to 102.36% [1]. Product Demand and Sales Growth - The increase in sales is attributed to a significant rise in the shipment volume of DDR5 memory interface and module supporting chips, as well as a higher proportion of second and third-generation RCD chip shipments [3]. - The company reported a total sales revenue of 294 million yuan from three high-performance transport chips, marking a substantial increase compared to the previous year [3]. Future Outlook - The company anticipates setting new historical highs in revenue, interconnect chip sales revenue, net profit attributable to the parent company, and net profit excluding non-recurring gains and losses in the second quarter of 2025 [3]. - It is expected that interconnect chip sales revenue and net profit will achieve a continuous increase for nine consecutive quarters [3]. IPO Plans - The company is preparing for an IPO in the Hong Kong stock market, having submitted its prospectus on July 11, with China International Capital Corporation, Morgan Stanley, and UBS Group acting as joint sponsors [3]. Company Profile - The company is a fabless integrated circuit design firm focused on providing innovative, reliable, and energy-efficient interconnect solutions for cloud computing and AI infrastructure [5].