Core Viewpoint - Major U.S. companies like Apple, AMD, NVIDIA, and Broadcom are increasingly relying on TSMC for advanced semiconductor manufacturing, particularly in response to growing demand for AI-related technologies and products [1][2] Group 1: TSMC's Expansion Plans - TSMC is accelerating the production timeline for its Arizona facilities, with the first factory now expected to begin mass production of 4nm chips in Q4 2024, ahead of the original 2025 schedule [1] - The second factory, initially set for 2028, is now targeted for production in early 2027 or possibly within 2026 [1] - The third factory is anticipated to start production of N2 and A16 processes by around 2028, which is at least four quarters earlier than planned [1] Group 2: Client Demand and Partnerships - NVIDIA's CEO recently visited TSMC to discuss the production of the next-generation Rubin platform, which includes six confirmed product designs [1] - AI giants like OpenAI are also rapidly increasing their demand for TSMC's advanced manufacturing capabilities, collaborating with major clients such as Broadcom and Marvell [2] - Intel, despite receiving government investment, is still outsourcing more orders to TSMC due to its own production capacity limitations [2] Group 3: Financial Implications - TSMC has acknowledged that the ramp-up of overseas wafer fabs will dilute its gross margin starting in 2025, with an initial impact of about 2% to 3% per year, increasing to 3% to 4% in later years [2] - The support from U.S. clients is crucial for the rapid growth and profitability of TSMC's new facilities in the U.S. [2] - TSMC plans to mitigate margin pressures by expanding operations in Arizona and improving cost structures while maintaining close collaboration with clients and suppliers [2]

将采用3纳米制程技术的第二座晶圆厂则已经完成建设，来自美国先进制程客户兴趣浓厚，为此，台积 电正致力将当地厂区量产进度加速数个季度，以支持客户需求。 台积电预告，将采用N2和A16制程技术的亚利桑那第三座晶圆厂已经开始动工，由于客户对AI相关的需 求强劲，也将考虑加快生产进度。 台积电（2330）面临今年第4季新台币与美元营收恐不如第3季，为近十年首次出现第4季旺季业绩出现 季减的状况。 不过，台积电仍积极争取更多成长机会，特别是在客户群狂催下，美国六个厂的超大晶圆厂计划持续加 速推进。 台积电已拍板加码美国亚利桑那州厂区投资，预期在美国先进制程客户以及美国联邦政府、州政府和市 政府大力合作和支持下，有意投资总共1,650亿美元于美国先进半导体制造，当中包含六个晶圆厂、两 座先进封装厂，以及一间主要研发中心。 台积电预估，美国亚利桑那州专案投资到位后，估30%的2纳米以下先进制程产能将在当地生产，进而 支援苹果、英伟达、超微、高通与博通等美系大客户需求。 台积电在亚利桑那州的第一座晶圆厂已于2024年第4季采用4纳米制程技术成功进入量产，良率与台湾厂 相当。 当地第四座晶圆厂将采用N2和A16制程技术，而第五 ...