Core Viewpoint - The article discusses the advancements and competitive landscape in the glass substrate market, particularly focusing on glass core substrates and interposers used in semiconductor packaging, highlighting the transition towards panel-level forms and the implications for supply chain dynamics [2][4][5]. Group 1: Technology and Market Dynamics - Glass core substrates are primarily competing with organic IC substrates, while glass interposers are competing with organic and silicon interposers, with both technologies showing similar manufacturing processes [2][4]. - PLP (Panel Level Packaging) technology is an early commercial advanced packaging direction that allows for finer metal wiring compared to metal substrates, indicating a trend towards more sophisticated packaging solutions [2][4]. - The interconnectivity of processes between glass core substrates and PLP technology is expected to alter the supply chain dynamics and increase demand for related products [4][5]. Group 2: Future Trends and Industry Players - As demand and penetration rates grow, the need for advanced lithography equipment in glass core substrates and PLP technology is anticipated to rise, with a focus on materials like ABF or PI dielectric layers [5]. - Major international players such as Intel and Samsung are investing in both glass core substrates and PLP technology, alongside domestic companies like Yicheng Technology and Guanzhi Semiconductor [6]. - A significant event, the 2025 Heterogeneous Integration Annual Conference, is planned to focus on advanced packaging technologies, aiming to foster collaboration and innovation within the industry [7].