Core Viewpoint - AMD's current Radeon RX 9000 series, based on RDNA 4 architecture, is not aimed at challenging NVIDIA in the high-end desktop GPU market, with the RX 9070 XT positioned against NVIDIA's mid-range GeForce RTX 5070 Ti [2] Group 1: AMD's Development and Future Plans - AMD's senior researcher Laks Pappu is involved in the development of next-generation GPUs, including Navi4x and Navi5x architectures, indicating potential advancements in chip design [2][3] - Pappu's experience at Intel, where he worked on high-end graphics processors, positions him to influence AMD's future GPU designs significantly [3] - The development cycle for high-end GPUs typically spans 2.5 to 3.5 years, suggesting that while RDNA 4 and CDNA 4 architectures are already defined, Pappu's input could impact the physical implementation and performance optimization of upcoming products [3][4] Group 2: Multi-Chip Design Challenges - Building multi-chip consumer GPUs presents significant challenges due to the need for high-speed, low-latency communication between processing units, which is critical for performance [5] - The complexity of software and driver integration for multi-chip GPUs adds another layer of difficulty, limiting such designs primarily to data center and HPC applications [5][6] - AMD's previous experience with multi-chip designs in CPUs and the Radeon RX 7900 series suggests that the company is well-positioned to explore multi-chip GPU architectures in the future [6] Group 3: Future Product Expectations - Pappu's involvement in the Navi 5x development indicates that AMD may adopt 2.5D or 3.5D packaging for future GPUs, potentially leading to innovative designs [4][7] - The expected release timeline for RDNA 5 is around late 2026 to early 2027, with the architecture likely entering the tape-out phase by mid-2025 [7][8] - AMD is anticipated to conduct tests on actual hardware in the coming months to evaluate the feasibility of multi-chip designs for consumer GPUs, which may lead to interesting developments [8]

Core Viewpoint - The article discusses the advancements in semiconductor technology and the release of new products, particularly focusing on the Nintendo Switch 2, which features significant upgrades in processing power and memory capacity compared to its predecessor [1]. Group 1: Semiconductor Advancements - In 2025, various products utilizing new semiconductor technologies are being launched, with a notable shift towards 3nm technology in high-end smartphones, including Xiaomi's "Xiaomi 15S Pro" [1]. - Major GPU manufacturers, including Intel, AMD, and NVIDIA, have released new GPU series, showcasing advancements in graphics technology [1]. Group 2: Nintendo Switch 2 Disassembly - The disassembly of the Nintendo Switch 2 is relatively easy, utilizing only two types of screws and minimal adhesive, making it more manufacturable compared to other devices [2][3]. - The mainboard of the Switch 2 contains 21 functional semiconductors, with a significant portion sourced from Japan, the USA, and Taiwan, indicating a diverse supply chain [6]. - The Switch 2 features a substantial increase in memory, with 12GB of LPDDR5X compared to the previous generation's 4GB, enhancing its performance capabilities [6][12]. Group 3: Structural Comparison - The Switch 2 is designed more like a portable PC rather than an upgraded smartphone, sharing structural similarities with ASUS's portable gaming PC "ROG Ally" [10]. - The internal architecture of the Switch 2 has evolved, with a focus on utilizing common PC chips, indicating a shift in design philosophy [11]. Group 4: Processor Details - The Switch 2 is powered by NVIDIA's GMLX30-A1 processor, which is a streamlined version of the AGX Orin TE990M-A1, allowing for a smaller package size while maintaining performance [18]. - The processor architecture includes 8 CPU cores and a reduced number of GPU cores compared to the Orin, reflecting a balance between performance and cost [22].