Core Viewpoint - The article discusses the advancements in semiconductor technology and the release of new products, particularly focusing on the Nintendo Switch 2, which features significant upgrades in processing power and memory capacity compared to its predecessor [1]. Group 1: Semiconductor Advancements - In 2025, various products utilizing new semiconductor technologies are being launched, with a notable shift towards 3nm technology in high-end smartphones, including Xiaomi's "Xiaomi 15S Pro" [1]. - Major GPU manufacturers, including Intel, AMD, and NVIDIA, have released new GPU series, showcasing advancements in graphics technology [1]. Group 2: Nintendo Switch 2 Disassembly - The disassembly of the Nintendo Switch 2 is relatively easy, utilizing only two types of screws and minimal adhesive, making it more manufacturable compared to other devices [2][3]. - The mainboard of the Switch 2 contains 21 functional semiconductors, with a significant portion sourced from Japan, the USA, and Taiwan, indicating a diverse supply chain [6]. - The Switch 2 features a substantial increase in memory, with 12GB of LPDDR5X compared to the previous generation's 4GB, enhancing its performance capabilities [6][12]. Group 3: Structural Comparison - The Switch 2 is designed more like a portable PC rather than an upgraded smartphone, sharing structural similarities with ASUS's portable gaming PC "ROG Ally" [10]. - The internal architecture of the Switch 2 has evolved, with a focus on utilizing common PC chips, indicating a shift in design philosophy [11]. Group 4: Processor Details - The Switch 2 is powered by NVIDIA's GMLX30-A1 processor, which is a streamlined version of the AGX Orin TE990M-A1, allowing for a smaller package size while maintaining performance [18]. - The processor architecture includes 8 CPU cores and a reduced number of GPU cores compared to the Orin, reflecting a balance between performance and cost [22].

Core Viewpoint - Xiaomi's self-developed 3nm flagship SoC chip, Xuanjie O1, is currently planned exclusively for the company's high-end flagship product line [1] Group 1: Product Development - The Xuanjie O1 chip is the first self-developed 3nm flagship SoC in mainland China, utilizing second-generation 3nm process technology [1] - The transistor count of the Xuanjie O1 reaches 19 billion, comparable to Apple's A18 Pro [1] Group 2: Performance and Future Integration - According to Xiaomi's President Lu Weibing, the performance and experience of the Xuanjie O1 are among the best globally [1] - The chip business is expected to integrate with the Pengpai OS and AI in the future, enhancing its capabilities significantly [1]