Summary of Conference Call on Liquid Cooling Technology Industry Overview - The conference focuses on the liquid cooling technology industry, particularly related to NVIDIA's GB300 and upcoming Rubin series products [1][3][5]. Key Points and Arguments Liquid Cooling Technology Developments - NVIDIA's GB300 features a full liquid cooling plate design that covers chips, memory, and power supply, but faces limitations with single-direction cooling plates, indicating a need for dual-direction plates or microchannel technology by 2026 [1][3]. - Dual-direction plates enhance cooling capacity through phase change and efficient media, while microchannel technology improves conduction efficiency but faces challenges in processing and uniformity [1][3][9]. - Vertiv's experiments with NVIDIA's NV72 system show a significant reduction in liquid usage, from 700 liters to approximately 360 liters, by employing localized silent cooling [1][7]. Cost and Component Changes - The number of quick connectors in GB300 has increased from 108 pairs in GB200 to 252 pairs, leading to a 20% to 30% increase in total cooling plate costs, primarily due to quick connectors and cleaning processes [2][29]. - The overall cost of the GB300 liquid cooling plate has risen from $49,000 to $59,000, driven by increased complexity and component requirements [29]. Future Trends and Challenges - The upcoming Rubin Ultra project is expected to adopt NV576 architecture with a TDP of 1,400 watts, necessitating advanced cooling solutions [8]. - The development of microchannel technology and dual-direction plates will significantly impact the competitive landscape, potentially introducing new players into the market [20]. Supplier Landscape - Current leading suppliers for GB300 include Qihong and Shuanghong, with domestic manufacturers like Industrial Fulian entering NVIDIA's supply chain due to cost control and rapid response capabilities [1][19]. - Domestic suppliers are increasingly participating in the market, with companies like Zhonghang Optoelectronics and Fengguang beginning to sample or collaborate to meet the growing demand for quick connectors [24]. Material and Pump Innovations - The liquid cooling system's evolution includes a shift from traditional materials to advanced options like R1,233 refrigerant, which is more environmentally friendly and has a higher boiling point than R134 [14][15]. - The importance of pumps in liquid cooling systems is rising, especially with microchannel applications requiring high stability and smooth operation [16][33]. Emerging Technologies - New materials such as graphene and silicon carbide are being explored for their thermal management properties, although their widespread application remains limited [31][32]. - Domestic universities are actively researching microchannel technology, which may lead to significant advancements in the field [34]. Additional Important Insights - The liquid cooling technology market is evolving rapidly, with significant opportunities for domestic suppliers to close the gap with established international players [21][22]. - The ASIC server market may adopt liquid cooling solutions, with companies like Google potentially leading the way, although the urgency compared to NVIDIA's needs is still under evaluation [25][26].

Summary of Conference Call Records Industry Overview - The conference call discusses advancements in liquid cooling technology within the server cabinet industry, particularly focusing on the Blackwell and Rubin series of products [1][2][6]. Key Points and Arguments 1. **Blackwell 300 Improvements**: The Blackwell 300 has undergone significant enhancements over the Blackwell 200, including a full cold plate covering that increases the number of liquid cooling plates and connectors, resulting in a 16% increase in infrastructure value and a 30% overall value increase [1][4]. 2. **Liquid Cooling System Value Distribution**: In the liquid cooling system, quick connectors hold a substantial value due to their high quantity, while the material cost of cold plates is relatively low. Major ODM manufacturers like Foxconn capture most of the core value by sourcing and assembling components [5]. 3. **Rubin Architecture Changes**: The Rubin architecture introduces a substantial technological upgrade, moving away from simple iterations to a new cooling solution, which may significantly alter supplier dynamics and market shares [6][7]. 4. **Strategic Collaboration**: Vertu and NV's strategic partnership focuses on developing next-generation cooling systems for the Rubin series, with initial tests using B100. Future cabinet power densities may reach 200-500 watts, necessitating advanced cooling methods [8]. 5. **Cost Implications of Cooling Solutions**: The coupling silent solution may double the cost per kilowatt compared to the existing Blackwell 200 solution, while the all-in-one plate attachment model could reduce costs to 1.5-1.6 times [9][10]. 6. **Future Trends in Liquid Cooling**: As server power densities increase, the adoption of comprehensive liquid cooling solutions is expected to rise, with competition among components intensifying due to declining material costs [7]. 7. **Market Entry Barriers**: New entrants into the Rubin ecosystem will depend more on supply chain relationships, capacity, and pricing rather than technical capabilities [19]. 8. **Material Compatibility Testing**: Liquid materials entering the NV ecosystem must undergo rigorous compatibility testing to prevent corrosion and ensure system integrity, typically starting 3-6 months before product release [17][18]. Additional Important Content - **Electronic Cooling Fluids**: Electronic cooling fluids are more expensive than traditional water-based coolants, with costs averaging 200-300 RMB per liter compared to less than 20 RMB per kilogram for water-based solutions. Despite better cooling performance, the long-term costs may be higher due to the need for continuous replenishment [16]. - **Domestic Supplier Landscape**: Domestic manufacturers like Invec and Bihai have entered the NV supply chain, indicating a shift towards local sourcing despite the historical reliance on foreign suppliers [14][15]. - **Impact of ASIC Shipments**: The anticipated increase in ASIC shipments in 2026 is expected to stabilize the demand for liquid cooling solutions, with no significant decline expected due to the introduction of Rubin [12]. This summary encapsulates the critical insights from the conference call, highlighting the advancements in liquid cooling technology and the strategic movements within the industry.