Core Viewpoint - The company, Invt (002334.SZ), has stated that its liquid cooling products currently do not utilize microchannel technology [1] Company Summary - Invt has clarified its position on the technology used in its liquid cooling products, indicating that microchannel technology is not part of its current offerings [1]

Core Insights - The article discusses the increasing demand for AI computing power and the challenges in thermal management, particularly the introduction of microchannel liquid cooling plate (MLCP) technology as a potential solution [2][57]. Group 1: MLCP Technology Overview - MLCP technology integrates a metal cover and liquid cooling plate with a microchannel design, enhancing cooling efficiency and reducing system size [4][6]. - The cost of MLCP is projected to be 3 to 5 times higher than existing cooling solutions, with manufacturing costs for GPUs potentially increasing by 5 to 7 times if MLCP is widely adopted [2][4]. Group 2: Thermal Management Challenges - The thermal power of the Rubin GPU is expected to rise from 1.8 kW to 2.3 kW, necessitating the introduction of MLCP technology by late 2026 [7][9]. - Current cooling solutions may not suffice for the increasing power demands of AI chips, indicating a critical need for advanced thermal management technologies [2][9]. Group 3: Industry Developments - Boyd, a leading supplier, has delivered 5 million liquid cooling plates to large-scale data centers, highlighting the growing importance of liquid cooling technology in AI computing [10]. - The article emphasizes that MLCP technology is gaining traction in the industry, with ongoing research and development efforts to address its challenges [6][57]. Group 4: Future Outlook - The article concludes that MLCP technology represents a significant advancement in thermal management for high-power AI platforms, despite facing production and technical validation challenges [57][59]. - The upcoming Thermal Management Industry Conference will focus on the latest developments in MLCP and liquid cooling technologies, providing a platform for industry experts to discuss solutions to the growing thermal challenges in AI computing [59].