Summary of Key Points Core Viewpoint - The strategic cooperation agreement signed between Beijing Lier High-Temperature Materials Co., Ltd., SenseTime Group Inc., and Hangzhou Xiwang Chip Technology Co., Ltd. aims to explore AI computing power collaboration, industrial manufacturing, and decision-making AI vertical model development and application [3][7]. Group 1: Agreement Overview - The agreement is a framework agreement and does not involve specific transaction amounts or constitute a major asset restructuring [3][12]. - The cooperation focuses on leveraging each party's strengths: SenseTime's AI algorithms, Lier's industry data resources, and Xiwang's advanced chip technology [8][9]. Group 2: Partner Introductions - SenseTime is a well-known AI software company listed on the Hong Kong Stock Exchange, with a registered capital of 1.625 billion RMB [4][6]. - Hangzhou Xiwang specializes in high-performance GPU development and has a registered capital of 20 million RMB [5][6]. Group 3: Cooperation Content - The parties will prioritize the development of AI applications in the refractory materials industry and related sectors, utilizing Lier's industry data and SenseTime's AI expertise [10][11]. - A joint effort will be made to promote Xiwang's AI chips in various fields, with a focus on established products [10][11]. Group 4: Impact on Company - The agreement is not expected to significantly impact the company's independence or current performance, as it is a strategic framework agreement [11][12]. - The cooperation aligns with the company's new development strategy and aims to expand its presence in the industrial manufacturing and decision-making AI sectors [11].

Core Viewpoint - Beijing Lier (002392.SZ) has signed a strategic cooperation agreement with SenseTime and Hangzhou Xiwang Chip Technology Co., Ltd. to explore AI computing power collaboration and the development of industrial manufacturing and decision-making AI vertical models [1] Group 1 - The three parties will jointly promote the sales of the AI chips developed by Hangzhou Xiwang and their application in various fields [1] - In stable market demand conditions, the parties will explore the establishment of a joint venture for computing power business, focusing on the already mass-produced S1, S2, and the upcoming S3 inference chips, supplemented by chips from other AI manufacturers [1] - The collaboration aims to help the company expand its business in the development and application of industrial manufacturing and decision-making AI vertical models [1] Group 2 - The company plans to leverage its strong customer relationships to actively promote the use of Hangzhou Xiwang's AI chips or jointly developed computing power leasing facilities in the AI data center business of relevant steel enterprises [1] - Several steel companies are currently entering the data center construction business, indicating a growing market for AI applications in this sector [1]