Group 1 - The core viewpoint of the article highlights the significant impact of the ongoing demand for AI GPUs and ASICs on the broader semiconductor supply chain, particularly leading to a shortage of key components used in smartphone SoCs [1] - Goldman Sachs has released a report indicating that the high demand for Ajinomoto Build-up Film (ABF) substrates has monopolized most of the current supply of T-glass, which is essential for manufacturing [1] - The report warns of a potential "double-digit percentage shortage" of T-glass supply for Bluetooth substrates in the coming months to quarters, raising concerns for the smartphone market as it prepares for a vibrant 2026 [1] Group 2 - Ajinomoto plans to invest at least 25 billion yen (approximately 166 million USD) by 2030 to increase its semiconductor material production capacity by 50%, aiming to strengthen its revenue base beyond its core food business [2] - The company holds over 95% market share in the data center and CPU sectors, producing ABF, an insulating material crucial for the latest GPUs and CPUs [2] - Ajinomoto's functional materials business, including ABF, is expected to account for 20% of its total operating profit for the fiscal year ending March 2024, with a projected 35% profit growth this year [3] Group 3 - The ABF film is essential for producing high-efficiency semiconductor products and has become a critical insulating material in the semiconductor packaging process [5] - Ajinomoto's ABF film has gained significant traction in the PC market, with major clients including Intel and AMD, and it dominates the global PC market share [5] - The ongoing demand for ABF is driven by rapid advancements in smartphones, personal computers, servers, and automotive technologies, leading to a supply-demand imbalance [6]