近日，半导体设备大厂DISCO公布的数据令人瞩目。2025财年第一财季（2025年4-6月），其 非合并出货金额预计高达930亿日元，同比增长8.5%，实现近6个季度以来的第五度增长，单 季出货金额更是超越2024年度第三季度的908亿日元，创下历史新高。 | | | | | | | PHILATIS AT (AU) | | | --- | --- | --- | --- | --- | --- | --- | --- | | | 1Q | 2Q | 1H | 3Q | 4Q | 2H | Full year | | Shipment Amount | 93.0 | | | | | | - | | YoY % Change | 8.5% | | | | | | | | QoQ % Change | 21.5% | | | | | | | | Reference: Fiscal Year 2024 | 85.7 | 84.6 | 170.4 | 90.8 | 76.6 | 167.4 | 337.8 | 如果您希望可以时常见面，欢迎标星收藏哦~ DISCO在公告中明确指出，精密加工设备出货增长，主要源于生成式A ...

公众号记得加星标⭐️，第一时间看推送不会错过。 近日，半导体设备大厂DISCO公布的数据令人瞩目。2025财年第一财季（2025年4-6月），其非合并出货金额预计高 达930亿日元，同比增长8.5%，实现近6个季度以来的第五度增长，单季出货金额更是超越2024年度第三季度的908亿 日元，创下历史新高。 | | | | | | | | (Billions of yen) | | --- | --- | --- | --- | --- | --- | --- | --- | | | 1Q | 2Q | 1H | 3Q | 4Q | 2H | Full year | | Shipment Amount | 93.0 | | | | | | | | YoY % Change | 8.5% | | | | | | | | QoQ % Change | 21.5% | | | | | | | | Reference: Fiscal Year 2024 | 85.7 | 84.6 | 170.4 | 90.8 | 76.6 | 167.4 | 337.8 | DISCO在公告中明确指出，精密加工设备出货增长，主要源于生成 ...

Core Insights - TC BioPharm announced that the first patient in Cohort B achieved complete molecular remission after receiving the second dose of TCB008, a gamma delta T cell therapy for cancer treatment [1][2][4] - The patient received a total of approximately 500 million gamma delta T cells over two weeks, with two out of a possible four infusions of TCB008 [2] - This milestone highlights the potential of TCB008 to serve as a foundational component in post-remission therapy for blood cancer patients, aiming to improve long-term outcomes and survival rates [4] Company Overview - TC BioPharm is a clinical-stage biopharmaceutical company focused on developing gamma-delta T cell therapies for cancer treatment, with a specific emphasis on acute myeloid leukemia [5][6] - The company is recognized as a leader in this field and is conducting pivotal clinical trials using its proprietary allogeneic CryoTC technology to provide frozen gamma-delta T cell products to clinics globally [6] Industry Context - Over 1 million patients are diagnosed with blood cancers globally each year, and many who achieve remission may still have a molecular burden of disease that can lead to relapse [3] - The ability of gamma delta T cells to differentiate between healthy and diseased tissue positions them as a promising therapeutic option in oncology [5]

Group 1: Core Insights - The semiconductor industry is transitioning into the "post-Moore era," leading to a shift in technological innovation towards advanced packaging technologies, which are crucial for the development of AI, HPC, and 5G [1][7] - The demand for advanced packaging technologies, such as CoWoS, is surging due to the rapid penetration of domestic AI chips in large model training and terminal applications [1][5] Group 2: Advanced Packaging Technology Overview - Advanced packaging technology plays a critical role in semiconductor manufacturing, providing electrical interconnection, mechanical support, and thermal management [2] - The evolution of packaging technology has seen significant changes from through-hole mounting to surface mount technology, and now to advanced packaging techniques like BGA, CSP, and 2.5D/3D packaging [3][4] Group 3: Market Demand and Applications - Advanced packaging is increasingly applied in high-end fields such as AI, HPC, and 5G, with its market share in the overall packaging and testing market continuously rising [5] - The need for advanced packaging is particularly high in AI chips due to the demands for high performance and efficiency, driven by large model training and inference [6] Group 4: Domestic Equipment Development - The domestic semiconductor industry is making significant strides in the development of advanced packaging equipment, driven by the increasing adoption of technologies like CoWoS [8] - Companies like Huazhuo Precision and Pulaixin Intelligent are leading the way in developing high-end equipment for HBM chip manufacturing and CoWoS technology, respectively [9][11] Group 5: Future Prospects - The advanced packaging market is expected to experience explosive growth as the challenges in advanced process technology increase [7] - The advancements in domestic equipment and technology are likely to enhance the competitiveness of the domestic semiconductor industry in the global market [8][10]

申请入围"中国IC独角兽" 半导体高质量发展创新成果征集 2024年，HBM成为半导体产业最炙手可热的产品之一。 随着AI大模型和高性能计算的狂飙突进，英伟达等巨头对HBM的需求水涨船高，内存厂的HBM订单早 已售卖一空，尤其是SK海力士，其在HBM市场占有率高达70%，更是赚得盆满钵满。 然而，就在这股浪潮背后，名为"TCB（Thermal Compression Bonding）键合机"的设备，正在悄然决定 HBM产业链的上限，不论是SK海力士，还是美光三星，都在过去一年时间里加大了设备方面的投入， 也让更多设备厂商有机会吃上这波AI红利。 什么是TCB？ 先来了解一下目前HBM芯片的键合技术。在传统的倒装芯片键合中，芯片被"翻转"，以便其焊料凸块 （也称为 C4 凸块）与半导体基板上的接合焊盘对齐。整个组件被放置在回流炉中，并根据焊料材料均 匀加热至 200ºC-250ºC 左右。焊料凸块熔化，在接合和基板之间形成电气互连。 随着互连密度的增加和间距缩小到 50µm 以下，倒装芯片工艺面临一些挑战。由于整个芯片封装都放入 烤箱中，芯片和基板会因热量而以不同的速率膨胀（即不同的热膨胀系数，CTE），从而产 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 2024年，HBM成为半导体产业最炙⼿可热的产品之⼀。 随着AI⼤模型和⾼性能计算的狂飙突进，英伟达等巨头对HBM的需求⽔涨船⾼，内存⼚的HBM订 单早已售卖⼀空，尤其是SK海⼒⼠，其在HBM市场占有率⾼达70%，更是赚得盆满钵满。 然⽽，就在这股浪潮背后，名为"TCB（Thermal Compression Bonding）键合机"的设备， 正在悄然决定HBM产业链的上限，不论是SK海⼒⼠，还是美光三星，都在过去⼀年时间⾥加⼤了 设备⽅⾯的投⼊，也让更多设备⼚商有机会吃上这波AI红利。 什么是TCB？ 先来了解⼀下⽬前HBM芯⽚的键合技术。在传统的倒装芯⽚键合中，芯⽚被"翻转"，以便其焊 料凸块（也称为 C 凸块）与半导体基板上的接合焊盘对⻬。整个组件被放置在回流炉中，并根据 焊料材料均匀加热⾄ ºC-ºC 左右。焊料凸块熔化，在接合和基板之间形成电⽓互连。 随着互连密度的增加和间距缩⼩到 µm 以下，倒装芯⽚⼯艺⾯临⼀些挑战。由于整个芯⽚封装 都放⼊烤箱中，芯⽚和基板会因热量⽽以不同的速率膨胀（即不同的热膨胀系数，CTE），从⽽产 ⽣变形，导致互连出现故障。然后， ...

Core Viewpoint - The company aims to improve its customer structure and product categories in the consumer electronics sector, focusing on the development of key products to enhance profitability in its power supply business [1]. Group 1: Business Performance - In the saw cutting sector, the company maintained stable revenue of 669 million, with a gross margin of 43.41%, indicating good profitability [2]. - The subsidiary, Meite Sen, achieved revenue of 103 million, reflecting a year-on-year growth of 11.45% [2]. - The company has strengthened its integrated cooperation model with manufacturers, fostering a positive industrial ecosystem [2]. Group 2: Product Development - The company successfully developed a toothless product, TCB-EMP, and achieved revenue of 413 million from mid-to-high-end saw cutting products, with hard alloy band saws and wide band saws growing by 2.42% and 2.12% respectively [3]. - The company has established sales partnerships with over 50 countries and regions, leveraging product quality and production capacity to expand its international market presence [3]. Group 3: Power Supply Business - The power supply business experienced a revenue decline due to increased competition and capacity ramp-up, but the AI terminal trend is expected to drive demand [4]. - The company reported a revenue of 176 million from its high-power power supply business, marking a year-on-year growth of 30% [4]. - The company has made significant shipments in smart photovoltaic and energy storage products, positioning itself to capitalize on opportunities in data center power and charging station sectors [4]. Group 4: Future Growth Potential - The company has obtained IATF16949 automotive certification, indicating that automotive power supplies could become a new growth point [5]. - The company is expanding its workforce in the high-power power supply sector and accelerating the development of key products such as 40KW air-cooled charging modules and 4000W power modules [5].

ASMPT20250513 摘要 • ASMPT 业务主要包括半导体解决方案和 SMT 解决方案，前者毛利率为 40%-45%，后者约为 30%。半导体解决方案涵盖后工序工具如 die bond、wire bond、TCB 等，以及 Mini/Micro LED 相关工具，并提供激 光切割和铜电镀沉积等中端工具。 • 关税对 ASMPT 的直接影响有限，但间接影响需关注，客户投资决策受关 税不确定性影响。公司通过全球生产基地（包括中国、新加坡、马来西亚 等）的灵活发货应对关税问题。中美关系缓和可能影响未来关税政策。 • 美国市场占 ASMPT 收入的 16%，贡献相对较小。TSMC 在亚利桑那州建 厂对美国市场有积极影响。公司可灵活调整生产基地应对关税，但需关注 客户投资意愿和新工厂投放等间接影响。 • ASMPT 的 TTEC 设备在存储和逻辑市场取得进展，已获得领先 XPM 客户 大订单并交付，与韩国客户建立合作，并与美国 CPU 公司及领先 foundry 在 TCB 领域合作，正逐步实现量产。 • Hybrid bonding 技术尚未大规模应用，成本高于 TCB，预计未来两三年 内 TCB 仍具优势 ...

Core Insights - Kytopen Corp. and Bio-Techne Corporation have announced a partnership to enhance gene delivery solutions for advanced cell therapies, focusing on the integration of their respective technologies [1][5] - The collaboration aims to streamline workflows for genome engineering of immune cell therapies, expediting their clinical advancement and manufacturing [1][5] Company Overview - Kytopen is a leader in non-viral, continuous flow cellular engineering technologies, headquartered in Cambridge, Massachusetts, and is known for maximizing yields and delivering hundreds of billions of engineered cells rapidly [6] - Bio-Techne is a global life sciences company that provides innovative tools and bioactive reagents for research and clinical diagnostics, generating approximately $1.2 billion in net sales in fiscal 2024 [7] Technology Highlights - The TcBuster™ system allows for the simultaneous delivery of multiple genes with high editing efficiency, offering advantages over traditional lentivirus-based methods [2][5] - Flowfect® technology combines mechanical, electrical, and chemical forces to enhance transfection efficiency and cell health, enabling the processing of billions of cells in minutes [2][5] Collaboration Details - The partnership will leverage the TcBuster™ GMP non-viral genome engineering system and the Flowfect Tx™ GMP cellular engineering platform to create a non-viral gene-editing workflow suitable for various immune cell types [1][3] - Data from the collaboration will be presented at the International Society of Cell & Gene Therapy (ISCT) Annual Meeting, showcasing the advancements made through this partnership [3][5]