Core Viewpoint - The article emphasizes the significance of TGV (Through Glass Via) technology in enhancing chip performance and its growing adoption in the semiconductor industry, driven by the demand for miniaturized electronic devices and advanced packaging solutions [2][3]. Group 1: TGV Technology Overview - TGV technology is crucial for improving interconnect density and signal integrity in high-speed circuits, enabling smaller and more powerful devices [2][3]. - The integration of TGV can simplify manufacturing processes by eliminating the need for separate interconnect layers, despite facing challenges such as material brittleness and processing defects [3][6]. Group 2: Market Growth and Applications - The demand for TGV substrates is expected to surge, particularly in IoT applications, with an estimated 50% of new IoT devices anticipated to incorporate TGV technology to enhance performance and reduce size [3]. - In high-performance computing, TGV glass substrates can boost chip performance by up to 40% while significantly reducing energy consumption [3]. Group 3: Industry Developments and Innovations - Recent advancements include significant investments in TGV technology, with companies like Chengdu Maike Technology securing hundreds of millions in funding to enhance TGV process development and production capabilities [7]. - Various projects and collaborations are underway, such as the establishment of a TGV manufacturing base in Jiangsu and the development of advanced TGV equipment by companies like Dazhu Semiconductor and Dongxu Group [7][8]. Group 4: Challenges and Considerations - TGV technology faces challenges related to material brittleness, processing defects, and cost control, which may hinder its widespread adoption [6]. - The need for reliable filling materials and thermal expansion coefficient matching is critical to ensure the structural integrity and performance of TGV substrates [6]. Group 5: Upcoming Events and Collaborations - TrendBank is organizing the 2025 Heterogeneous Integration Annual Conference in Ningbo from November 17-19, focusing on advanced packaging technologies, including TGV and FOPLP [9]. - The conference aims to foster collaboration between industry and academia, promoting technological innovation and application in the semiconductor field [9].