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江波龙(301308) - 2025年12月23日-26日投资者关系活动记录表
2025-12-30 11:18
Group 1: Market Trends and Demand - The continuous rise in storage prices is driven by sustained demand for high-performance TLC eSSD and QLC eSSD from cloud service providers, influenced by AI technology applications and HDD supply shortages [3] - Major manufacturers are maintaining a cautious capacity expansion strategy, which may limit the incremental contribution to output growth in 2026 due to the lag in capacity construction cycles [3] Group 2: Inventory Management - The company's inventory strategy is based on demand forecasting, market trends, storage wafer prices, and customer orders, allowing for timely procurement [3] - Long-term supply agreements (LTA) and memorandums of understanding (MOU) with storage wafer manufacturers ensure stable supply [3] Group 3: Product Innovations - The new mSSD product features a wafer-level system-in-package (SiP) design, integrating multiple components into a single package, which reduces costs and simplifies manufacturing processes [3] - mSSD offers TB-level capacities and is designed for compactness and high performance, meeting PCIe interface standards [3] - The innovative mSSD includes a tool-free expansion card for enhanced compatibility with diverse storage applications [3] Group 4: Future Profitability and R&D Directions - The company is expected to enhance its profitability through breakthroughs in high-end storage, overseas business, and self-developed controllers [3][4] - Future R&D will focus on chip architecture design and firmware development for UFS, eMMC, SD cards, and PCIe SSDs, adopting a fabless model to improve product competitiveness [4] Group 5: Disclosure Compliance - The investor relations activity did not involve any undisclosed significant information [4]
江波龙:存储供需格局改善叠加AI需求推动,NAND Flash需求迎来爆发
Core Viewpoint - The demand for NAND Flash is experiencing a surge due to the ongoing application of AI technology, which is driving cloud service providers to seek high-performance TLCeSSD and QLCeSSD, compounded by a shortage in HDD supply [1] Group 1: Demand Dynamics - The application of AI technology is continuously advancing, leading to increased demand for high-performance SSDs from cloud service providers [1] - The shortage of HDD supply is prompting cloud service providers to shift their orders to SSDs, further boosting NAND Flash demand [1] Group 2: Supply Chain Considerations - Major manufacturers are maintaining a cautious capacity expansion strategy due to past cycles, which may limit the contribution to bit output growth by 2026 despite a rebound in capital expenditures [1] - The lag in capacity construction cycles will restrict the incremental contribution to bit output growth in the coming years [1]
江波龙(301308) - 2025年12月15日-19日投资者关系活动记录表
2025-12-23 10:44
Group 1: Market Demand and Supply Dynamics - The demand for high-performance TLC eSSD and QLC eSSD is driven by the continuous application of AI technology in cloud services, coupled with a shortage of HDD supply, leading to a surge in NAND Flash demand [3] - Major manufacturers are maintaining a cautious capacity expansion strategy, which may limit the incremental contribution to output in 2026 due to the lag in capacity construction [3] Group 2: Supply Chain and Inventory Management - The company has established long-term direct cooperation with major global storage wafer manufacturers, ensuring a competitive advantage in the supply chain [3] - Long-term supply agreements (LTA) and memorandums of understanding (MOU) are in place to ensure a stable supply of storage wafers [3] Group 3: Profitability and Business Model - The production cycle from wafer procurement to memory sales means that rising wafer prices will positively impact the company's gross margin [3] - The company has made significant breakthroughs in high-end storage, overseas business, and self-developed main control chips, which will drive profitability growth [3] Group 4: TCM Model and Future Prospects - The TCM model, which integrates the entire supply chain from chip development to packaging, is gaining recognition from major Tier 1 customers [3] - The TCM model's customer acceptance is expected to increase during periods of rising storage prices, with ongoing acceleration in its implementation [4]