Core Viewpoint - The rapid development of data centers, advanced packaging, storage chips, AI chips, and artificial intelligence presents significant opportunities for the related materials industry [1] Group 1: Advanced Packaging - The company has established a comprehensive product matrix in the advanced packaging sector [1] - The Ultra Low Alpha Microball, with a minimum diameter of 50μm, addresses material bottlenecks for advanced packaging substrates [1] - The company has developed a product system for temporary bonding materials, primarily based on thermal and mechanical debonding, with laser debonding as a supplementary method [1] - The self-developed thick negative photoresist for semiconductor advanced packaging has completed validation and is being introduced to clients, compatible with 2.5D/3D advanced packaging processes [1] Group 2: Material Coverage - The existing MUF materials cover liquid packaging materials LMC and GMC particle packaging materials [1] - The company has also laid out products in semiconductor manufacturing and advanced packaging, including solder balls, epoxy encapsulants, photoresists, and wet process electronic chemicals such as developers, etchants, strippers, and plating solutions [1] Group 3: UV Curing Materials - After over twenty years of development, the company has gradually mastered several core technologies for UV curing coating materials [1] - The company has achieved advanced domestic technology in the synthesis of UV curing resin [1]

Group 1: Market Value Management - The company emphasizes strict compliance with laws and regulations regarding market value management to maximize shareholder interests and align market value with intrinsic value [1][2] - In December 2024, the company established a Market Value Management System to enhance management practices and protect investor rights [2] Group 2: Mergers and Acquisitions - The company signed a share transfer agreement to sell 100% of DaRui Technology for RMB 227.5 million, aimed at optimizing financial and asset structures [3] - A memorandum of understanding was signed with JNC Corporation to acquire 100% equity and related patents of two subsidiaries, enhancing market position in the LCD display industry [4] Group 3: Cash Dividends - The company has distributed cash dividends 10 times since its listing, totaling RMB 370 million, with a proposed dividend of RMB 0.65 per share for 2024 [5] Group 4: Investor Relations Management - The company actively engages with investors through various channels, including roadshows and online meetings, responding to 143 investor inquiries on the interactive platform [6] - Five investor relations activity records were disclosed from 2024 to Q1 2025 [6] Group 5: Crisis and Reputation Management - The company maintained a positive market image with no significant negative publicity or crisis events reported in 2024 and Q1 2025 [7] Group 6: Information Disclosure - The company adheres to legal and regulatory requirements for timely and fair disclosure of important information, ensuring clarity and accuracy [8] Group 7: Research and Development - In 2024, the company invested RMB 18.16 million in R&D, accounting for 6.23% of revenue, and holds 734 patents, including 708 invention patents [9][10] - The company developed a new generation of photoinitiators, TMO, to replace TPO, addressing industry challenges and supporting advanced packaging solutions [10]