格隆汇2月24日丨飞凯材料(300398.SZ)在互动平台表示，数据中心、先进封装、存储芯片、AI芯片及人 工智能高速发展，确实为相关材料产业带来了重要机遇。在先进封装领域，公司已形成较为完整的产品 矩阵：公司发布的Ultra Low Alpha Microball（超低阿尔法微球），最小直径低至50μm，助力解决先进 封装用基板的材料瓶颈；公司生产的临时键合材料也已形成以热解键与机械解键为主、激光解键为辅的 产品体系；公司自主研发的半导体先进封装用厚膜负性光刻胶已完成验证且正在向客户端导入，该产品 可良好适配2.5D/3D先进封装工艺；公司现有MUF材料覆盖液体封装材料LMC及GMC颗粒封装料；半 导体制造及先进封装领域还布局有锡球、环氧塑封料、光刻胶及湿制程电子化学品如显影液、蚀刻液、 剥离液、电镀液等。在紫外固化材料领域，公司经过二十余年的发展，逐步掌握了紫外固化涂覆材料产 品的多项核心技术，其中包括已掌握国内先进的紫外固化材料树脂合成技术。 ...

Industry Insights - TianShu ZhiXin, a leader in the domestic AI computing sector, announced three significant updates: a roadmap for its fourth-generation chip architecture aiming to surpass NVIDIA's Rubin architecture by 2027, the launch of the "Tongyang" series edge computing products outperforming NVIDIA's AGX Orin, and the first disclosure of large-scale implementation results and benchmark clients across multiple industries. This indicates a comprehensive acceleration in technology, product, and commercialization dimensions for domestic self-developed GPUs [3] - The satellite communication industry chain has become a recent market focus as global low-orbit satellite networks enter a phase of intensive construction. Data from Wind shows that the satellite communication sector index has risen approximately 40% over the past two months, with several satellite communication-related chip companies experiencing significant gains. Market participants believe that as the large-scale launch of satellite internet approaches, chips, as core components, are likely to be the first to benefit from the surge in demand [3] Company Developments - Feikai Materials stated on January 26 that it is closely monitoring advanced packaging technology trends, including HBF. The company has stable mass production of functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants applicable to HBF manufacturing processes. The development of temporary bonding materials and LMC liquid packaging materials is currently in the verification phase, with no large-scale revenue yet. The company is collaborating with relevant manufacturers to enhance the maturity and reliability of HBF process technology [4] - Jefferies noted that the surge in artificial intelligence spending has entered a new phase, with pricing power shifting from chip designers or cloud platforms to memory manufacturers. The market widely anticipates that the "super cycle" in memory driven by the AI boom will continue. According to Counterpoint's analysis, memory prices are expected to rise by 50% in the first quarter of 2026 [4] Related ETFs - The Sci-Tech Semiconductor ETF (588170) and its linked funds track the Shanghai Stock Exchange Sci-Tech Board semiconductor materials and equipment theme index, encompassing semiconductor equipment (60%) and semiconductor materials (25%) within the hard technology sector. The semiconductor equipment and materials industry is a crucial area for domestic substitution, characterized by low domestic replacement rates and high ceilings for domestic substitution, benefiting from the semiconductor demand driven by the AI revolution, expansion, and technological restructuring and mergers [5] - The Huaxia Semiconductor Equipment ETF (562590) and its linked funds focus on semiconductor equipment (63%) and semiconductor materials (24%), emphasizing the upstream semiconductor sector [5]

Core Viewpoint - The company is actively monitoring and engaging with advanced packaging technology trends, particularly HBF, and is developing materials that can be applied in HBF manufacturing processes [1] Group 1: Company Developments - The company has stable mass production capabilities for functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants, which are applicable in HBF manufacturing processes [1] - The company is currently in the verification and introduction phase for temporary bonding materials, LMC liquid encapsulation materials, and GMC particle encapsulation materials that are compatible with HBF process conditions [1] - The company is collaborating closely with relevant manufacturers to develop and test related materials, aiming to enhance the maturity and reliability of the HBF process [1] Group 2: Future Outlook - The company plans to leverage its existing collaboration foundation to continuously iterate and innovate its material technologies [1] - The goal is to establish a solid technical advantage and enhance market influence in advanced packaging fields such as HBF [1]

Core Viewpoint - Feikai Materials (300398) is actively involved in the semiconductor advanced packaging sector, focusing on the production of functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants, which are applicable in HBF and HBM manufacturing processes [1] Group 1: Product Development - The company has achieved stable mass production of functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants for HBF and HBM manufacturing processes [1] - The packaging processes for HBF and HBM involve wafer thinning, stacking, and encapsulation, for which the company has developed temporary bonding materials, LMC liquid encapsulation materials, and GMC particle encapsulation materials [1] - Currently, these materials are in the verification and introduction stage and have not yet generated scaled revenue [1] Group 2: Collaboration and Innovation - The company is closely collaborating with relevant manufacturers to develop and test related materials, aiming to enhance the maturity and reliability of HBF and HBM process technologies [1] - Future efforts will continue to focus on customer cutting-edge demands, driving the iteration and innovation of material technologies [1]

Core Viewpoint - The company is actively monitoring and engaging with advanced packaging technology trends, including HBF, and is developing materials suitable for HBF manufacturing processes [1] Group 1: Company Developments - The company has stable mass production capabilities for functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants applicable to HBF manufacturing processes [1] - The HBF packaging process involves wafer thinning, stacking, and encapsulation, for which the company has developed temporary bonding materials, LMC liquid encapsulation materials, and GMC particle encapsulation materials [1] - Currently, these materials are in the verification and introduction stage and have not yet generated significant revenue [1] Group 2: Collaboration and Future Prospects - The company is closely collaborating with relevant manufacturers to develop and test related materials [1] - The goal of this collaboration is to enhance the maturity and reliability of the HBF process technology [1]

Core Insights - The Chinese semiconductor industry is experiencing a significant transformation, moving from reliance on foreign technology to developing a robust domestic ecosystem that includes breakthroughs in materials, hardware, and software [1][2][8]. Industry Developments - The recent "Bay Chip Exhibition" showcased the advancements in China's semiconductor ecosystem, highlighting companies like Wanliyan, Fangzheng Microelectronics, and research institutions that are making strides across the entire supply chain [1][3]. - Wanliyan's new ultra-high-speed real-time oscilloscope, which surpasses 90GHz bandwidth, represents a significant leap in domestic technology, breaking the foreign monopoly on high-end oscilloscopes [4][1]. - Jiangfeng Electronics has successfully produced domestically manufactured high-purity tantalum targets, achieving the highest global shipment volume and reducing reliance on foreign suppliers [3][1]. Hardware and Software Innovations - The domestic semiconductor industry is addressing hardware gaps, with companies like Fangzheng Microelectronics achieving the highest production capacity for SiC automotive chips in China [7][1]. - EDA software, traditionally dominated by foreign firms, is being developed domestically, with companies like Qiyunfang releasing proprietary software that enhances performance and reduces development cycles [5][1]. Collaborative Ecosystem - The collaboration between companies and research institutions is crucial for overcoming challenges in the semiconductor industry, with platforms like Shenzhen Pinghu Laboratory facilitating the validation and introduction of domestic equipment [8][9]. - The Shenzhen Advanced Electronic Materials International Innovation Research Institute is focusing on developing key materials for advanced packaging, filling gaps in the domestic high-end electronic materials market [10][11]. Global Engagement - Foreign semiconductor giants are increasingly investing in China, with companies like NXP and GlobalFoundries planning to localize production and collaborate with Chinese firms [12][13]. - The overall scale of China's integrated circuit industry is projected to reach approximately 1.43 trillion yuan in 2024, reflecting a growth rate of 16.7% [12][1].

Group 1 - The private equity firm Licheng Asset recently conducted research on two listed companies, Feikai Materials and Huate Gas, indicating a focus on growth opportunities in the semiconductor and advanced manufacturing sectors [1][2] - Feikai Materials expects significant revenue growth in 2025 due to strong sales of TMO products, improved gross margins from lower raw material prices, and effective cost control leading to increased net profits [1] - The company has made technological breakthroughs in thick film negative photoresists for advanced packaging and is expanding its EMC materials into advanced packaging, IGBT, and third-generation semiconductor markets [1] Group 2 - Huate Gas has positioned itself in the supply chain of major domestic manufacturers of silicon carbide (SiC) and gallium nitride (GaN) semiconductors, indicating strong demand for its products in the third-generation power device sector [2] - Licheng Asset has a long-standing investment philosophy focused on growth stocks with a margin of safety, managing over 10 billion yuan and specializing in sectors such as pharmaceuticals, advanced manufacturing, and consumer goods [2]

Core Viewpoint - The company has made significant advancements in the field of advanced packaging materials, focusing on functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants [1] Group 1: Product Development - The company has achieved a major technological breakthrough with its self-developed thick film negative photoresist for semiconductor advanced packaging, which is well-suited for 2.5D/3D advanced packaging processes and exhibits excellent performance such as high resolution [1] - The company has established a product system for temporary bonding materials, primarily based on thermal and mechanical debonding, supplemented by laser debonding [1] Group 2: Sales and Market Strategy - Current products have achieved small-scale sales, and the company plans to gradually increase production volume based on customer validation progress [1] - The company aims to continuously expand its advanced packaging-related business, enhance product research and development, and upgrade technology to meet customer needs through customized development [1]

Financial Performance - The company achieved a revenue of approximately 1.462 billion RMB in the first half of 2025, representing a year-on-year growth of 3.80% [2] - Net profit attributable to shareholders was about 217 million RMB, an increase of 80.45% compared to the same period last year [3] - The net profit excluding non-recurring gains and losses was approximately 176 million RMB, reflecting a growth of 40.47% year-on-year [3] Business Segments Performance - Semiconductor materials revenue grew by 1.14% year-on-year; excluding the impact of the divestiture of a subsidiary, the actual growth was about 11% [3] - Screen display materials revenue increased by 4.56% year-on-year, with liquid crystal business remaining stable and OLED protective films generating approximately 10 million RMB in revenue [3] - UV curing materials revenue rose by 6.89% year-on-year, with significant growth in optical fiber coatings [3] - Organic synthesis materials segment saw an overall revenue growth of approximately 9.90% year-on-year [3] Strategic Acquisitions - The company completed the acquisition of JNC Corporation's subsidiaries, contributing to revenue growth by including their income in the consolidated financial statements [2] Future Outlook - The company aims to deepen its focus on niche markets within the materials industry and enhance collaboration with industry partners for sustainable growth [4] - The semiconductor sector is expected to benefit from ongoing demand driven by artificial intelligence and consumer electronics [17] Cost Management and Profitability - The net profit excluding non-recurring items increased by 27.68% quarter-on-quarter, attributed to lower raw material prices and effective cost control measures [5][6] - The impact of recent price increases in photoinitiators on gross margins is expected to be minimal due to effective supply chain management [7] Product Development and Market Expansion - The company is actively pursuing new product registrations for TMO products in multiple regions, with strong sales performance anticipated for the year [8] - In advanced packaging, the company has made significant progress in developing key materials and plans to expand its product offerings [9][10] - The company is also working on automotive exterior coatings, with ongoing testing and certification processes [12] Market Dynamics - The global liquid crystal market has an annual demand of approximately 900 tons, with small and medium-sized liquid crystal demand accounting for about 200 tons, offering higher value and profitability [11] - The company is strategically positioning itself to capture market share in the high-value small-sized liquid crystal segment following the acquisition of JNC's liquid crystal business [11]

点击 最 下方 "在看"和" "并分享，"关注"材料汇 互动问题： 添加 小编微信 ，遇见 志同道合 的你 问题1：目前有哪些先进封装材料迫切需要国产化呢？国产化的难点是在哪里呢？ 问题2：如果你是创业者或者从业者，你会选择什么样的封装材料赛道？你认为最关键的点在哪里？你将如何进行布局？ 问题3：如果你是投资者，面对先进封装材料的项目，你最看重哪几个点呢？ | 相关标的汇总 | | | | | | --- | --- | --- | --- | --- | | 公司 | 市值 /亿元 | 材料 | 讲属 | 2024H1半导体材料营收 /Q | | 鼎龙股份 | 279 | CMP材料、临时键合材料、PSPI | CMP材料、封装光刻胶、临时键合胶等多款材料能在国内丰流晶 圆厂客户端应用 | 6.3 | | 安集科技 | 223 | 湿电子化学品、电镀材料、CMP材料 | 先进封装用电镀液及添加剂已有多款产品实现量产销售 | 7.9 | | 上海新阳 | 114 | 电镀材料、湿电子化学品、光刻胶 | 已有电镀系列产品应用于先进封装及相应客户 | 4 4 | | 飞凯材料 | 101 | 临时键合材料、电镀材 ...