Core Insights - The Chinese semiconductor industry is experiencing a significant transformation, moving from reliance on foreign technology to developing a robust domestic ecosystem that includes breakthroughs in materials, hardware, and software [1][2][8]. Industry Developments - The recent "Bay Chip Exhibition" showcased the advancements in China's semiconductor ecosystem, highlighting companies like Wanliyan, Fangzheng Microelectronics, and research institutions that are making strides across the entire supply chain [1][3]. - Wanliyan's new ultra-high-speed real-time oscilloscope, which surpasses 90GHz bandwidth, represents a significant leap in domestic technology, breaking the foreign monopoly on high-end oscilloscopes [4][1]. - Jiangfeng Electronics has successfully produced domestically manufactured high-purity tantalum targets, achieving the highest global shipment volume and reducing reliance on foreign suppliers [3][1]. Hardware and Software Innovations - The domestic semiconductor industry is addressing hardware gaps, with companies like Fangzheng Microelectronics achieving the highest production capacity for SiC automotive chips in China [7][1]. - EDA software, traditionally dominated by foreign firms, is being developed domestically, with companies like Qiyunfang releasing proprietary software that enhances performance and reduces development cycles [5][1]. Collaborative Ecosystem - The collaboration between companies and research institutions is crucial for overcoming challenges in the semiconductor industry, with platforms like Shenzhen Pinghu Laboratory facilitating the validation and introduction of domestic equipment [8][9]. - The Shenzhen Advanced Electronic Materials International Innovation Research Institute is focusing on developing key materials for advanced packaging, filling gaps in the domestic high-end electronic materials market [10][11]. Global Engagement - Foreign semiconductor giants are increasingly investing in China, with companies like NXP and GlobalFoundries planning to localize production and collaborate with Chinese firms [12][13]. - The overall scale of China's integrated circuit industry is projected to reach approximately 1.43 trillion yuan in 2024, reflecting a growth rate of 16.7% [12][1].

Group 1 - The private equity firm Licheng Asset recently conducted research on two listed companies, Feikai Materials and Huate Gas, indicating a focus on growth opportunities in the semiconductor and advanced manufacturing sectors [1][2] - Feikai Materials expects significant revenue growth in 2025 due to strong sales of TMO products, improved gross margins from lower raw material prices, and effective cost control leading to increased net profits [1] - The company has made technological breakthroughs in thick film negative photoresists for advanced packaging and is expanding its EMC materials into advanced packaging, IGBT, and third-generation semiconductor markets [1] Group 2 - Huate Gas has positioned itself in the supply chain of major domestic manufacturers of silicon carbide (SiC) and gallium nitride (GaN) semiconductors, indicating strong demand for its products in the third-generation power device sector [2] - Licheng Asset has a long-standing investment philosophy focused on growth stocks with a margin of safety, managing over 10 billion yuan and specializing in sectors such as pharmaceuticals, advanced manufacturing, and consumer goods [2]

Core Viewpoint - The company has made significant advancements in the field of advanced packaging materials, focusing on functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants [1] Group 1: Product Development - The company has achieved a major technological breakthrough with its self-developed thick film negative photoresist for semiconductor advanced packaging, which is well-suited for 2.5D/3D advanced packaging processes and exhibits excellent performance such as high resolution [1] - The company has established a product system for temporary bonding materials, primarily based on thermal and mechanical debonding, supplemented by laser debonding [1] Group 2: Sales and Market Strategy - Current products have achieved small-scale sales, and the company plans to gradually increase production volume based on customer validation progress [1] - The company aims to continuously expand its advanced packaging-related business, enhance product research and development, and upgrade technology to meet customer needs through customized development [1]

Financial Performance - The company achieved a revenue of approximately 1.462 billion RMB in the first half of 2025, representing a year-on-year growth of 3.80% [2] - Net profit attributable to shareholders was about 217 million RMB, an increase of 80.45% compared to the same period last year [3] - The net profit excluding non-recurring gains and losses was approximately 176 million RMB, reflecting a growth of 40.47% year-on-year [3] Business Segments Performance - Semiconductor materials revenue grew by 1.14% year-on-year; excluding the impact of the divestiture of a subsidiary, the actual growth was about 11% [3] - Screen display materials revenue increased by 4.56% year-on-year, with liquid crystal business remaining stable and OLED protective films generating approximately 10 million RMB in revenue [3] - UV curing materials revenue rose by 6.89% year-on-year, with significant growth in optical fiber coatings [3] - Organic synthesis materials segment saw an overall revenue growth of approximately 9.90% year-on-year [3] Strategic Acquisitions - The company completed the acquisition of JNC Corporation's subsidiaries, contributing to revenue growth by including their income in the consolidated financial statements [2] Future Outlook - The company aims to deepen its focus on niche markets within the materials industry and enhance collaboration with industry partners for sustainable growth [4] - The semiconductor sector is expected to benefit from ongoing demand driven by artificial intelligence and consumer electronics [17] Cost Management and Profitability - The net profit excluding non-recurring items increased by 27.68% quarter-on-quarter, attributed to lower raw material prices and effective cost control measures [5][6] - The impact of recent price increases in photoinitiators on gross margins is expected to be minimal due to effective supply chain management [7] Product Development and Market Expansion - The company is actively pursuing new product registrations for TMO products in multiple regions, with strong sales performance anticipated for the year [8] - In advanced packaging, the company has made significant progress in developing key materials and plans to expand its product offerings [9][10] - The company is also working on automotive exterior coatings, with ongoing testing and certification processes [12] Market Dynamics - The global liquid crystal market has an annual demand of approximately 900 tons, with small and medium-sized liquid crystal demand accounting for about 200 tons, offering higher value and profitability [11] - The company is strategically positioning itself to capture market share in the high-value small-sized liquid crystal segment following the acquisition of JNC's liquid crystal business [11]

点击 最 下方 "在看"和" "并分享，"关注"材料汇 互动问题： 添加 小编微信 ，遇见 志同道合 的你 问题1：目前有哪些先进封装材料迫切需要国产化呢？国产化的难点是在哪里呢？ 问题2：如果你是创业者或者从业者，你会选择什么样的封装材料赛道？你认为最关键的点在哪里？你将如何进行布局？ 问题3：如果你是投资者，面对先进封装材料的项目，你最看重哪几个点呢？ | 相关标的汇总 | | | | | | --- | --- | --- | --- | --- | | 公司 | 市值 /亿元 | 材料 | 讲属 | 2024H1半导体材料营收 /Q | | 鼎龙股份 | 279 | CMP材料、临时键合材料、PSPI | CMP材料、封装光刻胶、临时键合胶等多款材料能在国内丰流晶 圆厂客户端应用 | 6.3 | | 安集科技 | 223 | 湿电子化学品、电镀材料、CMP材料 | 先进封装用电镀液及添加剂已有多款产品实现量产销售 | 7.9 | | 上海新阳 | 114 | 电镀材料、湿电子化学品、光刻胶 | 已有电镀系列产品应用于先进封装及相应客户 | 4 4 | | 飞凯材料 | 101 | 临时键合材料、电镀材 ...