Group 1 - The core viewpoint of the article highlights that Shengmei Shanghai has launched multiple devices compatible with HBM (High Bandwidth Memory) technology, indicating a strong focus on advanced packaging technology [2] - The UltraECP3d device is specifically mentioned as suitable for TSV (Through-Silicon Via) copper filling, showcasing the company's commitment to innovation in this area [2] - The company emphasizes its strategy of product platformization, continuously enhancing product technology levels and performance to meet diverse customer needs [2] Group 2 - Shengmei Shanghai is actively pursuing market opportunities presented by the rapid development of HBM technology, aiming for sustained high-speed growth [2] - The company has a comprehensive range of equipment, including wet cleaning and copper plating devices, applicable to HBM processes and advanced packaging for high-performance chips [2] - The focus on cutting-edge market demands and the development of advanced packaging technologies positions the company favorably for future growth [2]

Group 1 - The core viewpoint of the article is that Shengmei Shanghai has launched multiple devices compatible with HBM (High Bandwidth Memory) technology, indicating a focus on advanced packaging solutions for high-performance chips [2] - Shengmei Shanghai's UltraECP3d device is specifically designed for TSV (Through-Silicon Via) copper filling, showcasing the company's commitment to innovative manufacturing processes [2] - The company offers a full line of wet cleaning and copper plating equipment that can be utilized in HBM processes, as well as packaging equipment suitable for high-performance 2.5D chip packaging [2] Group 2 - The company emphasizes its adherence to information disclosure regulations, stating that it will promptly disclose relevant business information and order status if they meet the disclosure standards [2]