国家智能手机补贴计划落地受阻，但预计将持续至2025年下半年 中国中央政府推出了约人民币3000亿元（约414亿美元）的补贴计划，旨在刺激消费电子产品购买，包括价格在6000元（约828美元）以下的智能手机。 第一轮资金大幅推动了Q1销量增长，但也暴露出实施中的一系列难题。 补贴流程复杂，使得中小厂商望而却步，而资源充足的大型零售渠道则更易执行，因此华为与小米在该政策中受益最多。 尽管执行端面临挑战，且近期补贴发放节奏放缓，但预计该项目将持续至2025年全年，甚至可能延续至2026年（基于供应链渠道调研）。不过，随着中 国智能手机市场的成熟，此类大规模激励政策的边际效应正在逐渐减弱。 苹果凭借大幅降价主导618大促 以下文章来源于Counterpoint 咨询 ，作者Archie Zhang Counterpoint 咨询 . Counterpoint Research 是一家专注于科技行业的全球性研究公司，在全球主要的市场有着强大的影响力。我们致力于为合作伙伴提供准确、及时的市场数 据，帮助他们做出明智的决策。 2025年上半年，中国智能手机市场出货量预计同比增长1.4%，在全球市场整体不确定性加剧的背景下 ...

Core Insights - The marketing landscape in the first week of summer 2025 showcases a diverse and dynamic approach, with brands like Meituan, Lululemon, Xianyu, and Proya engaging users through empathetic and relatable strategies [2][5][6][12][15] Group 1: Innovative Marketing Strategies - Meituan's new advertisement creatively uses "small lobsters as tools," effectively compressing and communicating the core value of the product as "sufficient, full, and cost-effective" through humor and metaphor [5] - Xianyu's appointment of Liu Yuning as its first brand ambassador emphasizes a "immersive identity binding," where the celebrity actively engages with the community rather than merely serving as a symbolic face [8][10] - Lululemon's "Summer Fun Challenge" promotes participation over performance, encouraging users to find their own movement style rather than adhering to traditional fitness standards [10][11] Group 2: Emotional Connection and Brand Identity - Proya's collaboration with actress Kwang Lingling focuses on the theme of "the secret of youth," redefining anti-aging and self-worth through storytelling and emotional resonance rather than just product promotion [14] - The overarching trend in marketing is shifting towards rebuilding relationships, where emotional engagement, rhythm, and participation are prioritized over mere technical execution or budget allocation [15][16] - Brands are increasingly striving to become entities that users want to connect with, share, and remember, reflecting a collective identity rather than a singular brand image [18]

在智能手机行业陷入创新同质化的当下，华为Pura 80系列正以"移动影像引领者"的姿态撕开市场裂 口。 6 月 11 日，在华为 Pura 80 系列及全场景新品发布会上，华为正式带来了上半年旗舰产品华为 Pura 8 0 系列，起售 价 6499 元（华为 Pura 80 Pro ）。 过去十多年， P 系列成为华为登顶全球高端市场的核心引擎。从 P9 的徕卡联名奠定影像标杆，到 P20 Pro 的"夜视仪"震撼行业，再到 P30 Pro 潜望长焦改写规则， P 系列以影像为矛，硬生生在 国外品牌垄断多年的高端手机市场撕开口子，将华为送上全球高端三强宝座。 2024 年，华为 P 系 列重磅升级为 Pura 系列，影像体验全面升级。 从此次发布看，华为 Pura 80 系列的登场正在触发一系列连锁反应——不仅是华为技术突围的具象 化呈现，更可能成为搅动高端市场格局的"鲇鱼"。 重构高端市场产品坐标系 这种定位调整暗藏精妙的战略部署，在华为的高端产品矩阵中， Mate 系列负责技术参数的全面碾 压， Pura 系列则专攻影像美学的情感共鸣。就像徕卡之于相机行业，华为 Pura 80 系列 正在尝试 建立移动影 ...

Core Viewpoint - Xiaomi is positioning itself as a strong competitor to Apple's iPhone by launching the new Xiaomi 15S Pro, which features an advanced chip and a lower price point compared to Apple's latest models [1][2]. Pricing Strategy - The Xiaomi 15S Pro starts at 5,499 yuan ($764), making it eligible for state-subsidized discounts, while the iPhone 16 Pro starts at 7,999 yuan and the iPhone Pro Max at 9,999 yuan, both above the 6,000 yuan threshold for discounts [2]. Technological Advancements - Xiaomi's CEO Lei Jun claims that the new Xring O1 chip outperforms Apple's A18 Pro in several technical aspects, including lower heat generation during gaming [3][4]. - The Xring O1 chip is in mass production, and Xiaomi plans to invest at least 50 billion yuan ($6.9 billion) over the next decade in its chip development [6]. Research and Development Investment - Xiaomi will allocate 200 billion yuan for research and development over the next five years, starting in 2026, and anticipates a 30% revenue growth this year [5]. Automotive Ventures - Xiaomi's first electric car, the SU7, was launched at a price $4,000 lower than Tesla's Model 3, and the company plans to release its first SUV, the YU7, in July [7][8]. - The company delivered over 28,000 vehicles in April, a slight decrease from the previous month, following a tragic accident involving one of its vehicles [9]. Financial Performance - Xiaomi is set to release its first-quarter results on May 27, after reporting record revenue and net profit for 2024 in March, with nearly 42% of total revenue coming from overseas markets [10].

Group 1 - The recent trade policy adjustments between the US and China have cast a shadow over India's ambition to become the "world's factory," as the US has significantly reduced tariffs on Chinese goods from 145% to 10%, while maintaining a 27% tariff on Indian goods [1] - Experts indicate that the shift in tariff policy may lead to a stagnation or reversal of manufacturing investments that were previously directed towards India, threatening the growth of high-value industries despite the low-cost assembly segment remaining viable [1][3] - Apple's recent decision to shift a significant portion of its iPhone production from China to India contrasts sharply with the current challenges faced by India's manufacturing sector, highlighting the complexities of global supply chains [1] Group 2 - A joint venture between Foxconn and India's HCL Group has received approval for a $435 million semiconductor factory, expected to begin production in 2027, focusing initially on chip packaging and testing [2] - Apple CEO Tim Cook has emphasized that deepening operations in India is a key strategy to navigate uncertainties in US-China trade relations, with data showing that 40% of India's exports to the US overlap with Chinese products, indicating potential for short-term substitution [2] - Despite the positive outlook, India's manufacturing sector faces structural weaknesses, with manufacturing contributing only 15% to GDP and a heavy reliance on imports for core components, particularly in high-end production like iPhones [3][4] Group 3 - The Indian government's Production-Linked Incentive (PLI) scheme has shown limited success, achieving only 37% of its target output by October 2024, with subsidies disbursed falling short of initial plans [4] - Recent trends indicate a reversal of some Apple supply chain activities back to China due to quality control issues and operational challenges in Indian factories, underscoring India's shortcomings in high-end manufacturing capabilities [4] - Experts suggest that while India aims to attract Chinese investments to bolster its manufacturing sector, this could potentially undermine local technological development, emphasizing the need for integration into global supply chains [4]

【环球网科技综合报道】5月6日消息，据外媒CNET报道，知情人士透露，苹果公司计划自2026年起调整 iPhone产品线发布策略，由当前"一年一更"的秋季集中发布模式，转向"高端旗舰先行、基础款错季补 位"的春秋交替模式。这一战略调整若落地，将重塑苹果高端化布局与折叠屏产品线的市场节奏，同时延 长基础款产品的生命周期。 消息称，自2026年起，苹果将优先在秋季发布价格定位更高的机型，其中Pro系列或成为唯一以"年度旗 舰"身份迭代的产品线。这一策略将强化Pro系列作为技术标杆的市场定位，通过率先搭载最新芯片、影 像模组及AI功能，巩固苹果在高端智能手机市场的利润护城河。 值得关注的是，苹果首款折叠屏iPhone的发布窗口期亦被纳入秋季档期的考量范围。若技术成熟度达 标，该机型或与Pro系列同期亮相，形成"双旗舰"组合拳，直接对标三星Galaxy Z Fold系列等竞品。行业 分析认为，折叠屏iPhone的入局将推动超高端市场扩容，而Pro系列的常规迭代则能维持技术连贯性，避 免折叠屏产品冲击现有高端用户群体。 与高端机型秋季"抢跑"形成对比，基础款iPhone的发布周期将大幅延后。消息指出，原计划于2026年 ...

GenAI的内存解决方案 第 1 部分：能力的变化 所需能力 GenAI 应用需要高速、高带宽且低延迟的内存，以便实时处理海量数据。在需要实时决策和 预测的推理环节，数据的快速访问就显得尤为关键。 GenAI内存解决方案第 2 部分：HBM的竞争态势 内存设计的挑战与解决方案以及内存技术的最新趋势正在塑造高性能计算的未来及其竞争 格局。 竞争态势 技术革新： 具有传统接口的动态随机存取存储器（DRAM）在带宽和延迟方 面 存在局限，因此像高带宽内存（HBM）这类利用硅通孔（TSV）堆叠 DRAM 的 技术，就成为满足这些性能需求的关键解决方案。与内存设计相关的挑战与应 对办法，以及内存技术的新兴趋势，正塑造着高性能计算的未来与竞争格局。 优化策略： 未来，像3D-IC和（或）CoWoS等封装技术的进步，将在智能手 机、PC 等不同领域得到应用。智能手机受空间和成本限制，人们会尝试多种办 法，在不增加成本与空间占用的前提下，降低延迟、减少能耗。 应变准备 ： 目前仍不清楚到 2030 年哪些类型的GenAI模型和应用会流行，以 及具体数量是多少。因此，支持架构层面的进步并构建生态系统，以便能够应 对任何变化，将 ...

Core Viewpoint - The company acknowledges its responsibility for previous issues related to misleading consumers during live broadcasts and has initiated comprehensive rectification measures to address these problems and improve operational management [1][11]. Summary by Sections Rectification Measures - A rectification task force has been established, led by board members, focusing on seven key areas including product selection, quality control, pricing, and after-sales service [1]. - The company has paid a total fine of 68.95 million yuan as per the administrative penalty decision [2]. - Compensation for affected products, specifically "Hong Kong Meicheng" mooncakes and "Fresh Du Yu" Australian beef rolls, has reached 277,785 yuan, with a commitment to follow a "refund and triple compensation" principle [3]. Quality Control Enhancements - The company has engaged three third-party quality control agencies and developed operational guidelines for seven categories of products, including food and cosmetics, to ensure strict quality management [4]. - Brand partnerships have been rigorously selected, reducing the number of cooperative brands by 80% to enhance the proportion of self-operated products [5]. Live Broadcast Management - The company has implemented multiple layers of review for live broadcast content, ensuring that promotional information aligns accurately with product details [5]. - A set of regulations for network anchors has been established, including a handling procedure for violations, to maintain compliance with industry standards [5]. After-Sales Service Improvements - A dedicated after-sales service account has been created to facilitate consumer claims, with a promise to advance compensation for recognized problematic products [6]. Commitment to Compliance - The company expresses gratitude for public scrutiny and commits to adhering to industry standards and fulfilling legal obligations to regain consumer trust [7].

半导体创新是改善我们生活的技术的核心所在。在半导体领域，各公司正采取灵活的策略，以获取 更高的投资资本回报率（ROIC）。此外，在芯片结构中，与供应链的合作变得比以往任何时候都更 加必要。我们还注意到，硬件也在发生变化，以适应 GenAI 应用场景以及用户界面的改变。 2025-2027 年，谁在推动什么？ 业务咨询 Rick Cui / 客户服务总监 电话: +86 13801127537 邮箱:rick@counterpointresearch.com 没有完美的解决方案 ：动态随机存取存储器（DRAM） 解决方案有其自身的优缺点。这些技术改善 了带宽、延迟、速度、容量和功耗/热量等特性，但也带来了成本和时效性方面的挑战。为了降低与 创新相关的风险，客户需要作出承诺，而制造商则需要减轻成本负担。 智能手机与 Apple ：短期内，最具创新性的解决方案是处理内存（PIM），但其数量有限，主要支 持神经处理单元（NPU）。移动高带宽内存（HBM）有望提升性能，但应用场景尚不明确。预计到 2026 年，Apple 将从封装堆叠（PoP）转向分立封装，在 iPhone Pro Max 和折叠手机中提高带宽。 此外 ...

半导体创新是改善我们生活的技术的核心所在。在半导体领域，各公司正采取灵活的策略，以获取 更高的投资资本回报率（ROIC）。此外，在芯片结构中，与供应链的合作变得比以往任何时候都更 加必要。我们还注意到，硬件也在发生变化，以适应 GenAI 应用场景以及用户界面的改变。 NVIDIA 与 SOCAMM： NVIDIA 提出的 DIGITS 技术旨在通过将 GPU 与 HBM 相结合，扩展内存 带宽，并通过 SOCAMM 提升 CPU 带宽，预计将在 2025 年中期实现，从而与板载 LPDDR 相比， 提供更大的容量扩展和更好的信号完整性。然而，由于 PCB 和连接器的成本负担，目前没有计划将 此技术应用于通用 PC。 点击阅读原文下载完整版 PDF 报告 业务咨询 Rick Cui / 客户服务总监 电话: +86 13801127537 邮箱:rick@counterpointresearch.com 媒体采访 2025-2027 年，谁在推动什么？ 没有完美的解决方案 ：动态随机存取存储器（DRAM） 解决方案有其自身的优缺点。这些技术改善 了带宽、延迟、速度、容量和功耗/热量等特性，但也带来了成本和时效 ...