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零跑汽车:Lafa5即刻开启盲订,将于今年四季度在国内正式发布
Ju Chao Zi Xun· 2025-09-08 09:31
从车身来看,Lafa5采用家族一贯的贯穿设计灯组,前舱盖设计了隆起线条,体现出动感气息。此外,该车会根据配置不同提供激光雷达的智驾方案和纯视 觉方案供选择。 据悉,Lafa5已于今日开幕的2025慕尼黑车展上首次亮相。 (校对/黄仁贵) 9月8日,零跑汽车发文称,Lafa5即刻开启盲订。Lafa5将于今年四季度在国内正式发布,明年全球市场陆续启动销售;Lafa5Ultra版本将于明年上半年在国 内交付。 文章图片信息显示,Lafa5车长为4430mm,车宽为1880mm,车高为1520mm,轴距为2735mm。同时,Lafa5有6种车身颜色可选。 ...
上汽通用五菱与华为深化“三智”合作,共研成果首搭宝骏华境S
Ju Chao Zi Xun· 2025-09-08 09:31
9月7日,上汽通用五菱旗下品牌宝骏汽车发文称,9月6日,上汽通用五菱汽车股份有限公司与华为技术有限公司在柳州举行宝骏"三 智"深化合作签约仪式,全面升级战略合作伙伴关系。 宝骏汽车表示,上汽通用五菱与华为自2018年起便开始合作,有共同的奋斗基因与多年默契。此次深化合作,双方将聚焦"三智"领域进 一步发挥各自优势,推动汽车产业的智能化、网联化发展,助力广西汽车产业培育新质生产力,共同构建开放、繁荣的智能汽车生态, 为用户提供更加安全、便捷、智慧的出行体验。 资料显示,2024年,宝骏汽车累计销量为43647辆,月均销量不足4000辆。今年8月,宝骏汽车整体销量5103辆,同比增长8.1%。 (校对/黄仁贵) 文章称,双方将在辅助驾驶、智能座舱、智能制造三方面深化合作,共研的技术成果将率先应用于宝骏汽车全新旗舰大六座SUV——宝 骏华境S。新车将全系标配华为乾崑智驾HUAWEI ADS4、鸿蒙座舱Harmony Space5、乾崑车云HUAWEI IVCS,并首批搭载华为舱内激 光视觉(Limera)。 ...
向日葵筹划重大资产重组 拟跨界进军半导体材料领域
Ju Chao Zi Xun· 2025-09-08 09:16
Group 1 - The company announced plans to acquire controlling stakes in Zhangzhou Xipu Material Technology Co., Ltd. and the remaining 40% equity of Zhejiang Beid Pharmaceutical Co., Ltd. through a combination of share issuance and cash payment, which is expected to constitute a major asset restructuring [1] - Since its transition to the pharmaceutical industry in 2019, the company has struggled to overcome operational difficulties, with a net profit of only 1.16 million yuan in the first half of 2024, a year-on-year decline of 36%, and a full-year net profit of approximately 7.8 million yuan in 2023, down 64% year-on-year [1] - The company is shifting its focus to the semiconductor materials sector, with Xipu Material aiming to become a primary supplier of electronic-grade materials, including hexafluorobutylene and trifluorine [1] Group 2 - The semiconductor materials industry has high technical barriers and long customer certification cycles, which can take 1 to 3 years, raising questions about the company's ability to successfully transition into this high-tech manufacturing field [2] - The company's historical performance has been characterized by a "high opening and low walking" trajectory, having previously been a leading enterprise in the photovoltaic sector before facing significant challenges and transitioning to the pharmaceutical industry [2] - Despite continuous declines in performance, the company's stock price has increased by over 53% this year, indicating market speculation regarding its transformation prospects [2] Group 3 - The transaction is still in the planning stage, with specific details regarding valuation and performance commitments yet to be disclosed, leaving the success of the acquisition uncertain [3]
Pragmatic柔性芯片产能就绪,赋能更多创新场景
Ju Chao Zi Xun· 2025-09-08 09:03
与传统硅基芯片相比,Flex IC(柔性集成电路)厚度仅为其1/3,生产周期更是从数月缩短至数天,从原材料进场到最后产品交付,只需要数天就可以完 成,整个制造成本会更低。 不过,从目前应用来看,Flex IC不是替代硅基,而是开辟更多新的应用场景。在2025深圳国际物联网展(IOTE)上,全球柔性半导体领军企业Pragmatic 带来了其柔性晶圆和产品方案,一度吸晴无数。 Pragmatic 半导体销售、业务发展与产品管理高级副总裁James Davey表示:"我们Flex IC与传统硅基芯片的制造工艺几乎一样的,不同之处在于我们将一 种聚合物——聚酰亚胺作为基材,通过玻璃载具承载生产,兼容传统硅基半导体的刻蚀等工艺。" James Davey进一步称,Flex IC在生产过程中使用化学品、水、能源的量少,传统硅基在生产过程中会耗很多的能源、水和化学品;同时产品具备超薄、 可弯曲特性,可实现"触感无痕"集成,为智能穿戴、包装标签等场景提供了全新可能,工作温度范围覆盖- 10℃至75℃,已满足消费电子等主流场景需 求。 目前,NFC Connect已经采用Pragmatic公司独特的Flex IC技术,以超薄、 ...
臻驱科技完成数亿元E轮融资二期交割,总融资额超6亿元
Ju Chao Zi Xun· 2025-09-08 07:08
据悉,臻驱科技成立于2017年,专注提供高性能国产功率半导体及新能源汽车驱动解决方案,总部位于上海浦东,在广西柳州、浙江平湖、安徽芜湖、重 庆、上海临港、浙江杭州及德国亚琛等地设有子公司。 9月8日,臻驱科技发文称,公司完成了数亿元E轮融资二期交割,E轮总融资额超6亿元。此轮融资中,E轮领投方国投创新、国投招商再度加码,中国互联 网投资基金、广州产投、浦东创投参与投资,老股东华泰宝利投资旗下华淳保信基金追加投资。 此次融资资金将主要用于加速新一代功率模块、功率砖及电控产品的量产落地,推动海外客户项目的交付,并进一步完善国内业务布局和全球市场拓展。 文章称,凭借着行业领先的产品创新、产业化落地和供应链整合能力,臻驱科技正向开发的新能源汽车电机控制器、功率模块等产品,已成功配套国内外主 流车企的数十款车型,畅销中国、欧洲等市场,2024年出货量达50万套,功率模块超150万片,助力全球新能源汽车产业绿色前行。据NE时代最新数据, 2025上半年臻驱科技双电控装机量居行业前三,功率模块排名第八,出口装机量在独立电控供应商中排名全国第一。 (校对/黄仁贵) ...
中智行科技被裁定破产清算,经营场所已不明
Ju Chao Zi Xun· 2025-09-08 07:08
经法院调查,中智行涉及多件执行不能案件,涉案金额巨大,对于本案申请人的1.5万元款项也未能偿付。中智行符合受理破产 的条件,依法予以受理。此外,中智行公司不在注册地经营,经营场所不明,无法取得联系。 2024年8月,中智行第一次出现被执行案件,在第一次被执行文书披露前的一个月,创始人王劲卸任法人。目前,企查查显示, 中智行的法定代表人为张水生,且公司现在公开的涉及合同纠纷案件有近10件,总金额接近2500万元。 8月18日,江苏南京市栖霞区人民法院裁定受理了债务人对中智行科技有限公司提出的破产清算申请,并指定江苏泛华律师事务 所与江苏苏亚金诚税务师事务所有限公司为中智行公司管理人。9月4日,法院发布公告称,法院将于2025年10月24日召开第一 次债权人会议。 法院发布的民事裁定书显示,申请人对中智行申请破产清算理由如下:申请人与中智行于2024年11月27日在劳动仲裁委员会签 订调解书,约定中智行在2025年4月20日前支付1.5万元,后经多次催要未果。申请人遂向人民法院申请强制执行,但中智行一直 无法支付调解款项,故申请其破产清算还债。 公开资料显示,中智行的创始人王劲是中国互联网和人工智能领域的资深人士 ...
即将上市!奇瑞汽车成功通过港交所上市聆讯
Ju Chao Zi Xun· 2025-09-08 07:01
备案通知书显示,奇瑞汽车拟发行不超过6.99亿股境外上市普通股并在香港联合交易所上市。同时,奇瑞汽车18名股东拟将所持合计 2,015,999,074股境内未上市股份转为境外上市股份,并在香港联合交易所上市流通。 据悉,自1997年成立以来,奇瑞汽车已形成覆盖燃油车与新能源汽车的多元化产品矩阵,业务遍及全球100多个国家和地区,2024年全球 销量突破229.5万辆,稳居中国自主品牌乘用车企业第二、全球第十一大乘用车企业。 资料显示,2024年,奇瑞汽车全年实现营业收入4800亿元,同比增长超过50%;净利润143.34亿元,同比增长37.2%;全年销量首次突破 260万辆,同比增长38.4%,新能源车销量超58万辆,同比增长232%。 (校对/黄仁贵) 9月7日,港交所文件显示,奇瑞汽车股份有限公司通过港交所上市聆讯。 8月27日,中国证券监督管理委员会发布关于奇瑞汽车股份有限公司境外发行上市及境内未上市股份"全流通"备案通知书。 ...
中科曙光重大资产重组稳步推进,海光信息换股吸收合并引关注
Ju Chao Zi Xun· 2025-09-08 03:22
Core Viewpoint - Zhongke Shuguang (stock code: 603019) is progressing with a major asset restructuring involving a share swap merger with Haiguang Information Technology Co., Ltd. [2] Group 1: Restructuring Details - As of September 6, the due diligence work related to the restructuring is still ongoing [2] - Haiguang Information plans to issue A-shares to all A-share shareholders of Zhongke Shuguang as part of the share swap merger [2] - The transaction is classified as a related party transaction and constitutes a major asset restructuring [2] Group 2: Timeline and Process - The planning for this major asset restructuring began on May 26, 2025, leading to the suspension of Zhongke Shuguang's A-shares [2] - On May 31, the company announced the continuation of the stock suspension to protect investor interests [2] - A board meeting was held on June 6, where relevant proposals related to the transaction were approved, and the stock resumed trading on June 10 [2] - The company has provided updates on the restructuring progress on July 9 and August 7 [2] - The company will convene another board meeting to review the transaction proposals once the relevant work is completed [2]
乐鑫科技17.78亿元再融资项目注册生效,将投建Wi-Fi 7路由器芯片等项目
Ju Chao Zi Xun· 2025-09-08 03:08
Core Viewpoint - Lexin Technology (Shanghai) Co., Ltd. plans to raise up to 1.78 billion RMB through a private placement of A-shares to enhance its core competitiveness and market position by investing in various technology innovation projects [2][6]. Fundraising Details - The total amount to be raised is capped at 1.78 billion RMB [4]. - The fundraising has been registered and is effective as of August 28, 2025 [3]. - The issuance will target no more than 35 specific entities, including securities investment fund management companies, securities companies, and trust companies [5]. Investment Projects - Wi-Fi 7 Router Chip R&D and Industrialization Project: Investment of 398.52 million RMB aimed at developing router chips supporting Wi-Fi 7 technology [5]. - Wi-Fi 7 Smart Terminal Chip R&D and Industrialization Project: Investment of 249.86 million RMB focused on developing Wi-Fi 7 chips for smart terminal devices [5]. - AI Edge Chip R&D based on RISC-V Self-Developed IP: Investment of 431.76 million RMB to develop AI edge chips based on RISC-V architecture [5]. - Shanghai R&D Center Construction Project: Investment of 597.73 million RMB to enhance R&D capabilities and technological innovation [5]. - Supplementary Working Capital: 100 million RMB to improve liquidity for daily operations [5]. Strategic Goals - The fundraising aims to further develop the company's business and enhance its competitiveness in the IoT chip design sector [6]. - The company intends to continuously monitor trends in IoT technology and increase R&D investment to improve product performance and innovation capabilities [6]. - The plan has received approval from the company's board and shareholders, as well as regulatory approval from the Shanghai Stock Exchange and the China Securities Regulatory Commission [6].
华友钴业关于实施“华友转债”赎回暨摘牌的公告
Ju Chao Zi Xun· 2025-09-08 02:54
Core Viewpoint - Shanghai Nanchip Semiconductor Technology Co., Ltd. announced its fundraising plan aimed at technology innovation, with a total amount not exceeding 1,933.38 million yuan [2]. Group 1: Fundraising Overview - The total amount of funds raised will not exceed 1,933.38 million yuan, allocated to three main technology innovation projects [2]. Group 2: Project Summaries - **Intelligent Computing Power Management Chip R&D and Industrialization Project**: This project plans to invest 459.24 million yuan to develop power management products for high current applications, which will be used in PCs, data centers, and smart terminals, aiming to break foreign monopolies and enhance the company's industry position [3]. - **Automotive Chip R&D and Industrialization Project**: This project plans to invest 843.34 million yuan, focusing on various chip functions for automotive body systems, cockpit systems, and intelligent driving systems, aiming to establish a complete automotive chip ecosystem and promote domestic substitution in the automotive chip sector [4]. - **Industrial Application Sensor and Control Chip R&D and Industrialization Project**: This project plans to invest 630.80 million yuan, focusing on developing high-precision, low-power sensor and control solutions for industrial robots and smart sensing terminals, leveraging the company's capabilities in analog circuit design and control [5]. Group 3: Strategic Importance - The implementation of these projects is deemed necessary and feasible, aligning with national policy directions and market prospects, while enhancing the company's core technology and product competitiveness [5].