Financial Performance - The company reported a significant increase in revenue for the first half of 2023, with total revenue reaching approximately CNY 1.5 billion, representing a year-over-year growth of 25%[12]. - The company's operating revenue for the first half of 2023 reached ¥8,843,953,931.25, an increase of 11.52% compared to ¥7,930,064,263.71 in the same period last year[17]. - Net profit attributable to shareholders was ¥1,588,718,517.78, reflecting a 32.07% increase from ¥1,202,978,478.35 year-on-year[17]. - The basic earnings per share rose to ¥1.21, up 31.52% from ¥0.92 in the previous year[18]. - Future guidance indicates an expected revenue growth of 30% for the full year 2023, with a projected total revenue of CNY 3.2 billion[12]. - The company reported a net profit margin of approximately 11.4% for the first half of 2023, compared to 12.6% in the same period of 2022[143]. Research and Development - The company has allocated CNY 200 million for R&D in new technologies, focusing on advanced semiconductor manufacturing processes[12]. - Research and development expenses accounted for 7.59% of operating revenue, an increase of 0.38 percentage points compared to the previous year[18]. - The company reported a total R&D investment of ¥671,006,155.41, representing a 17.37% increase compared to ¥571,690,260.81 in the same period last year[35]. - The company applied for 357 new invention patents during the reporting period, with a total of 8,664 applications and 4,269 granted patents to date[34]. - The company has developed a new generation of independent NOR FLASH, with a focus on automotive-grade requirements and plans for continuous optimization for high-capacity, low-power products[38]. Market Expansion and Strategy - The company plans to expand its market presence in Southeast Asia, targeting a 20% market share in the region by 2025[12]. - The company is focusing on expanding its market presence in new industries such as new energy vehicles, industrial intelligence, and the Internet of Things[30]. - The company is actively pursuing vertical integration and specialization in the semiconductor industry, adapting to the evolving market demands[30]. Financial Stability and Cash Flow - The company maintains a strong cash position with CNY 1 billion in cash reserves, providing flexibility for future investments[12]. - The company's net cash flow from operating activities decreased by 17.39% to ¥2,241,826,177.74, down from ¥2,713,677,878.41[17]. - The company reported a net cash outflow from investment activities of RMB 2.65 billion, attributed to increased equipment purchases[63]. - The company has not utilized any raised funds for temporary liquidity support or cash management during the reporting period[119]. Environmental Compliance - The company has established pollution prevention facilities capable of treating 12,384 cubic meters of wastewater and 28,512,000 cubic meters of exhaust gas daily at its first plant[79]. - The total emissions of nitrogen oxides were recorded at 6.462 tons, with a permitted limit of 12.296 tons, indicating compliance with environmental standards[76]. - The company has implemented carbon reduction measures, including high-efficiency freezer retrofits and LED lighting upgrades, to control carbon emissions[86]. - The company and its domestic subsidiaries have passed ISO 14001 environmental management system certification, ensuring compliance with environmental management standards[83]. Shareholder and Corporate Governance - The company has committed to avoiding competition with its indirect controlling shareholder, Huahong Group, ensuring no adverse impact on its operations[90]. - The company has established a plan to stabilize its A-share stock price for three years following its IPO on the Shanghai Stock Exchange[96]. - The company guarantees that the prospectus for the IPO does not contain false statements or significant omissions, and will bear legal responsibility for the accuracy of the information provided[106]. - The company has committed to applying Chinese law and jurisdiction for disputes arising from its initial public offering and listing on the Shanghai Stock Exchange[112]. Risks and Challenges - Risk factors include potential supply chain disruptions and fluctuations in raw material costs, which could impact profit margins[12]. - The company faces risks related to market demand fluctuations, particularly in the consumer electronics sector, which may impact revenue and profitability[47]. - The company emphasizes the importance of talent retention and recruitment to maintain its competitive position in the semiconductor industry[44].

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對其準確性 或完整性亦不發表任何聲明，並明確表示，概不對因本公告全部或任何部份內容而產生或因倚 賴該等內容而引致的任何損失承擔任何責任。 HUA HONG SEMICONDUCTOR LIMITED 華虹半導體有限公司 （於香港註冊成立之有限公司） （股份代號：01347） 截至二零二三年六月三十日止六個月 中期業績公告 華虹半導體有限公司（「本公司」）董事會（「董事會」）謹此公佈本公司及其子公司 截至二零二三年六月三十日止六個月的未經審核綜合業績。 本公告載列本公司二零二三年中期報告全文，並符合香港聯合交易所有限公司 （「香港聯交所」）證券上市規則有關中期業績初步公告附載資料之相關規定。 本公司二零二三年中期報告的印刷版本將於適當時候寄發予本公司股東，並可於 香港聯交所網站 www.hkexnews.hk及本公司網站 www.huahonggrace.com進行查 閱。 承董事會命 華虹半導體有限公司 董事長兼執行董事 張素心先生 香港，二零二三年八月二十九日 於本公告日期，本公司董事分別為： 執行董事： 張素心 （董事長） 唐均君 （ ...

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對其準確性 或完整性亦不發表任何聲明，並明確表示，概不對因本公告全部或任何部份內容而產生或因倚 賴該等內容而引致的任何損失承擔任何責任。 HUA HONG SEMICONDUCTOR LIMITED 華虹半導體有限公司 （於香港註冊成立之有限公司） （股份代號：01347） 截至二零二三年六月三十日止六個月 中期業績公告 華虹半導體有限公司（「本公司」）董事會（「董事會」）謹此公佈本公司及其子公司 截至二零二三年六月三十日止六個月的未經審核綜合業績。 本公告載列本公司二零二三年中期報告全文，並符合香港聯合交易所有限公司 （「香港聯交所」）證券上市規則有關中期業績初步公告附載資料之相關規定。 本公司二零二三年中期報告的印刷版本將於適當時候寄發予本公司股東，並可於 香港聯交所網站 www.hkexnews.hk及本公司網站 www.huahonggrace.com進行查 閱。 承董事會命 華虹半導體有限公司 董事長兼執行董事 張素心先生 香港，二零二三年八月二十九日 ...

| A 股代码：688347 | 股简称：华虹公司 A | 公告编号：2023-003 | | --- | --- | --- | | 港股代码：01347 | 港股简称：华虹半导体 | | 华虹半导体有限公司 关于部分高级管理人员增持公司 A 股股份计划的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 华虹半导体有限公司（以下简称"公司"）收到公司执行董事兼 总裁唐均君先生；公司执行副总裁周卫平先生；公司执行副总裁、 首席财务官兼信息披露境内代表 Daniel Yu-Cheng Wang（王鼎）先 生；公司执行副总裁 Weiran Kong（孔蔚然）先生；公司执行副总 裁倪立华先生的告知函，基于对公司未来发展的信心以及对公司 长期投资价值的认可，计划自 2023 年 8 月 30 日（中报窗口期后第 一个交易日）起 6 个月内，通过上海证券交易所交易系统以集中竞 价方式增持公司股份，合计增持金额不低于人民币 225 万元且不超 过人民币 450 万元。 一、增持主体的基本情况 | （一）增持主体 | ...

| A 股代码：688347 | A | 股简称：华虹公司 | 公告编号：2023-002 | | --- | --- | --- | --- | | 港股代码：01347 | | 港股简称：华虹半导体 | | 华虹半导体有限公司 关于间接控股股东增持公司 A 股股份计划的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 华虹半导体有限公司（以下简称"公司"）收到公司间接控股股东 上海华虹（集团）有限公司（以下简称"华虹集团"）的告知函， 基于对公司未来发展的信心以及对公司长期投资价值的认可，计划 自 2023 年 8 月 30 日（中报窗口期后第一个交易日）起 6 个月内， 通过集中竞价的方式增持公司股份，合计增持金额不低于人民币 5,000 万元且不超过人民币 10,000 万元。 一、增持主体的基本情况 （一）增持主体的名称：上海华虹（集团）有限公司 （二）截至2023年6月30日，华虹集团通过Shanghai Hua Hong International, Inc.（上海华虹国际公司）间接持有公 ...

HUA HONG SEMICONDUCTOR LIMITED 華虹半導體有限公司 （於香港註冊成立之有限公司） （股份代號：01347） (Client) (80000) (80000) 1st Proof 1st Proof 2023-08-15 12:19 2023-08-15 12:19 File Name: HAM23080728_C_Hua Hong_.indd File Name: HAM23080728_C_Hua Hong_.indd P.1 香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對其準確性 或完整性亦不發表任何聲明，並明確表示，概不對因本公告全部或任何部份內容而產生或因倚 賴該等內容而引致的任何損失承擔任何責任。 董事會會議日期通知 華虹半導體有限公司（「本公司」）特此通知，本公司謹訂於二零二三年八月二十九 日（星期二）上午十時舉行董事會會議，以商討下列事項： 1. 考慮及批准刊發本集團截至二零二三年六月三十日止未經審核中期業績；及 2. 商議任何其他事項。 承董事會命 華虹半導體有限公司 董事長兼執行董事 張素心先生 上海，二零二三年八月十六日 於本公告日 ...

[0 -> 25] Ladies and gentlemen, thank you for standing by, and welcome to the Fohung Semiconductor Second Quarter 2023 Earnings Conference Call. The call is hosted by Mr. Junjun Tang, President and Executive Director, and Mr. Daniel Wang, Executive Vice President and Chief Financial Officer. Please be advised that your dial-in is in a listen-only mode. [26 -> 52] However, at the conclusion of the management presentation, there will be a question and answer session, at which time you will receive instruction ...

香港交易及結算所有限公司、香港聯合交易所有限公司及香港中央結算有限公司對本公告的內容概不負責，對其準 確性或完整性亦不發表任何聲明，並明確表示，概不就因本公告全部或任何部分內容而產生或因依賴該等內容而引 致的任何損失承擔任何責任。 華虹半導體二零二三年第二季度業績公佈 所有貨幣以美元列帳，除非特別指明。 本合併財務報告系依香港財務報告準則編製。 中國香港 — 2023 年 8 月 10 日 — 全球領先的特色工藝純晶圓代工廠華虹半導體有限公司（香港聯交所 股票代號：01347；上交所科创板证券代码：688347) (「本公司」)於今日公佈截至二零二三年六月三 十日止三個月的綜合經營業績。 二零二三年第二季度主要財務指標（未經審核） 二零二三年第三季度指引 1 銷售收入達 6.314 億美元，同比上升 1.7%，環比持平。 毛利率 27.7%，同比下降 5.9 個百分點，環比下降 4.4 個百分點。 期内溢利 780 萬美元，上年同期為 5,320 萬美元，上季度為 1.409 億美元。 母公司擁有人應佔溢利 7,850 萬美元，上年同期為 8,390 萬美元，上季度為 1.522 億美元。 基本每股盈利 0. ...

本公告乃本公司自願提供，旨在向本公司股東及潛在投資者提供股票期權計劃下 的安排之最新情況。 香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對其準確性 或完整性亦不發表任何聲明，並明確表示，概不對因本公告全部或任何部分內容而產生或因倚 賴該等內容而引致的任何損失承擔任何責任。 HUA HONG SEMICONDUCTOR LIMITED 華虹半導體有限公司 （於香港註冊成立之有限公司） （股份代號：1347） 自願公告 茲提述本公司日期為二零二一年十一月八日的通函（「該通函」），內容有關修訂股 票期權計劃的條款。除另有界定外，本公告所用詞彙與該通函所界定者具有相同 涵義。 非執行董事： 孫國棟 王靖 葉峻 獨立非執行董事： 張祖同 王桂壎太平紳士 葉龍蜚 董事會欣然宣佈，根據股票期權計劃的條款（經本公司股東在二零二一年十一月 二十六日舉行的股東特別大會上通過的普通決議案修訂），二零一八年期權下最多 925,000份、二零一九年期權下最多125,000份及634,438份將分別於二零二三年十 二月二十四日、二零二三年八月十一日及二零二三年十二月二十三日歸屬。 本公司將根據香港聯合交易所有 ...

Financial Performance - Sales revenue for Q2 2023 reached $631.4 million, an increase of 1.7% year-over-year and flat compared to the previous quarter[2]. - Gross margin was 27.7%, down 5.9 percentage points year-over-year and down 4.4 percentage points quarter-over-quarter[2]. - Net profit for the period was $7.8 million, a significant decrease from $53.2 million in the same period last year and $140.9 million in the previous quarter[2]. - Basic earnings per share for Q2 2023 were $0.060, down from $0.064 year-over-year and $0.116 quarter-over-quarter[2]. - Operating expenses were $76.7 million, an increase of 8.5% year-over-year, mainly due to higher R&D costs[8]. - Other net losses amounted to $54.709 million, a decrease of 3.5% year-over-year, mainly due to increased government subsidies and interest income[22]. - The company reported a significant increase in interest income by 193.3% year-over-year, reaching $14.057 million[22]. - The company reported a net profit attributable to the parent company of $78.52 million for Q2 2023, compared to $83.93 million in Q2 2022[30]. - The company reported a pre-tax profit of $43,679 thousand for the three months ended June 30, 2023, down 46.5% from $81,519 thousand in the same period last year[32]. Future Projections - The company expects Q3 2023 sales revenue to be between $560 million and $600 million[3]. - Projected gross margin for Q3 2023 is expected to be between 16% and 18%[3]. Production and Capacity - The company’s eight-inch monthly production capacity increased to 347,000 wafers by the end of Q2 2023[4]. - The company maintained a production capacity utilization rate of 102.7% in Q2 2023[7]. - The overall capacity utilization rate for 200mm wafers was 112.0%, while for 300mm wafers it was 92.9%, resulting in a total capacity utilization rate of 102.7%[19]. - The company shipped 1,074,000 wafers in Q2 2023, reflecting a year-over-year increase of 3.7% and a quarter-over-quarter increase of 7.3%[20]. Revenue Breakdown - Revenue from 8-inch wafers was $361.2 million, accounting for 57.2% of total sales, while 12-inch wafers generated $270.1 million, or 42.8%[10]. - Sales revenue from China was $489.3 million, representing 77.5% of total sales, with an 8.6% year-over-year increase driven by demand for IGBT and MCU products[11]. - Sales revenue from North America was $48.5 million, down 33.7% year-over-year, primarily due to decreased demand for power management and MCU products[12]. - Embedded non-volatile memory sales reached $208.3 million, up 18.9% year-over-year, driven by increased demand for MCUs and smart card chips[13]. - Standalone non-volatile memory sales were $33.4 million, down 52.1% year-over-year, mainly due to reduced demand for NOR flash products[14]. - The industrial and automotive segment reported sales revenue of $195.158 million, a significant increase of 55.2% year-over-year, attributed to rising demand for IGBT, smart card chips, and general MOSFET products[18]. - Sales revenue for the 55nm and 65nm technology nodes was $84.920 million, down 25.7% year-over-year, primarily due to decreased demand for NOR flash, CIS, and logic products[15]. - Sales revenue for the 0.11µm and 0.13µm technology nodes increased by 15.2% year-over-year to $120.254 million, driven by higher demand for MCU products[16]. - The electronic consumer goods segment contributed $347.824 million in sales, accounting for 55.1% of total sales revenue, but saw a decline of 14.1% year-over-year[17]. Cash Flow and Assets - Net cash flow from operating activities for Q2 2023 was $161.19 million, a decrease of 24.1% year-over-year, but an increase of 22.2% quarter-over-quarter[23]. - Net cash flow used in investing activities was $(150.65) million, including capital expenditures of $165 million, partially offset by interest income of $14.4 million[24]. - Net cash flow used in financing activities was $(300.18) million, with new pledged deposits of $167.7 million and repayment of bank loans of $85.6 million[24]. - Total assets decreased from $7.38 billion in Q1 2023 to $6.95 billion in Q2 2023, while total liabilities decreased from $2.75 billion to $2.56 billion[25]. - Current assets totaled $3.08 billion, down from $3.32 billion in Q1 2023, with cash and cash equivalents decreasing from $2.22 billion to $1.85 billion[27]. - The current ratio improved to 2.8x in Q2 2023, compared to 2.7x in Q1 2023[28]. - Total non-current assets were $3,870,674 thousand, down from $4,060,779 thousand as of March 31, 2023, a decrease of 4.7%[31]. - Inventory increased to $558,252 thousand from $473,935 thousand, representing an increase of 17.8%[31]. - Total current liabilities decreased to $1,104,366 thousand from $1,220,712 thousand, a reduction of 9.5%[31]. - The company’s long-term bank borrowings stood at $1,410,544 thousand, a decrease from $1,496,396 thousand as of March 31, 2023[31].