| A 股代码：688347 | A 股简称：华虹公司 | 公告编号：2023-005 | | --- | --- | --- | | 港股代码：01347 | 港股简称：华虹半导体 | | 华虹半导体有限公司 关于使用募集资金向全资子公司增资 重要内容提示： 公司董事会于 2023 年 9 月 19 日审议通过了《关于使用募集资金向全资 子公司增资的议案》，同意公司使用募集资金向全资子公司华虹宏力增资 126.3235 亿元人民币（以下币种无特别说明，均为人民币）。联席保荐人 国泰君安证券股份有限公司、海通证券股份有限公司对前述事项出具了明 确同意的核查意见。本次使用募集资金向全资子公司增资事项在董事会审 批权限范围内，无需提交股东大会审议。本次增资不构成关联交易和《上 市公司重大资产重组管理办法》规定的重大资产重组。 一、 募集资金基本情况 根据中国证券监督管理委员会于 2023 年 6 月 6 日出具的《关于同意华 虹半导体有限公司首次公开发行股票注册的批复》（证监许可〔2023〕1228 号），公司获准向社会公开发行人民币普通股 40,775.00 万股，每股发行价格 为 52.00 元，募集资金总额 ...

国泰君安证券股份有限公司、海通证券股份有限公司 关于华虹半导体有限公司 使用募集资金向全资子公司增资以实施募投项目的核查意 见 国泰君安证券股份有限公司与海通证券股份有限公司（以下合称"联席保 荐人"）作为华虹半导体有限公司（以下简称"华虹公司"或"公司"）首次 公开发行人民币普通股（A股）股票并在科创板上市的联席保荐人，根据《证 券发行上市保荐业务管理办法》《上海证券交易所科创板股票上市规则》《上 海证券交易所上市公司自律监管指引第11号——持续督导》《上海证券交易所 科创板上市公司自律监管指引第1号——规范运作》《上市公司监管指引第2号 ——上市公司募集资金管理和使用的监管要求》等有关规定，对华虹公司拟使 用募集资金向全资子公司上海华虹宏力半导体制造有限公司（以下简称"华虹 宏力"）增资实施募投项目事项进行了审慎核查，具体情况如下： 一、募集资金的基本情况 根据中国证券监督管理委员会于2023年6月6日出具的《关于同意华虹半导 体有限公司首次公开发行股票注册的批复》（证监许可〔2023〕1228号），公 司获准向社会公开发行人民币普通股40,775.00万股，每股发行价格为人民币 52.00元，募集资金总 ...

股份發行人及根據《上市規則》第十九B章上市的香港預託證券發行人的證券變動月報表 | 截至月份: | 2023年8月31日 | 狀態: | 新提交 | | --- | --- | --- | --- | | 致：香港交易及結算所有限公司 | | | | | 公司名稱: | 華虹半導體有限公司（於香港註冊成立的有限公司） | | | | 呈交日期: | 2023年9月6日 | | | | I. 法定/註冊股本變動 不適用 | | | | FF301 第 1 頁 共 7 頁 v 1.0.2 於2023年8月7日發行於上海證券交易所上市並以人民幣買賣的普通股 第 2 頁 共 7 頁 v 1.0.2 III. 已發行股份變動詳情 (A). 股份期權（根據發行人的股份期權計劃） | 1. 可發行股份分類 | | 普通股 | | 股份類別 | 不適用 | | 可發行股份將於香港聯交所上市 (註1) | | 是 | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 可發行股份的證券代號(如已於香港聯交所上市) (註1) | | | | 01347 ...

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對其準確性 或完整性亦不發表任何聲明，並明確表示，概不就因本公告全部或任何部分內容而產生或因依 賴該等內容而引致的任何損失承擔任何責任。 HUA HONG SEMICONDUCTOR LIMITED 華虹半導體有限公司 （於香港註冊成立之有限公司） （股份代號：1347） 更改公司標誌 華虹半導體有限公司（「本公司」）董事（「董事」）會（「董事會」）欣然宣佈，本公司 已採納新標誌，自本公告日期起生效。本公司舊標誌及本公司新標誌載列如下， 以供識別： 舊標誌 新標誌 新標誌將印製於本公司相關公司文件（包括但不限於中期及年度報告、公告、通 函、通知、股票及新聞稿）及將於本公司網站展示。 更改本公司標誌將不會影響本公司現有股東之任何權利或本公司業務經營或財務 狀況。本公司所有印有舊標誌之現有已發行股票將繼續是該等本公司股份所有權 之有效憑證，可繼續用作買賣、結算、登記及交付用途。 因此，本公司將不會就現有股票提供任何免費換領印有本公司新標誌之新股票安 排。任何日後發行之股票將印有本公司新標誌。 承董事會命 華虹半導體有限公司 董事長兼執行董事 ...

HUA HONG SEMICONDUCTOR LIMITED 華虹半導體有限公司 Stock Code 股份代號 : 1347 (Incorporated in Hong Kong with limited liability) （於香港註冊成立之有限公司） 華彩華彩 芯 未來未來 EMPOWERING THE INFORMATION AGE EMPOWERING THE INFORMATION AGE 芯 2023 中期報告 INTERIM REPORT DEFINITIONS In this interim report, unless the context otherwise requires, the following terms shall have the meanings set out below. "Director(s)" the director(s) of the Company; "EPS" earnings per share; "Executive Director(s)" the executive Director(s) of our Company; "Group" o ...

Financial Performance - Revenue reached an all-time high of US$1,262.2 million, an increase of 3.8% compared to 1H 2022, primarily benefiting from improved average selling price[24] - Gross profit was US$377.3 million, an increase of 2.3% compared to 1H 2022, driven by improved average selling price[26] - Profit attributable to owners of the parent was US$230.8 million, an increase of 23.5% compared to 1H 2022[23] - Profit for the period was US$148.7 million, a decrease of 4.3% compared to 1H 2022, with a net profit margin of 11.8%[36] - Other income and gains were US$50.7 million, an increase of 153.3% compared to 1H 2022, primarily due to increased interest income and government subsidies[27] - Basic earnings per share attributable to ordinary equity holders increased to $0.176 from $0.144, marking a rise of 22.2%[168] Expenses and Costs - Finance costs increased to US$56.7 million, a rise of 278.5% compared to 1H 2022, primarily due to increased interest rates on bank borrowings[33] - Income tax expense was US$26.9 million, an increase of 25.9% compared to 1H 2022, primarily due to increased taxable profit[35] - Selling and distribution expenses decreased to US$5.1 million, a decrease of 27.6% compared to 1H 2022, primarily due to decreased labor expenses[30] - Administrative expenses increased to US$147.8 million, an increase of 6.4% compared to 1H 2022, primarily due to increased engineering wafer costs[31] - Cost of sales was US$885.0 million, an increase of 4.5% compared to 1H 2022, primarily due to increased depreciation and utility costs[25] Assets and Liabilities - Total non-current assets decreased by 2.7% from US$3,979.7 million to US$3,870.7 million[38] - Cash and cash equivalents decreased by 7.9% from US$2,008.8 million to US$1,851.0 million[50] - Net cash flows generated from operating activities decreased by 28.1% from US$407.8 million to US$293.1 million[50] - Total current liabilities decreased by 20.1% from US$1,382.4 million to US$1,104.4 million[38] - Other non-current assets increased by 63.3% from US$54.8 million to US$89.5 million due to increased prepayments for capital expenditure[42] Production and Capacity - The capacity utilization rate remained high, with double-digit growth in sales of eNVM/Standalone NVM process platforms[69] - Revenue from power discrete devices increased over 30% year-on-year in the first half of 2023[71] - The Company plans to continue expanding production capacity and accelerate process development in the second half of 2023, despite a slow recovery in the end-user market[73] - The joint venture for Wuxi Phase II project (HH Fab9) involves an investment of US$880.38 million and aims for a monthly production capacity of 83,000 wafers[72] Share Issuance and Financial Strategy - The RMB Share Issue raised gross proceeds of RMB21,203 million (approximately US$2,974 million), with net proceeds of RMB20,921 million (approximately US$2,934 million) after deducting issuance costs[77] - The Company intends to apply proceeds from the RMB Share Issue to projects including the "Hua Hong Manufacturing (Wuxi) Project" and the "8-Inch Factory Optimisation and Upgrading Project"[82] - The Company expects the RMB Share Issue to enhance its production capacity and R&D capabilities, consolidating its position as a leading pure-play foundry in the PRC[76] - The Board believes the RMB Share Issue will strengthen the financial position and broaden the Company's fundraising channels and shareholder base[76] Research and Development - The "Specialty Technological Innovation and Research and Development Project" aims to enhance proprietary innovation and R&D capabilities[85] - The "Special Process Technology Innovation R&D Project" is intended to strengthen the company's independent innovation and R&D capabilities[159] Market and Economic Conditions - The company will continue to pursue a diversified development strategy despite slow recovery in end-market demand[151] - Approximately 23% of the company's sales for the six months ended June 30, 2023, were denominated in currencies other than the functional currency of its subsidiaries[145] - The company’s bank borrowings amounted to $1.653 billion, with a potential impact of $57 million on pre-tax profit if the USD appreciates or depreciates by 5% against the RMB[145]

非執行董事： 孫國棟 葉峻 HUA HONG SEMICONDUCTOR LIMITED 華虹半導體有限公司 董事名單與其角色和職能 華虹半導體有限公司董事會（「董事會」）成員載列如下： 執行董事： 張素心 （董事會主席） 唐均君 （總裁） | | | 委員會成員 | | | --- | --- | --- | --- | | 董事 | 提名 | 薪酬 | 審核 | | 張素心 | C | | | | 唐均君 | | | | | 孫國棟 | | | | | 葉峻 | | | M | | 張祖同 | | | C | | 王桂壎太平紳士 | M | C | | | 葉龍蜚 | M | M | M | 二零二三年九月一日 附註： C 有關董事委員會主席 M 有關董事委員會成員 獨立非執行董事： 張祖同 王桂壎太平紳士 葉龍蜚 董事會設立三個委員會。下表提供各董事會成員在該等委員會中所擔任的職位： ...

华虹半导体有限公司（以下简称"公司"）董事会于近日收到公司非执行董 事王靖女士提交的书面辞职申请。因其他工作安排原因，王靖女士申请辞去公司 非执行董事及薪酬委员会成员职务，辞职后不再担任公司任何职务，该辞职申请 自送达公司董事会之日起生效。 据公司章程及相关适用规则，王靖女士的辞职不会导致公司董事会人数低于 法定最低人数，不会影响公司董事会的正常运行，亦不会对公司的日常运营产生 不利影响。 王靖女士已确认其与董事会并无任何意见分歧，其并不知悉任何有关辞任非 执行董事及薪酬委员会成员之事宜须提请公司股东关注的事项。 王靖女士在担任公司非执行董事及薪酬委员会成员期间，恪尽职守、勤勉尽 责，为公司的规范治理和健康发展发挥了重要作用。公司及董事会对王靖女士在 任职期间为公司作出的贡献表示衷心感谢！ 特此公告。 | 股代码：688347 | A | A 股简称：华虹公司 | 公告编号：2023-004 | | --- | --- | --- | --- | | 港股代码：01347 | | 港股简称：华虹半导体 | | 华虹半导体有限公司 关于非执行董事辞职的公告 华虹半导体有限公司董事会 本公司董事会及全体董事保证本 ...

Financial Performance - The company reported a significant increase in revenue for the first half of 2023, with total revenue reaching approximately CNY 1.5 billion, representing a year-over-year growth of 25%[12]. - The company's operating revenue for the first half of 2023 reached ¥8,843,953,931.25, an increase of 11.52% compared to ¥7,930,064,263.71 in the same period last year[17]. - Net profit attributable to shareholders was ¥1,588,718,517.78, reflecting a 32.07% increase from ¥1,202,978,478.35 year-on-year[17]. - The basic earnings per share rose to ¥1.21, up 31.52% from ¥0.92 in the previous year[18]. - Future guidance indicates an expected revenue growth of 30% for the full year 2023, with a projected total revenue of CNY 3.2 billion[12]. - The company reported a net profit margin of approximately 11.4% for the first half of 2023, compared to 12.6% in the same period of 2022[143]. Research and Development - The company has allocated CNY 200 million for R&D in new technologies, focusing on advanced semiconductor manufacturing processes[12]. - Research and development expenses accounted for 7.59% of operating revenue, an increase of 0.38 percentage points compared to the previous year[18]. - The company reported a total R&D investment of ¥671,006,155.41, representing a 17.37% increase compared to ¥571,690,260.81 in the same period last year[35]. - The company applied for 357 new invention patents during the reporting period, with a total of 8,664 applications and 4,269 granted patents to date[34]. - The company has developed a new generation of independent NOR FLASH, with a focus on automotive-grade requirements and plans for continuous optimization for high-capacity, low-power products[38]. Market Expansion and Strategy - The company plans to expand its market presence in Southeast Asia, targeting a 20% market share in the region by 2025[12]. - The company is focusing on expanding its market presence in new industries such as new energy vehicles, industrial intelligence, and the Internet of Things[30]. - The company is actively pursuing vertical integration and specialization in the semiconductor industry, adapting to the evolving market demands[30]. Financial Stability and Cash Flow - The company maintains a strong cash position with CNY 1 billion in cash reserves, providing flexibility for future investments[12]. - The company's net cash flow from operating activities decreased by 17.39% to ¥2,241,826,177.74, down from ¥2,713,677,878.41[17]. - The company reported a net cash outflow from investment activities of RMB 2.65 billion, attributed to increased equipment purchases[63]. - The company has not utilized any raised funds for temporary liquidity support or cash management during the reporting period[119]. Environmental Compliance - The company has established pollution prevention facilities capable of treating 12,384 cubic meters of wastewater and 28,512,000 cubic meters of exhaust gas daily at its first plant[79]. - The total emissions of nitrogen oxides were recorded at 6.462 tons, with a permitted limit of 12.296 tons, indicating compliance with environmental standards[76]. - The company has implemented carbon reduction measures, including high-efficiency freezer retrofits and LED lighting upgrades, to control carbon emissions[86]. - The company and its domestic subsidiaries have passed ISO 14001 environmental management system certification, ensuring compliance with environmental management standards[83]. Shareholder and Corporate Governance - The company has committed to avoiding competition with its indirect controlling shareholder, Huahong Group, ensuring no adverse impact on its operations[90]. - The company has established a plan to stabilize its A-share stock price for three years following its IPO on the Shanghai Stock Exchange[96]. - The company guarantees that the prospectus for the IPO does not contain false statements or significant omissions, and will bear legal responsibility for the accuracy of the information provided[106]. - The company has committed to applying Chinese law and jurisdiction for disputes arising from its initial public offering and listing on the Shanghai Stock Exchange[112]. Risks and Challenges - Risk factors include potential supply chain disruptions and fluctuations in raw material costs, which could impact profit margins[12]. - The company faces risks related to market demand fluctuations, particularly in the consumer electronics sector, which may impact revenue and profitability[47]. - The company emphasizes the importance of talent retention and recruitment to maintain its competitive position in the semiconductor industry[44].

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對其準確性 或完整性亦不發表任何聲明，並明確表示，概不對因本公告全部或任何部份內容而產生或因倚 賴該等內容而引致的任何損失承擔任何責任。 HUA HONG SEMICONDUCTOR LIMITED 華虹半導體有限公司 （於香港註冊成立之有限公司） （股份代號：01347） 截至二零二三年六月三十日止六個月 中期業績公告 華虹半導體有限公司（「本公司」）董事會（「董事會」）謹此公佈本公司及其子公司 截至二零二三年六月三十日止六個月的未經審核綜合業績。 本公告載列本公司二零二三年中期報告全文，並符合香港聯合交易所有限公司 （「香港聯交所」）證券上市規則有關中期業績初步公告附載資料之相關規定。 本公司二零二三年中期報告的印刷版本將於適當時候寄發予本公司股東，並可於 香港聯交所網站 www.hkexnews.hk及本公司網站 www.huahonggrace.com進行查 閱。 承董事會命 華虹半導體有限公司 董事長兼執行董事 張素心先生 香港，二零二三年八月二十九日 於本公告日期，本公司董事分別為： 執行董事： 張素心 （董事長） 唐均君 （ ...