Core Viewpoint - The report highlights the significant decline in the net profit of Xidi Microelectronics Group Co., Ltd. by over 50% in 2023, prompting a special legal review prior to a major asset restructuring [1][2]. Group 1: Performance and Compliance - Xidi Microelectronics confirmed that its financial information and commitments provided to the law firm are true, accurate, and complete [2][3]. - The law firm conducted a review of the company's compliance with public commitments made since its listing, confirming that all commitments have been fulfilled or are in progress [3][4]. Group 2: Financial Operations and Violations - The company has not engaged in any violations regarding fund occupation or external guarantees in the past three years, except for a minor incident involving related party transactions that were rectified [4][5]. - Xidi Microelectronics faced regulatory warnings due to improper handling of personal tax payments for related parties, which were subsequently returned [4][5]. Group 3: Regulatory Actions and Disciplinary Measures - The company and its executives have received disciplinary warnings from regulatory bodies for inaccuracies in financial reporting and improper fund usage [6][7]. - No criminal penalties or ongoing investigations have been reported against the company or its key personnel in the last three years [7]. Group 4: Future Commitments and Governance - Xidi Microelectronics has committed to enhancing its internal controls and management practices to ensure compliance with regulatory requirements and improve operational efficiency [38][39]. - The company has established a profit distribution policy to ensure stable returns for investors and maintain compliance with shareholder interests [38][40].

Core Viewpoint - The adjustment of the transaction plan by Xidi Microelectronics Group Co., Ltd. does not constitute a significant change to the restructuring plan, as confirmed by the independent financial advisor [10][11]. Group 1: Transaction Adjustment Details - The company plans to acquire 100% of Shenzhen Chengxin Micro Technology Co., Ltd. through a combination of issuing shares and cash payments [1]. - The performance commitment compensation scheme has been adjusted, maintaining the performance commitment period for 2025, 2026, and 2027, with net profit targets remaining at 22 million, 25 million, and 28 million RMB respectively [2][3]. - The total cumulative net profit target over the three years remains unchanged at 75 million RMB [3]. Group 2: Changes in Funding and Usage - The amount of matching funds to be raised has been reduced from 170.5 million RMB to 99.4825 million RMB, with the funds now intended for cash payments for the transaction and intermediary fees, rather than for R&D projects [7][8]. - The previous allocation of funds for the development of high-efficiency power management chips based on third-generation power devices has been removed from the funding plan [4][8]. Group 3: Performance Compensation Terms - The adjustment introduces new triggering conditions for performance compensation, including cumulative net profit not meeting targets in the two years following the performance commitment period [6][7]. - If the company exceeds the profit target for 2025, the excess will not be included in the cumulative net profit for the performance commitment period [7]. - The adjustments clarify the calculation of compensation amounts in the event of asset impairment, ensuring that certain amounts are excluded from the total compensation calculation [6][7]. Group 4: Decision-Making Process - The board of directors approved the adjustments during the 23rd meeting of the second board session on July 8, 2025, confirming that the changes do not constitute a significant adjustment to the restructuring plan [11].

Core Viewpoint - The report outlines the independent financial advisory opinion regarding the acquisition of 100% equity of Chengxin Microelectronics by Xidi Microelectronics through a combination of share issuance and cash payment, along with the fundraising of supporting funds. Group 1: Transaction Overview - Xidi Microelectronics plans to acquire 100% equity of Chengxin Microelectronics from four parties, including Cao Jianlin and Cao Songlin, through share issuance and cash payment [2][6]. - The total transaction price for the acquisition is set at 31,000 million RMB, with an estimated valuation of 31,100 million RMB for Chengxin Microelectronics, resulting in a premium rate of 214.37% [6][9]. - The transaction will involve issuing shares to no more than 35 specific investors to raise supporting funds, with a total fundraising amount not exceeding 9,948.25 million RMB [9][10]. Group 2: Financial Impact - Following the transaction, the total assets of Xidi Microelectronics are projected to increase by 24.16%, from 181,033.63 million RMB to 224,775.81 million RMB [17]. - The company's total liabilities are expected to rise significantly by 108.99%, from 24,151.42 million RMB to 50,473.57 million RMB [17]. - The transaction is anticipated to enhance the company's revenue by 36.20%, with projected operating income increasing from 54,551.06 million RMB to 74,297.37 million RMB [17]. Group 3: Share Structure and Control - Post-transaction, the total share capital of Xidi Microelectronics will increase from 410,319,336 shares to 425,819,336 shares, reflecting the issuance of 15,500,000 new shares [11][13]. - The control structure of the company will remain unchanged, with the actual controllers being Tao Hai and Tang Ya, despite the recent passing of a previous controller [14][15]. Group 4: Strategic Benefits - The acquisition will allow Xidi Microelectronics to rapidly absorb Chengxin Microelectronics' mature patent technologies, R&D resources, and sales channels, thereby expanding its product offerings in power management chips and other related fields [11][12]. - This strategic move is expected to enhance the company's market competitiveness and operational sustainability by broadening its technology and product layout [11].

Core Viewpoint - The company, Xidi Microelectronics, plans to acquire 100% of Chengxin Micro Technology Co., Ltd. through a combination of issuing shares and cash payment, while also raising supporting funds from specific investors [1][20]. Group 1: Transaction Overview - The transaction involves issuing shares and cash to acquire 100% of Chengxin Micro's shares from four parties, including Cao Jianlin and Cao Songlin [1][20]. - The total transaction price for the acquisition is set at 31 million yuan, with an estimated increase in value of 214.37% based on the income method of valuation [20][23]. - The company aims to raise up to 9.94825 million yuan from no more than 35 specific investors to support the transaction [20][21]. Group 2: Impact on Business - The acquisition will allow Xidi Micro to integrate Chengxin Micro's established technology, research resources, and sales channels, enhancing its product offerings in power management chips and other semiconductor areas [22][23]. - The transaction is expected to strengthen the company's market competitiveness and operational sustainability by expanding its product categories and customer base [23]. Group 3: Share Structure Changes - Following the transaction, the total number of shares for Xidi Micro is projected to increase to 425,819,336 shares, reflecting the issuance of 15.5 million new shares [23].

希荻微电子集团股份有限公司（以下简称"公司"）第二届监事会第十九次 会议于 2025 年 7 月 8 日在公司会议室召开，本次会议采用现场和通讯方式召开， 会议应到监事 3 名，实到监事 3 名。本次会议由公司监事会主席李家毅先生主持。 会议的召集和召开程序符合《中华人民共和国公司法》（以下简称《公司法》）和 《希荻微电子集团股份有限公司章程》（以下简称《公司章程》）的相关规定，表 决形成的议决议合法、有效。 二、监事会审议情况 本次会议由监事会主席李家毅先生主持，以记名投票表决方式审议通过以下 议案： （一） 逐项审议通过《关于调整公司发行股份及支付现金购买资产并募集 配套资金具体方案的议案》 证券代码：688173 证券简称：希荻微 公告编号：2025-051 希荻微电子集团股份有限公司 第二届监事会第十九次会议决议公告 本公司监事会及全体监事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、监事会会议召开情况 前述事项在公司和交易对方签署的《业绩补偿及超额业绩奖励协议》《业绩 补偿及超额业绩奖励协议之补充协议》进行了具体约定。 表决结果 ...

证券代码：688173 证券简称：希荻微 公告编号：2025-050 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、董事会会议召开情况 希荻微电子集团股份有限公司（以下简称"公司"）第二届董事会第二十三 次会议于 2025 年 7 月 8 日以通讯方式和书面方式发出通知，并于 2025 年 7 月 8 日以现场及通讯表决方式召开。本次会议由公司董事长 TAO HAI（陶海）先生 主持，会议应参加表决的董事为 8 人，实际参加会议表决的董事为 8 人。本次会 议的召集、召开和表决程序符合《中华人民共和国公司法》（以下简称《公司法》） 和《希荻微电子集团股份有限公司章程》（以下简称《公司章程》）的有关规定， 会议决议合法、有效。 二、董事会审议情况 会议以记名投票表决方式，审议通过了以下议案： （一） 逐项审议通过《关于调整公司发行股份及支付现金购买资产并募集 配套资金具体方案的议案》 公司拟对 2025 年第二次临时股东大会原审议通过的发行股份及支付现金购 买资产并募集配套资金方案进行调整，具体调整如下： 1．发行股份 ...

证券代码：688173 证券简称：希荻微 公告编号：2025-052 的审核问询函回复的提示性公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 希荻微电子集团股份有限公司（以下简称"公司"）拟通过发行股份及支付 现金方式购买深圳市诚芯微科技股份有限公司 100%股份并募集配套资金（以下 简称"本次交易"）。 2025 年 5 月 13 日，公司收到上海证券交易所（以下简称"上交所"）出具 的《关于希荻微电子集团股份有限公司发行股份及支付现金购买资产并募集配套 资金申请的审核问询函》（上证科审（并购重组）〔2025〕12 号）（以下简称"《审 核问询函》"）。 公司及相关中介机构根据《审核问询函》的要求，就相关事项逐项说明、论 证和回复，具体内容详见公司于 2025 年 7 月 10 日在上交所网站(www.sse.com.cn) 披露的《希荻微电子集团股份有限公司关于上海证券交易所〈关于希荻微电子集 团股份有限公司发行股份及支付现金购买资产并募集配套资金申请的审核问询 函〉之回复》及相关文件。 本次交易尚需满足多项交易 ...

证券代码：688173 证券简称：希荻微 公告编号：2025-053 希荻微电子集团股份有限公司 关于发行股份及支付现金购买资产并募集配套资金 （草案）（修订稿）修订说明的公告 相较公司于 2025 年 4 月 29 日披露的《希荻微电子集团股份有限公司发行股 份及支付现金购买资产并募集配套资金报告书（草案）（申报稿）》，草案（修 订稿）对部分内容进行了修订，主要修订情况如下： | 重组报告书 | 修订情况说明 | | --- | --- | | 释义 | 1、更新和增加了新的释义 | 1 | | 重组报告书 | 修订情况说明 | | --- | --- | --- | | | 重大事项提示 | 1、更新了发行股份购买资产的发行情况 | | | | 2、更新了募集配套资金情况 | | | | 3、更新了上市公司股权结构及实际控制人的最新情况以及相关表述 | | | | 年度主要财务指标的影响 4、更新了本次交易对上市公司 2024 | | | | 5、更新了上市公司持股 5%以上股东自本次交易首次信息披露之日起 | | | | 至实施完毕期间的股份减持计划 | | | | 6、更新了业绩承诺补偿安排 | | ...

股票代码：688173.SH 股票简称：希荻微 上市地点：上海证券交易所 上市公司声明 希荻微电子集团股份有限公司 发行股份及支付现金购买资产 并募集配套资金报告书（草案） （修订稿） | 交易类型 | 交易对方 | | --- | --- | | | 曹建林、曹松林、深圳市链智创芯管理咨询合伙企业（有限合 | | 发行股份及支付现金购买资产 | 伙）、深圳市汇智创芯管理咨询合伙企业（有限合伙） | 独立财务顾问 募集配套资金 不超过35名符合条件的特定投资者 二〇二五年七月 希荻微发行股份及支付现金购买资产并募集配套资金报告书（草案）（修订稿） 本公司及本公司全体董事、监事及高级管理人员保证本报告书及其摘要内容的真 实、准确、完整，对本报告书及其摘要的虚假记载、误导性陈述或重大遗漏负相应的 法律责任。 本公司实际控制人及其一致行动人、董事、监事、高级管理人员承诺，如本次交 易因涉嫌所提供或者披露的信息存在虚假记载、误导性陈述或者重大遗漏而被司法机 关立案侦查或者被中国证券监督管理委员会立案调查的，在案件调查结论明确之前， 将暂停转让所持有的上市公司股份（如有），并于收到立案稽查通知的两个交易日内 将暂停转让 ...

希荻微电子集团股份有限公司（以下简称"公司"）拟通过发行股份及支付 现金方式购买深圳市诚芯微科技股份有限公司（以下简称"诚芯微"）100%股份 并募集配套资金（以下简称"本次交易"）。 经审慎认定，公司董事会认为本次交易符合《上市公司监管指引第 9 号—— 上市公司筹划和实施重大资产重组的监管要求》第四条的规定，具体如下： （一）本次交易的标的资产为诚芯微 100%股份。诚芯微的日常经营不涉及 立项、环保、行业准入、用地、规划、建设施工等有关报批事项，不需要取得相 应的许可证书或者有关主管部门的批复文件。本次交易涉及的有关报批事项已在 《希荻微电子集团股份有限公司发行股份及支付现金购买资产并募集配套资金 报告书（草案）（修订稿）》中详细披露，并对本次交易无法获得批准或核准的风 险作出了特别提示。 （二）本次交易的交易对方合法拥有标的资产的完整权利，不存在限制或者 禁止转让的情形，诚芯微不存在出资不实或者影响其合法存续的情况。 （三）本次交易有利于提高公司资产的完整性，有利于公司在人员、采购、 生产、销售、知识产权等方面保持独立。 希荻微电子集团股份有限公司董事会 关于公司发行股份及支付现金购买资产并募集配套资 ...