平安证券股份有限公司 首次公开发行部分限售股上市流通的核查意见 平安证券股份有限公司（以下简称平安证券或保荐人）作为承接甬矽电子 (宁波) 股份有限公司(以下简称甬矽电子或公司)首次公开发行股票并在科 创板上市持续督导工作及向不特定对象发行可转换公司债券的保荐人,根据 《证券发行上市保荐业务管理办法》《上海证券交易所科创板股票上市规则》 《上海证券交易所科创板上市公司自律监管指引第 1 号——规范运作》等有关 规定,对甬矽电子首次公开发行部分限售股上市流通事项进行了审慎核查,并 发表本核查意见，具体情况如下: 一、本次上市流通的限售股类型 关于甬矽电子(宁波)股份有限公司 根据中国证券监督管理委员会(以下简称中国证监会)出具的《关于同意 角矽电子（宁波）股份有限公司首次公开发行股票注册的批复》(证监许可 (2022) 2286号),同意甬矽电子向社会公众发行人民币普通股(A股)股票 60.000.000 股,公司于 2022年 11月 16日在上海证券交易所科创板上市,公司首 次公开发行股票完成后,公司股份总数为 407,660,000 股,其中有限售条件流通 股 362,074,866 股,无限售条件流通股 ...

Core Points - The company, Yongxi Electronics (Ningbo) Co., Ltd., will hold a Q3 2025 earnings presentation on November 17, 2025, from 11:00 to 12:00 [2][4][5] - Investors can submit questions for the presentation from November 10 to November 14, 2025, via the Shanghai Stock Exchange Roadshow Center or through the company's email [2][6] - The presentation will be conducted in an interactive online format, allowing for real-time communication between the company and investors [3][4] Summary by Sections Meeting Details - The earnings presentation will take place on November 17, 2025, from 11:00 to 12:00 [5] - The location for the meeting is the Shanghai Stock Exchange Roadshow Center [4][5] - The format of the meeting will be an online interactive session [3][4] Participation Information - Investors can participate online through the Shanghai Stock Exchange Roadshow Center [6] - Questions can be submitted in advance through the designated website or via the company's email [2][6] - The company will address commonly asked questions during the presentation [2][3] Contact Information - The contact person for inquiries is Li Dalin, with a provided phone number and email for further assistance [6]

| 证券代码：688362 | 证券简称：甬矽电子 | 公告编号：2025-090 | | --- | --- | --- | | 转债代码：118057 | 转债简称：甬矽转债 | | 甬矽电子（宁波）股份有限公司 关于召开 2025 年第三季度业绩说明会的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 会议召开时间：2025 年 11 月 17 日（星期一）11:00-12:00 会 议 召 开 地 点 ： 上 海 证 券 交 易 所 上 证 路 演 中 心 （ 网 址 ： https://roadshow.sseinfo.com/） 会议召开方式：上证路演中心网络互动 投资者可于 2025 年 11 月 10 日（星期一）至 11 月 14 日（星期五）16:00 前登录上证路演中心网站首页点击"提问预征集"栏目或通过公司邮箱 zhengquanbu@forehope-elec.com 进行提问。公司将在说明会上对投资者普遍关注 的问题进行回答。 甬矽电子（宁波）股份有限公司（以下简称"公司"） ...

| 证券代码：688362 | 证券简称：甬矽电子 | 公告编号：2025-091 | | --- | --- | --- | | 转债代码：118057 | 转债简称：甬矽转债 | | 关于控股子公司参与竞拍 宁波宇昌建设发展有限公司股权的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、交易基本情况 甬矽电子（宁波）股份有限公司（以下简称"公司"）于 2025 年 10 月 13 日召开第三届董事会第二十三次会议，审议通过了《关于控股子公司参与竞拍宁 波宇昌建设发展有限公司 100%的股权的议案》，同意公司控股子公司甬矽半导体 （宁波）有限公司（以下简称"甬矽半导体"）参与余姚市昌海建设发展有限公 司（以下简称"余姚昌海"、"转让方"）所持宁波宇昌建设发展有限公司（以下 简称"宁波宇昌"）100%的股权的竞拍（以下简称"本次交易"）。该事项已经公 司 2025 年第四次临时股东会审议通过。 本次交易对方为余姚昌海，余姚昌海为原直接持有公司 5%以上股份的股东 中意宁波生态园控股集团有限公司的全资子公司，本次 ...

Core Insights - The company Yongxi Electronics announced that its subsidiary Yongxi Semiconductor participated in the auction for the equity of Ningbo Yuchang Construction Development Co., Ltd. The transaction price was 486 million yuan [1] Group 1 - Yongxi Semiconductor's involvement in the auction indicates a strategic move to expand its business operations [1] - The acquisition price of 486 million yuan reflects the company's investment capacity and market confidence [1]

Group 1 - Huajin Securities issued a report on November 6, giving Yongxi Electronics (688362.SH, latest price: 32.12 yuan) an "Overweight" rating [1] - The rating is supported by the breakthrough with overseas major clients and rapid growth of existing core customer base, leading to a significant quarter-on-quarter performance increase [1] - AIoT remains the primary downstream sector for the company, with the first-phase factory and second-phase FC and QFN operating at full capacity [1]

Core Insights - The Chinese semiconductor industry is transitioning from a phase of rapid growth driven by policy and capital to a more complex stage focused on sustainability, strength, and true innovation [1] - The future of the industry will emphasize "strong chain and supplementary chain" strategies, marking a pivotal shift in development [1] Investment Strategy Evolution - The investment landscape is expanding from chip design to upstream areas of the supply chain, with a focus on materials, advanced packaging, and emerging technologies [2][3] - Materials are identified as a key investment area due to their long validation cycles and the potential for creating a strong competitive moat [2] - Advanced packaging is becoming increasingly important as a high-value business, especially in light of the slowing of Moore's Law [3] - Emerging fields like photonic quantum technology are seen as promising areas for growth, with China positioned to compete globally [3] Entrepreneurial Ecosystem Shift - The number of semiconductor companies in China has grown significantly, indicating a shift towards industry consolidation and mergers and acquisitions [6] - Founders are increasingly open to the idea of being acquired, recognizing that there are multiple paths to success beyond independent IPOs [6] - New entrepreneurs are more inclined to innovate rather than replicate existing products, reflecting a shift in market dynamics [6] Industry Drivers - AI is becoming a central driver of demand for new chips, particularly in data centers and IoT applications [7] - The market for GPUs is expanding rapidly, driven by the increasing investment in data center infrastructure [7] - Storage solutions are also seeing significant growth, with domestic companies improving their capabilities and increasing their market share [7] Future Outlook - The next decade will focus on "strong chain and supplementary chain" strategies, with an emphasis on core areas like computing chips and critical materials [9] - Mergers and acquisitions will play a crucial role in industry consolidation, with plans for a dedicated fund to facilitate this process [9] - Original innovation will be prioritized, with investments aimed at transforming research outcomes into commercial products [9] - AI will continue to redefine the semiconductor industry, influencing everything from data centers to smart hardware [9]

Summary of Conference Call Company Overview - The conference call was held for Yongxi's Q3 2025 earnings report, attended by key executives including the CTO and CFO [1][2]. Key Financial Highlights - **Revenue**: For the first three quarters of 2025, Yongxi achieved revenue of 3.17 billion CNY, a year-on-year increase of 24%. Q3 revenue alone was 1.16 billion CNY, up 26% year-on-year, marking a record high for the company [2][3]. - **Net Profit**: The net profit attributable to shareholders for the first three quarters was 63 million CNY, a 49% increase compared to the same period last year. Q3 net profit after deducting non-recurring items also turned positive [2][3]. - **Gross Margin**: The overall gross margin for the first three quarters was 16.4%, with a steady increase observed each quarter [3]. - **Operating Expenses**: Management expense ratio decreased from 7.76% to 6.24%, and financial expense ratio dropped from 6.02% to approximately 5.15% [3]. Product and Market Insights - **Product Revenue Breakdown**: System-level packaging products accounted for about 40% of revenue, while QF classified products made up approximately 38%. Wafer-level packaging and flip-chip products combined accounted for 20% [3][4]. - **Growth Areas**: The AIoT sector remains the largest revenue contributor, accounting for nearly 70% of total revenue, with a growth rate exceeding 30% [4][25]. - **Client Base**: The company has seen significant growth from overseas clients, particularly in the top three customer segments [4][16]. Future Outlook - **Q4 Expectations**: The company anticipates continued revenue growth in Q4, driven by strong demand from overseas clients and a recovery in the PA sector [7][29]. - **Capital Expenditure**: The capital expenditure for the current year is set at 2.5 billion CNY, with expectations for next year to remain at least at the same level. Production capacity is projected to increase by nearly 20% [10][29]. - **Advanced Packaging Development**: The company is focusing on 2.5D packaging technology and has made significant R&D investments, with a 42% increase in R&D spending compared to last year [3][13]. Industry Trends - **AI Impact**: The demand for advanced packaging technologies is expected to grow significantly due to the increasing application of AI across various industries. The company views this as a substantial growth opportunity [24][33]. - **Market Dynamics**: There is a noted increase in material costs and potential price adjustments for customers due to tight capacity in the industry [8][9]. Additional Insights - **Customer Demand**: The company is experiencing high utilization rates, with production capacity operating above 90% for certain product lines [7]. - **Future Revenue Composition**: The company aims for overseas revenue to exceed 30% in the future, driven by successful engagements with international clients [16]. This summary encapsulates the key points discussed during the conference call, highlighting the company's financial performance, market positioning, and future growth strategies.

| 证券代码：688362 | 证券简称：甬矽电子 | 公告编号：2025-089 | | --- | --- | --- | | 转债代码：118057 | 转债简称：甬矽转债 | | 甬矽电子（宁波）股份有限公司 2025年第四次临时股东会决议公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次会议是否有被否决议案：无 一、 会议召开和出席情况 （一） 股东会召开的时间：2025 年 10 月 29 日 （二） 股东会召开的地点：浙江省余姚市中意宁波生态园滨海大道 60 号行政楼 8 楼会议室 （三） 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况： | 1、出席会议的股东和代理人人数 | 149 | | --- | --- | | 普通股股东人数 | 149 | | 2、出席会议的股东所持有的表决权数量 | 134,162,865 | | 普通股股东所持有表决权数量 | 134,162,865 | | 3、出席会议的股东所持有表决权数量占公司表决权数量的比 ...

FANGDA PARTNERS http://www.fangdalaw.com 上海市方达（北京）律师事务所（以下简称"本所"）是具有中华人民共和国 境内法律执业资格的律师事务所。根据相关法律顾问协议，本所指派律师出席甬 矽电子（宁波）股份有限公司（以下简称"公司"）2025 年第四次临时股东会（以 下简称"本次股东会"），并就本次股东会的召集和召开程序、参与表决和召集会 议人员的资格、表决程序和表决结果等有关事宜出具本法律意见书。 本法律意见书依据《中华人民共和国公司法》《中华人民共和国证券法》《上 市公司股东会规则》及其他相关中华人民共和国境内已公开颁布并生效的法律、 法规、规章及规范性文件（以下合称"中国法律法规"）以及《甬矽电子（宁波） 股份有限公司章程》（以下简称"《公司章程》"）的规定出具。 本法律意见书仅就本次股东会的召集和召开程序、出席会议人员、召集人、 表决程序是否符合相关中国法律法规及《公司章程》的规定以及表决结果是否合 法、有效发表意见，并不对任何中国法律法规以外的国家或地区的法律发表任何 意见。本法律意见书的出具基于以下假设：（1）公司所提供的所有文件正本及副 本均为真实、准确、完整 ...