Core Viewpoint - The future of AI is transitioning towards physical applications, with significant advancements expected in silicon technology and open-source models, particularly in China [1][4][5]. Group 1: AI Development Stages - AI has experienced rapid development over the past twelve years, with major breakthroughs occurring approximately every three to five years [4]. - The current wave of AI, termed reasoning AI, is characterized by its ability to understand and solve previously unencountered problems [4]. - The next phase of AI is expected to be physical AI, where capabilities will be applied to physical machines such as robots [4]. Group 2: China's Role in Open Source - China has excelled in open-source initiatives, with models like DeepSeek, Qwen, and Kimi being among the best in the world [6][7]. - The number of research papers published by Chinese researchers on arXiv is the highest globally, indicating a strong contribution to the open-source ecosystem [7]. - Open-source research enhances the quality and safety of AI development by inviting global scrutiny [7]. Group 3: Advancements in Silicon Technology - Future advancements in silicon technology are expected to include three-dimensional transistors, larger panel-level packaging, and high-density integrated modules [8][9]. - The transition to three-dimensional structures, such as Gate-All-Around (GAA) transistors, will significantly enhance performance [8]. - Innovations in packaging technology, such as CoWoS, allow for the stacking of multiple chips, leading to greater integration and efficiency [8]. Group 4: Recommendations for Young People - Young individuals should develop the ability to interact effectively with AI and start using it as soon as possible [10][12]. - It is crucial for the younger generation to continue learning foundational skills such as mathematics, logic, and programming, even as AI evolves [12]. - The integration of AI into daily life presents a unique opportunity for young people to grow alongside this technology [12].

开源还是推动发展最安全的方式。黄仁勋表示："有了开源和所有开放创新，就会引来全球科学界的审 视。而有了全球科学界的审视，研究工作的质量就会提高，对安全性很有好处。" "过去的12年左右时间里，人工智能发展速度非常快，大概每3到5年就会有一次重大突破。"黄仁勋预 测，在问题解决方面，AI应该很快就能实现超越人类的水平，其发展的下一阶段是物理型人工智能， 生成式AI的所有能力都可以应用到像机器人这样的物理机械当中。 王坚表示，算力的进步是近年来最让他感到兴奋的技术变革。算力是一切的基础，与其说计算机改变世 界，不如说算力改变世界。今天的AI是算力发展的成果。 开源是当今人工智能发展的核心动力之一，具有全球性影响。黄仁勋称，中国在开源工程方面做得非常 出色，比如DeepSeek-R1、通义千问（Qwen）和Kimi等都是当今世界上最优秀的推理模型，开源模型不 仅助力中国的生态系统，也在为全球各地的生态系统提供支持。据他介绍，目前中国研究人员在arXiv （国际权威论文预印本平台）上发表的论文数量是全球最多的。 第三届链博会先进制造主题活动现场。 记者 伊妹儿 摄 ◎记者 窦世平 "对英伟达而言，中国是世界上最大的市 ...

Group 1 - The core viewpoint of the news is that Shenzhen Basic Semiconductor Co., Ltd. has submitted its listing application, indicating its intent to go public and raise capital for its operations in the silicon carbide power device sector [1] - Basic Semiconductor was established in 2016 and specializes in the research and industrialization of silicon carbide power devices, with headquarters in Shenzhen and R&D centers in multiple locations including Beijing, Shanghai, and Japan [1] - The company has experienced significant losses over the reporting period from 2022 to 2024, with cumulative losses amounting to approximately 821 million yuan [2] Group 2 - Revenue figures for Basic Semiconductor during the reporting period are approximately 117 million yuan for 2022, 221 million yuan for 2023, and 299 million yuan for 2024, reflecting a compound annual growth rate of 59.9% [2] - The company has reported losses of approximately 242 million yuan, 342 million yuan, and 237 million yuan for the respective years, indicating ongoing financial challenges [2] - The revenue from distributors has shown a downward trend, with income from this channel being 41.8 million yuan, 68.6 million yuan, and 75.8 million yuan over the same period, while the number of distributors decreased from 169 to 141 [4] Group 3 - Basic Semiconductor's customer concentration is high, with revenue from the top five customers accounting for 32.2%, 46.4%, and 63.1% of total sales during the reporting period [5] - The company employs a combination of direct sales and distribution channels, with approximately 30% of revenue coming from distributors, which helps to quickly establish regional sales networks [2][4] - The company has been investing heavily in R&D, with expenditures of 59.4 million yuan, 75.8 million yuan, and 91.1 million yuan over the reporting period, representing 50.8%, 34.4%, and 30.5% of total revenue respectively [6][7] Group 4 - Basic Semiconductor's operating cash flow has been negative, with net cash used in operating activities reported as -307 million yuan, -120 million yuan, and -24.1 million yuan for the respective years [6][7] - The company emphasizes that its strategic investments in R&D, despite leading to losses, are intended to create unique competitive advantages and drive technological progress [6] - As of the end of 2024, Basic Semiconductor holds 163 patents and has submitted 122 patent applications, showcasing its commitment to innovation [6]

Core Viewpoint - The rapid adoption of silicon carbide (SiC) in the new energy sector is significantly increasing its market penetration, particularly in charging modules for electric vehicles, driven by the growing demand for high-efficiency power devices [3][12]. Group 1: Collaboration and Innovations - Yuyou Green Energy announced a deepened collaboration with Infineon Technologies to enhance the application of SiC power semiconductor solutions in their charging modules, achieving an efficiency of over 97.5% [4][6]. - The partnership aims to upgrade various charging solutions, including high-quality 40kW/60kW independent air-cooled and liquid-cooled charging modules, as well as V2G (Vehicle-to-Grid) interactive solutions [4][6]. Group 2: Product Development and Efficiency - Yuyou Green Energy is actively developing multiple SiC power modules, with some products achieving a maximum conversion efficiency of 97% [7]. - The company is in various stages of development for several SiC products, including a 40kW ultra-high voltage liquid-cooled module and a 22kW bidirectional DC charging module, with ongoing design and testing phases [7]. Group 3: Market Trends and Adoption - Nearly 20 companies have recently announced their latest SiC application solutions, indicating a growing market interest in SiC power modules [10]. - The increasing power requirements for charging stations, particularly those exceeding 600kW, are driving the demand for higher voltage, power, and density in power modules, making SiC devices an ideal choice [12][14]. Group 4: Cost Efficiency and Environmental Impact - SiC devices can help reduce overall costs and improve energy efficiency, with estimates suggesting significant savings in electricity costs for charging stations using SiC modules [17]. - For example, a charging station with five 480kW chargers could save approximately 21,200 yuan in electricity costs over three years by using SiC modules, while another station could reduce carbon emissions by 12 tons annually [17].

Core Viewpoint - Xiaomi has officially launched its first SUV model, YU7, which utilizes an 800V silicon carbide (SiC) high-voltage platform, showcasing the company's commitment to advanced electric vehicle technology [1][3][6]. Group 1: Product Specifications - The Xiaomi YU7 comes in three versions: Standard, Pro, and Max, all featuring the 800V SiC high-voltage platform [7]. - The Standard version has a single motor with a power of 235kW, achieving 0-100 km/h in 5.88 seconds and a range of 835 km [9]. - The Pro version features dual motors with a total power of 365kW, achieving 0-100 km/h in 4.27 seconds and a range of 770 km [9]. - The Max version also has dual motors, with a peak power of 288kW, achieving 0-100 km/h in 3.23 seconds and a range of 769 km [9]. - The YU7 supports fast charging, with the Max version capable of charging from 10% to 80% in just 12 minutes [9]. Group 2: Technology and Supplier Relationships - The YU7 is equipped with the V6s Plus super motor, featuring a conversion efficiency of 99.85% and a peak torque of 528N·m [11]. - The SiC suppliers for the YU7 include Infineon and Bosch, with the main electric drive systems provided by Huichuan United Power and United Automotive Electronics [16][25]. - The YU7's SiC components are expected to increase compared to the SU7, with the single motor version using approximately 64 SiC MOSFETs and the dual motor version using about 112 [23]. - Domestic suppliers such as ChipLink, Linzhong Electronics, and others are entering Xiaomi's supply chain, indicating a shift towards local SiC component sourcing [25].

Core Viewpoint - InnoCare (02577.HK) shares rose nearly 15% as the company engages in the sales of gallium nitride power semiconductor products, with reports indicating that Nexperia's collaboration with NVIDIA will play a crucial role in gallium nitride and silicon carbide technologies [1] Company Summary - InnoCare is involved in the sales of gallium nitride power semiconductor products [1] - The company's stock experienced a significant increase of nearly 15% [1] Industry Summary - The collaboration between Nexperia and NVIDIA is expected to enhance the development of gallium nitride and silicon carbide technologies, which are critical for the semiconductor industry [1]

据外媒报道，美国碳化硅（SiC）芯片制造商Wolfspeed正准备在数周内申请破产。 受消息影响，该公司股价开盘暴跌超70%，市值从百亿美元缩水至个位数。年初至今已累计下跌超90%。 背负65亿美元巨额债务 Wolfspeed在碳化硅衬底市场长期占据领先地位，但因自身激进扩张、行业竞争加剧，近年来陷入债务危机。 根据《华尔街日报》援引知情人士的报道，该公司正面临高达65亿美元的债务压力，其中包含一笔5.75亿美元、在2026年5月到期的期末整付可转债。而 截至3月底，其现金储备仅为13亿美元。 Wolfspeed的财务困境主要源于工业和汽车市场需求疲软、关税带来的不确定性，以及与主要客户（如瑞萨电子）之间的供应协议压力。 本月早些时候，该公司对其持续运营的能力表示了严重担忧，并发布了疲软的收入预期。 2025财年第三财季，公司营收同比下滑7%，仅为1.85亿美元，净亏损为28550万，且未提供第四财季的业绩指引。经调整后，公司每股亏损72美分，亏 损幅度较去年进一步扩大。 资料显示，Wolfspeed成立于1987年，是一家全球领先的碳化硅功率器件和宽禁带半导体技术公司，Wolfspeed最初是Cree公司旗 ...

插播： 天科合达、天岳先进、同光股份、烁科晶体、合盛新材料、三 安半导体、东尼电子、中电化合物、芯聚能、安海半导体、 凌锐半导体、 士兰微、 泰坦未来、恒普技术、华卓精科、快克芯装备、京航特碳、奥亿达半导 体及 成都炭材等 已确认参编《2025碳化硅衬底与外延 产 业 调 研 白 皮 书 》 及 《 2025 碳 化 硅 器 件 与 模 块 产 业 调 研 白 皮 》 ， 参 编 咨 询 请 联 系 许 若 冰 （hangjiashuo999）。 5月15日，行家说 第3届 "电动交通&数字能源SiC技术应用及供应链升级大会"成功在上海举办。 比亚迪、 吉利、 丰田、 上汽、 长安、 长城、 蔚来、 零 跑、 深蓝、 合众、 江铃汽车等车企，华为、 美的、 浪潮集团、 阿特斯光伏 等新能源 头部厂商，以及 三菱电机 、 意法半导体、 Wolfspeed、三安半导体、天科合达及瀚天天成 等 碳化硅产业链上下游企业， 合 计 超400位 精英代表相聚上 海。 本次会议上，围绕 "数字能源SiC技术应用研讨会"与"电动交通SiC技术应用研讨会"两大会议主题，三菱电机 （总冠名商） 、 意法半导体、Wolfspeed ...

插播： 倒计时1天！ 三 菱 电 机 、 意 法 半 导 体 、 Wolfspeed、三安半导体、天科合达、元山电子、大族半导体、香港大学、士兰微、长飞先进、宏 微科技、利普思、昕感科技、国扬电子、国基南方、芯长征、同光半导体、合盛新材料、瀚天天 成、芯研科、国瓷功能材料、季华恒一等 邀您参加上海"电动交通&数字能源SiC技术应用及供应 链升级大会"，点击文章底部 "阅读原文" 即可报名参会。 前不久，"行家说三代半"报道了 今年一季度 碳化硅 在 超充领域的应用情况（ 点击查看 ）。近期，我们发现又有多家企业集中发布应用碳化硅技术的新产品，与此同时，不少 超充站建设也开始采用碳化硅，这意味着： 图：英飞源、行家说三代半 值得注意的是，据英飞源测算， 以配置5台480kW充电桩的公共运营充电站点为例，如果都采用SiC 电源模块，充电效率可提高1.5%-2%，预计三年可累计节省电费约21.2万元。 华为数字能源： 兆瓦超充方案采用SiC技术 采用碳化硅的企业持续增加：华为数字能源、中建科工、宇视科技等大型企业积极采用碳化硅技 术。 超快充需求促使企业采用碳化硅技术：面对兆瓦级等超快充需求，诸多企业相继研发并推出 ...

插播： 倒计时3天！ 三菱电 本届盛会受到了产业链企业高度关注和支持，将 邀请众多SiC产业大咖， 聚焦8英寸SiC关键 量产技术，以及车规级SiC芯片与模块制造所面临的难题等核心维度，共同致力于助力SiC产业达成高质量 技术降本的目标， 探讨未来的机遇，并针对 SiC终端应用 的关键技术展开深入讨 论。 机、意法半导体、Wolfspeed、三安半导体、天科合达、元山电子、大族半导体、香港大学、 士兰微、长飞先进、宏微科技、利普思、昕感科技、国扬电子、国基南方、芯长征、合盛新材 料、瀚天天成、芯研科、国瓷功能材料、季华恒一等邀您参加上海 "电动交通&数字能源SiC技 术应用及供应链升级大会"，点击文章底部 "阅读原文" 即可报名参会。 5月15日，行家说将 在上海举 办 "电动交通&数字能源SiC技术应用及供应链升级大会" 。 往届盛况 本次上海碳化硅大会已经开启报名登记，扫描下方二维码即可报名，欢迎大家报名参会，联手众多产业大 咖共同促进新能源和SiC行业持续健康发展！ 会议距离正式召开 仅剩3天 ， 本次碳化硅会议到底有哪些亮点？"行家说三代半"给大家剧透一下。 亮点一： 名企荟萃，近20家SiC企业亮相 ...