Core Viewpoint - Shanghai Xinshi Technology Co., Ltd. has been accepted for IPO on the Shanghai Stock Exchange's Sci-Tech Innovation Board, aiming to raise 785 million yuan, positioning itself as a leading domestic enterprise in semiconductor-grade perfluoroether rubber sealing components [1][2]. Company Overview - Xinshi Technology focuses on the research and application innovation of perfluoroether rubber, having independently developed and achieved stable mass production of semiconductor-grade perfluoroether rubber sealing rings, breaking the monopoly of foreign companies in this field [1]. - The company provides a full range of perfluoroether rubber sealing rings and functional components for core process equipment in semiconductor manufacturing, meeting stringent vacuum sealing requirements across various models and process nodes [1]. Market Position - According to Frost & Sullivan, Xinshi Technology ranked third in the sales scale of semiconductor-grade perfluoroether rubber sealing rings in China for 2023 and 2024, and first among domestic companies, establishing itself as a top player in the high-end sealing ring market for semiconductor equipment [2]. Financial Performance - The company reported revenues of approximately 41.59 million yuan, 130 million yuan, and 208 million yuan for the years 2022, 2023, and 2024, respectively, with net profits of 1.73 million yuan, 36.39 million yuan, and 68.94 million yuan during the same periods [3]. - Financial data indicates total assets of 475.51 million yuan, equity attributable to shareholders of 417.61 million yuan, and a debt-to-asset ratio of 12.18% for the year ending December 31, 2024 [5]. Investment Plans - The funds raised from the IPO will be allocated to various projects based on their urgency, indicating a strategic approach to growth and development [3].

Market Overview - The main board led the gains with notable increases in stocks such as Hai Neng Da (+10.03%), Yuan Long Ya Tu (+10.02%), and Ji Da Zheng Yuan (+10.02%) [1] - The ChiNext board saw significant growth with Zheng Yuan Zhi Hui (+20.03%) and Cheng Tian Wei Ye (+20.00%) leading the charge [1] - The Sci-Tech Innovation board was also active, with Jin Cheng Zi (+20.01%) and Zhong Ke Fei Ce (+6.23%) showing strong performance [1] - Active sub-industries included SW Military Electronics III (+1.74%) and SW Semiconductor Equipment (+1.63%) [1] Domestic News - Ai Bang Semiconductor announced the large-scale production of modules equipped with self-developed silicon carbide chips, marking a complete self-sufficiency in the automotive power semiconductor field [1] - Ao Xin Semiconductor's FC-BGA high-end packaging IC substrate project has officially opened, with an annual production capacity of 36 million substrates and an expected annual output value exceeding 2 billion yuan [1] - Jing Tong Technology has introduced its first batch of 2.5D/3D advanced packaging equipment, which includes 11 high-precision devices from Japan, set to enhance production efficiency [1] - Jie Fa Technology has shipped over 300 million chips, achieving a self-research rate of 100% for analog IP and over 90% for digital IP, actively promoting the domestic production process [1] Company Announcements - Xi Di Wei reported a reduction in shares by a major shareholder, with Chongqing Wei Chun holding 9.23% of the total shares before the reduction [2] - Ge Bi Jia announced a cash dividend of 0.976630 yuan per 10 shares based on a total share capital of 144,630,000 shares [2] - Guo Zi Software declared a stock bonus of 4 shares for every 10 shares held, along with a cash dividend of 1.8 yuan per share [2] - Anshuo Information revealed a government subsidy expected to impact pre-tax profits by 6.42 million yuan, accounting for 42.55% of the latest audited net profit attributable to shareholders [2] Overseas News - Major global DRAM manufacturers are transitioning from DDR4 specifications to advanced process products, with Micron confirming plans to cease DDR4 shipments over the next 2-3 quarters [3] - Dongjin Semiconductor has signed a licensing agreement with Merck to implement its self-developed OLED materials [3] - Micron announced an expansion of its investment in the U.S. from $125 billion to $200 billion, including an additional $25 billion for memory manufacturing and $50 billion for R&D [3] - The price of server DDR5 products is expected to see slight increases in Q3, with potential price risks in Q4 as production capacity ramps up [3]

导读： 睿宝高端半导体设备真空检测仪器及传感器研发生产基地预计今年6月投用，总建筑面积约4.8万平方米，总投资额约5亿元，主要建设高端半导体设备真 空检测仪器及传感器研发生产基地。 特别提示 微信公众号机制调整，请点击顶部"仪器信息网" → 右上方"…" → 设为 ★ 星标，否则很可能无法看到我们的推送。 据成都高新消息，睿宝高端半导体设备真空检测仪器及传感器研发生产基地预计今年6月投用，成都未来科技城一大批总部基地建设项目正在 加快建设。 睿宝高端半导体设备真空检测仪器及传感器研发生产基地项目，总建筑面积约4 . 8万平方米，总投资额约5亿元，项目主要建设高 端半导体设备真空检测仪器及传感器研发生产基地。 宝科技产业 园效果图 该项目由五大区域构成，其中，1号楼和2号楼为研发楼AB区，3号楼为生产厂房，4号楼为工艺楼，5号楼为宿舍。产业园以生产真空检测仪 器、氦质谱检漏仪和真空规管等应用于半导体、新能源、航空航天等行业领域的产品为主。同时，将建设专业的国家级真空实验室及检测中 心，致力推动产业发展和科技创新。 睿 2 0 2 4年11月1 9日，睿宝科技产业园3号楼正式封顶。成都未来科技城2 0 2 5年1 ...

特别提示：本次股票发行拟在科创板市场上市，科创板公司具有研发投入大、经营风险高、业绩 不稳定、退市风险高等特点，投资者面临较大的市场风险。投资者应充分了解科创板市场的投资 风险及本公司所披露的风险因素，审慎作出投资决定。 绍兴中芯集成电路制造股份有限公司 Semiconductor Manufacturing Electronics（Shaoxing）Corporation （浙江省绍兴市越城区皋埠街道临江路 518 号） 首次公开发行股票并在科创板上市 招股说明书 （注册稿） 声明：本公司的发行申请尚需经上海证券交易所和中国证监会履行相应程序。本招股说明书不具 有据以发行股票的法律效力，仅供预先披露之用。投资者应当以正式公告的招股说明书作为投资 决定的依据。 保荐机构（主承销商） 上海市黄浦区广东路 689 号 联席主承销商 深圳市前海深港合作区南山街道桂湾 五路128号前海深港基金小镇B7栋401 福州市湖东路 268 号 绍兴中芯集成电路制造股份有限公司 招股说明书（注册稿） 声明 中国证监会、交易所对本次发行所作的任何决定或意见，均不表明其对发行 人注册申请文件及所披露信息的真实性、准确性、完整性作出 ...