Market Overview - The main board led the gains with notable increases in stocks such as Hai Neng Da (+10.03%), Yuan Long Ya Tu (+10.02%), and Ji Da Zheng Yuan (+10.02%) [1] - The ChiNext board saw significant growth with Zheng Yuan Zhi Hui (+20.03%) and Cheng Tian Wei Ye (+20.00%) leading the charge [1] - The Sci-Tech Innovation board was also active, with Jin Cheng Zi (+20.01%) and Zhong Ke Fei Ce (+6.23%) showing strong performance [1] - Active sub-industries included SW Military Electronics III (+1.74%) and SW Semiconductor Equipment (+1.63%) [1] Domestic News - Ai Bang Semiconductor announced the large-scale production of modules equipped with self-developed silicon carbide chips, marking a complete self-sufficiency in the automotive power semiconductor field [1] - Ao Xin Semiconductor's FC-BGA high-end packaging IC substrate project has officially opened, with an annual production capacity of 36 million substrates and an expected annual output value exceeding 2 billion yuan [1] - Jing Tong Technology has introduced its first batch of 2.5D/3D advanced packaging equipment, which includes 11 high-precision devices from Japan, set to enhance production efficiency [1] - Jie Fa Technology has shipped over 300 million chips, achieving a self-research rate of 100% for analog IP and over 90% for digital IP, actively promoting the domestic production process [1] Company Announcements - Xi Di Wei reported a reduction in shares by a major shareholder, with Chongqing Wei Chun holding 9.23% of the total shares before the reduction [2] - Ge Bi Jia announced a cash dividend of 0.976630 yuan per 10 shares based on a total share capital of 144,630,000 shares [2] - Guo Zi Software declared a stock bonus of 4 shares for every 10 shares held, along with a cash dividend of 1.8 yuan per share [2] - Anshuo Information revealed a government subsidy expected to impact pre-tax profits by 6.42 million yuan, accounting for 42.55% of the latest audited net profit attributable to shareholders [2] Overseas News - Major global DRAM manufacturers are transitioning from DDR4 specifications to advanced process products, with Micron confirming plans to cease DDR4 shipments over the next 2-3 quarters [3] - Dongjin Semiconductor has signed a licensing agreement with Merck to implement its self-developed OLED materials [3] - Micron announced an expansion of its investment in the U.S. from $125 billion to $200 billion, including an additional $25 billion for memory manufacturing and $50 billion for R&D [3] - The price of server DDR5 products is expected to see slight increases in Q3, with potential price risks in Q4 as production capacity ramps up [3]

插播： 英 诺 赛 科 、 能 华 半 导 体 、 致 能 半 导 体 、 京 东 方 华 灿 光 电 、 镓 奥 科 技 等 已 确 认 参 编 《 2024-2025 氮 化 镓 （ GaN ） 产 业 调 研 白 皮 书 》 ， 参 编 咨 询 请 联 系 许 若 冰 （hangjiashuo999）。 近日， 芯联动力 董事长、芯联资本创始合伙人袁锋 在"第19届中国投资年会·年度峰会"上发表了《 新时代的产业投资：从Capital到Connection" 》的主题演讲，在演讲中指出了目前 国产芯片陷入的" 车规级困局" ： ● 新能源汽车订单，并与上汽、小米、理想等车企深度绑定。 中国电动汽车年销量突破1100万辆，但核心主驱芯片国产化率 不 足 20% 宁德时代、汇川等本土Tier 1厂商快速崛起，但国产车规芯片仍难打入高端供应链。 袁锋直言："车企既要降本，又不敢用国产芯片，这是产业升级的致命矛盾。" 芯联集成以碳化硅主驱芯片为突破口，实现国产车规芯片的"订单爆满"：其碳化硅模块已锁定未来 5年 ； ● 数百万台 本文将分析芯联集成取得这一成绩的背后，详情请看： 国产EV和Tier 1的繁荣背后 ...