Core Viewpoint - The article highlights the revolutionary development of 3D integration and advanced packaging driven by semiconductor bonding technology, with a focus on low-temperature bonding and integration [1][5]. Group 1: Event Overview - The 2025 China International Low Temperature Bonding 3D Integration Technology Seminar (LTB-3D 2025) will be held for the first time in China, organized by Qinghe Crystal and IMSI, bringing together international experts to discuss cutting-edge wafer bonding technologies and their industrial applications [1][3][5]. - The seminar will take place from August 3 to 4, 2025, in Tianjin, China, and aims to provide a platform for international cooperation and exchange in semiconductor integration technology [3][5]. Group 2: Technical Focus - LTB-3D 2025 will focus on core technologies such as low-temperature bonding, heterogeneous integration, and advanced packaging, aiming to align China's semiconductor industry with international standards [3][5]. - The workshop will cover advanced research areas related to low-temperature bonding technologies, including surface activated bonding (SAB) and atomic diffusion bonding (ADB), which enable novel device structures through heterogeneous material integration [5]. Group 3: Registration and Participation - The event is open for topic submissions and registration for global industry professionals, with an early-bird registration fee structure outlined [7][8]. - The registration fees vary by category, with early-bird rates for regular participants at RMB 3000, members at RMB 2400, and students at RMB 2000 [7].

半导体键合技术正推动3D集成与先进封装的革命性发展！作为低温键合与键合集成领域的创新引领 者， 青禾晶元 携手日本先进微系统集成研究所（IMSI）等国际权威机构，共同主办 2025中国国际低温键 合3D集成技术研讨会（LTB-3D 2025） 。这一全球顶尖学术会议将首次登陆中国，汇聚诸多国际巨头及 全球专家，共探晶圆键合技术前沿与产业应用。 技术革新 · 国际视野 · 产业赋能 L TB-3D 2025将聚焦低温键合、异质集成、先进封装等核心技术，为中国半导体产业提供与国际接轨的交 流平台。青禾晶元诚邀学术界、产业界同仁共襄盛举，加速技术创新与产业链协作！ 会议时间：2025年8月3日-4日 会议地点：中国·天津 现面向全球行业人士开放议题征集通道，同时也邀请您注册报名参与此次盛会，详情见下方会议通知： 2025 中国国际低温键合 3D 集成技术研讨会 国际低温键合 3D 集成技术 (LTB-3D) 研讨会是由日本非营利协会-先进微系统集成协会(IMSI) 主办的重要会议，该会议在技术上由美国电化学学会和 IEEE EPS 日本分会共同指导。2025 年该研讨 会将首次在中国举行，这将促进国际半导体低温键合 ...