Core Viewpoint - The article highlights the revolutionary development of 3D integration and advanced packaging driven by semiconductor bonding technology, with a focus on low-temperature bonding and integration [1][5]. Group 1: Event Overview - The 2025 China International Low Temperature Bonding 3D Integration Technology Seminar (LTB-3D 2025) will be held for the first time in China, organized by Qinghe Crystal and IMSI, bringing together international experts to discuss cutting-edge wafer bonding technologies and their industrial applications [1][3][5]. - The seminar will take place from August 3 to 4, 2025, in Tianjin, China, and aims to provide a platform for international cooperation and exchange in semiconductor integration technology [3][5]. Group 2: Technical Focus - LTB-3D 2025 will focus on core technologies such as low-temperature bonding, heterogeneous integration, and advanced packaging, aiming to align China's semiconductor industry with international standards [3][5]. - The workshop will cover advanced research areas related to low-temperature bonding technologies, including surface activated bonding (SAB) and atomic diffusion bonding (ADB), which enable novel device structures through heterogeneous material integration [5]. Group 3: Registration and Participation - The event is open for topic submissions and registration for global industry professionals, with an early-bird registration fee structure outlined [7][8]. - The registration fees vary by category, with early-bird rates for regular participants at RMB 3000, members at RMB 2400, and students at RMB 2000 [7].

半导体键合技术正推动3D集成与先进封装的革命性发展！作为低温键合与键合集成领域的创新引领 者， 青禾晶元 携手日本先进微系统集成研究所（IMSI）等国际权威机构，共同主办 2025中国国际低温键 合3D集成技术研讨会（LTB-3D 2025） 。这一全球顶尖学术会议将首次登陆中国，汇聚诸多国际巨头及 全球专家，共探晶圆键合技术前沿与产业应用。 技术革新 · 国际视野 · 产业赋能 L TB-3D 2025将聚焦低温键合、异质集成、先进封装等核心技术，为中国半导体产业提供与国际接轨的交 流平台。青禾晶元诚邀学术界、产业界同仁共襄盛举，加速技术创新与产业链协作！ 会议时间：2025年8月3日-4日 会议地点：中国·天津 现面向全球行业人士开放议题征集通道，同时也邀请您注册报名参与此次盛会，详情见下方会议通知： 2025 中国国际低温键合 3D 集成技术研讨会 国际低温键合 3D 集成技术 (LTB-3D) 研讨会是由日本非营利协会-先进微系统集成协会(IMSI) 主办的重要会议，该会议在技术上由美国电化学学会和 IEEE EPS 日本分会共同指导。2025 年该研讨 会将首次在中国举行，这将促进国际半导体低温键合 ...

Core Viewpoint - The article emphasizes the critical importance of advanced bonding technology in the semiconductor industry, highlighting the need for domestic innovation in bonding equipment to enhance China's competitiveness in the global market [1]. Group 1: Industry Context - The semiconductor industry is facing increasing competition, making the development of domestic advanced bonding equipment a strategic necessity for China [1]. - Historically, high-end bonding equipment has relied on imports, which poses a significant risk to the domestic semiconductor sector [1]. Group 2: Company Innovations - Qinghe Crystal has developed a product matrix with four proprietary technologies: ultra-high vacuum room temperature bonding systems, hybrid bonding equipment, thermal compression bonding equipment, and a full range of bonding process services [1]. - These technologies are applied in cutting-edge fields such as advanced packaging, semiconductor device manufacturing, wafer-level heterogeneous material integration, and MEMS sensors [1]. Group 3: Upcoming Event - Qinghe Crystal will host a sharing session titled "Leading the Future of Bonding, Innovating New Industrial Patterns" at SEMICON China on March 26, 2025, in Shanghai [2][4]. - The event will focus on the latest trends in bonding technology, core advantages of self-innovated equipment, and opportunities for collaboration [4].