Core Insights - The launch of the first domestic chip ETF exceeding 50 billion yuan signifies strong market recognition of the investment value in the semiconductor sector, reflecting ongoing enthusiasm for core technology assets amid supportive policies and accelerated domestic substitution [1][3] Group 1: ETF Performance and Market Dynamics - The Jiashi Fund's Sci-Tech Chip ETF (588200) has reached a scale of 50.343 billion yuan, marking a new high since its listing and becoming the first chip ETF in China to surpass the 50 billion yuan threshold [1] - The ETF tracks the Shanghai Stock Exchange Sci-Tech Board Chip Index, covering high-quality companies across the semiconductor industry chain, including leaders like Zhongwei Company and Tuojing Technology, which helps capture overall industry growth while mitigating individual stock volatility [3] - Other chip ETFs, such as E Fund's Sci-Tech Chip ETF (589130) and Guolian An's Sci-Tech Chip Design ETF (588780), have also seen significant inflows, indicating a consensus on the long-term value of the chip industry [3] Group 2: Policy Support and Industry Growth - Continuous policy support is identified as a key driver for the explosive growth of chip ETFs, with the semiconductor industry policy support intensifying since the beginning of 2026, including the establishment of the third phase of the semiconductor fund with a total scale exceeding 350 billion yuan [4] - The Ministry of Industry and Information Technology has introduced special subsidy policies, allowing domestic wafer fabs to receive up to 15% subsidies for purchasing domestic semiconductor equipment, thereby accelerating the domestic substitution process [4] - Major domestic wafer fabs are actively expanding production, with significant investments announced, such as 7.6 billion USD by SMIC and 6.7 billion USD by Huahong Wuxi, which are expected to drive performance expectations for industry chain companies [4] Group 3: Domestic Substitution and Market Recovery - The acceleration of domestic substitution in the semiconductor industry and signs of cyclical recovery provide solid fundamental support for ETF growth, with the domestic semiconductor equipment localization rate rising from 25% in 2025 to 35% by early 2026 [5] - Key equipment replacement rates have exceeded 40%, and the proportion of domestic equipment in new wafer production lines has reached 55%, surpassing market expectations [5] - The semiconductor industry is showing clear signs of recovery, with DRAM contract prices increasing by over 50% and flash memory prices rising by over 30%, further driving equipment procurement by domestic manufacturers [5]

东 兴 晨 报 东兴晨报 P1 2026 年 1 月 28 日星期三 经济要闻 1. 国税局：2025 年税务部门全年征收各项税费 33.1 万亿元。其中，未扣 除出口退税的税收收入 17.8 万亿元，同比增长 2.7%。支持科技创新和制造 业发展的主要优惠政策减税降费退税超 2.8 万亿元，有力促进新质生产力和 实体经济发展。（资料来源：同花顺） 2. 国资委：1 月 28 日，国务院国资委企业改革局局长林庆苗在国新办新 闻发布会上透露，下一步国资委将聚焦国有资本"三个集中"，以重组整合为 抓手，扎实推进国有经济布局优化和结构调整，加快建设更多世界一流企业。 国有资本"三个集中"，首先是扎实做好新央企组建和战略性重组，更加突出 中央企业在战略安全、产业引领、国计民生、公共服务等领域的支撑作用， 更好把企业做强做优做大。其次，深入推进专业化整合，支持创新能力强的 企业作为主体，开展同类业务横向整合、产业链上下游纵向整合，减少行业 内卷。再次，支持中央企业开展高质量并购，获取核心要素、抢占技术先机， 加快培育发展战略性新兴产业和未来产业。（资料来源：同花顺） 3. 国家移民管理局：2025 年，全国移民管理机构 ...

Group 1: Non-Bank Financial Industry - The public fund performance benchmark has officially been implemented, with the preset interest rate research value decreasing by 1 basis point week-on-week [6][7] - The non-bank index fell by 1.5%, underperforming the CSI 300 by 0.9 percentage points, with both brokerage and insurance indices showing a synchronized decline of -0.6% and -4% respectively [6][7] - The average daily trading volume of stock funds decreased by 15.8% week-on-week to 34,429 billion yuan, while the margin financing balance slightly decreased by 0.3% to 2.72 trillion yuan [6] Group 2: TuoJing Technology (688072) - TuoJing Technology is a leading domestic semiconductor thin film deposition equipment company, with a significant revenue increase from 440 million yuan in 2020 to 4.1 billion yuan in 2024, reflecting a compound annual growth rate of 75% [11][12] - The company has established a dual-platform driven structure focusing on thin film deposition and advanced bonding equipment, with a strong market demand evidenced by an order backlog of approximately 9.4 billion yuan, a year-on-year increase of about 46% [11][12] - The global thin film deposition equipment market is projected to reach approximately 24.4 billion USD by 2025, with the domestic market estimated at around 10.2 billion USD, indicating substantial room for domestic substitution [12][13] Group 3: Food and Beverage Industry - The average price of raw milk has remained low, with a current price of 3.03 yuan per kilogram, reflecting a slight increase of 0.01 yuan week-on-week, while the industry is approaching a supply-demand turning point [16][17] - The restaurant sector is showing signs of recovery, with December 2025 retail sales of social consumer goods reaching 45,136 billion yuan, a year-on-year increase of 0.9%, and restaurant income growing by 2.2% year-on-year [16][17] - The food and beverage sector saw a decline of 1.41%, underperforming the CSI 300 index by 0.79 percentage points, with snack foods performing well, increasing by 6.12% [18][19]

Core Viewpoint - Advanced packaging is emerging as a new engine for computing power in the "post-Moore's Law" era, addressing the limitations of traditional chip performance improvements through innovative bonding technologies [4][5]. Group 1: Hybrid Bonding Overview - Hybrid bonding is an advanced packaging technology that combines dielectric bonding and metal interconnects, allowing for high-density, high-performance 3D integration [8][19]. - The development of hybrid bonding has evolved through various stages, from wire bonding to flip chip, and now to hybrid bonding, which enables ultra-fine pitch stacking and packaging [10][11]. - Hybrid bonding can be categorized into wafer-to-wafer (W2W) and chip-to-wafer (C2W) processes, with C2W offering higher flexibility and lower defect rates for smaller chips [14][16]. Group 2: Advantages and Challenges of Hybrid Bonding - The technology allows for extreme interconnect density and performance breakthroughs, achieving interconnect pitches below 1 μm, significantly enhancing data transfer bandwidth [23]. - Hybrid bonding is compatible with existing wafer-level manufacturing processes and can be integrated with TSV and micro-bump technologies, providing cost optimization potential [24]. - Challenges include yield issues, surface smoothness requirements, cleanliness standards, and complex testing processes that need to be addressed for successful mass production [26]. Group 3: Market Demand and Future Prospects - Major HBM manufacturers, including Samsung, Micron, and SK Hynix, have committed to adopting hybrid bonding technology for HBM5, which aims to meet the extreme demands of AI and high-performance computing [28]. - TSMC's SolC technology, which utilizes hybrid bonding, is expected to double its production by 2026, highlighting the growing adoption of this technology [29][30]. - The global market for hybrid bonding equipment is projected to exceed $600 million by 2030, with significant growth anticipated in the Asia-Pacific region [37]. Group 4: Competitive Landscape - The hybrid bonding equipment market is dominated by international players such as BESI, EV Group, and SUSS MicroTec, with BESI holding a market share of 67% in 2023 [44]. - The competitive landscape is evolving, with Chinese companies like Piotech entering the market, indicating advancements in domestic semiconductor equipment capabilities [42].

3. 海关：1 月 26 日，海关总署署长孙梅君在署会见哈萨克斯坦总统办公 厅副主任扎纳索娃。双方就落实中哈两国元首战略共识，加强智慧海关合作、 跨境贸易便利化、检验检疫、口岸保通保畅等议题交换意见，达成积极意向。 （资料来源：同花顺） 4. 人力资源保障部：我国将制定《新就业形态劳动者基本权益保障办法》， 进一步明确新就业形态劳动基准和企业劳动保护责任；出台《超龄劳动者基 本权益保障暂行规定》；推动修订《职工带薪年休假条例》，促进用人单位落 实职工带薪年休假制度。（资料来源：同花顺） 5. 香港：香港和上海签订合作协议，成立香港贵金属中央结算系统有限公 司(港金结算公司)。担任主席的财经事务及库务局局长许正宇表示，有逾 10 间本地及海内外银行参与，短期内会召开董事会。为配合黄金市场发展，当 局已将商品交易人才纳入人才清单，相关海外专业人士可透过加分制度申请 来港，同时鼓励企业透过旧人带新人及专业培训，以支持市场长远发展。（资 料来源：同花顺） 6. 财政部：为整治政府采购领域"内卷式"竞争，形成优质优价、良性竞 争的市场秩序，日前，财政部印发《关于推动解决政府采购异常低价问题的 通知》（以下简称"通知"） ...

Investment Rating - The report initiates coverage with a "Buy" rating for the company [6][7]. Core Insights - The company is a leading domestic semiconductor thin film deposition equipment manufacturer, demonstrating rapid revenue growth that confirms its industry-leading position. The company has established a dual-platform driven structure centered on thin film deposition equipment and advanced bonding and supporting measurement equipment. From 2020 to 2024, revenue is projected to grow from 440 million to 4.1 billion yuan, with a compound annual growth rate (CAGR) of 75% [6][7]. - The company is well-positioned to capitalize on the trends of advanced processes and three-dimensional integration, with its thin film deposition business continuing to grow significantly. The global thin film deposition equipment market is expected to reach approximately $24.4 billion by 2025, with the domestic market estimated at around $10.2 billion, indicating substantial room for domestic substitution [6][7]. - The company is strategically expanding into advanced bonding and supporting measurement equipment, which is crucial for achieving high-density, high-performance, and low-power chips, particularly driven by AI applications. The advanced packaging market is projected to grow from $4.3 billion in 2023 to $28 billion by 2029, with a CAGR of about 37% [6][7]. Summary by Sections 1. Company Overview - The company has focused on high-end semiconductor equipment since its establishment in 2010, developing a comprehensive product matrix in thin film deposition and three-dimensional integration equipment [13][15]. - The company has a balanced shareholding structure without a controlling shareholder, with the largest shareholder holding 19.57% [18][21]. 2. Market Opportunities - Thin film deposition is a core process in integrated circuit manufacturing, essential for constructing multi-layer circuit structures and enhancing device performance. The company’s products cover a wide range of applications in logic and memory chip manufacturing [45][46]. - The company’s thin film deposition equipment has shown excellent stability in client production lines, with an average uptime exceeding 90%, matching international standards [6][7]. 3. Financial Performance - The company’s revenue has maintained a high growth trajectory, with a CAGR of 75.19% from 2020 to 2024. In the first three quarters of 2025, revenue reached 4.22 billion yuan, a year-on-year increase of 85.27% [23][27]. - The company’s net profit has been on a continuous rise since turning profitable in 2021, with a net profit of 557 million yuan in the first three quarters of 2025, reflecting a significant year-on-year growth of 105.14% [27][30]. 4. Future Growth Potential - The company has a robust order backlog, with approximately 9.4 billion yuan in orders as of 2024, representing a year-on-year increase of about 46%. This strong demand underlines the company’s market position and customer recognition [27][41]. - The company is continuously optimizing its cost structure, enhancing operational and R&D efficiency, which is expected to improve profit margins as new products enter mass production [27][30].

Investment Rating - The report initiates coverage with a "Buy" rating for the company [6][7]. Core Insights - The company is a leading domestic semiconductor thin film deposition equipment manufacturer, demonstrating rapid revenue growth that confirms its industry-leading position. The revenue is projected to grow from 440 million yuan in 2020 to 4.1 billion yuan in 2024, with a compound annual growth rate (CAGR) of 75% [6][7]. - The company has established a dual-platform strategy focusing on thin film deposition equipment and advanced bonding and supporting measurement equipment, which enhances its technological capabilities and market position [6][7]. - The global thin film deposition equipment market is expected to reach approximately $24.4 billion by 2025, with the domestic market estimated at around $10.2 billion, indicating significant room for domestic substitution as the current localization rate is below 20% [6][7]. Summary by Sections 1. Company Overview - The company has been focusing on high-end semiconductor equipment since its establishment in 2010, developing a comprehensive product matrix that includes PECVD, ALD, SACVD, HDPCVD, and Flowable CVD technologies [13][15]. - The company has successfully launched its first wafer-to-wafer (W2W) hybrid bonding equipment, expanding its product offerings in the three-dimensional integration equipment sector [13][15]. 2. Market Opportunities - The thin film deposition process is critical in semiconductor manufacturing, responsible for constructing multi-layer circuit structures and enhancing device performance [45]. - The advanced packaging market is projected to grow from $4.3 billion in 2023 to $28 billion by 2029, with a CAGR of approximately 37%, highlighting the increasing demand for hybrid bonding equipment [6][7]. 3. Financial Performance - The company’s revenue is expected to reach 6.38 billion yuan in 2025, with a year-on-year growth rate of 55.52%, and net profit is projected to be 1.04 billion yuan, reflecting a growth rate of 51.32% [8][7]. - The company has a robust order backlog of approximately 9.4 billion yuan as of the end of 2024, indicating strong market demand and customer recognition [6][7]. 4. Product Development and R&D - The company has invested significantly in R&D, with a total of 1,783 patent applications filed, of which 581 have been granted, demonstrating its commitment to innovation [33][27]. - The company’s thin film deposition equipment has achieved a stable operational uptime of over 90%, matching international standards, which enhances its competitive edge [6][7]. 5. Management and Corporate Structure - The company has a balanced shareholding structure with no controlling shareholder, which promotes efficient and collaborative operations [18][21]. - The management team possesses extensive industry experience and a strong technical background, supporting the company’s ongoing innovation and business expansion [21][22].

Group 1 - The hybrid bonding industry is entering a high-speed implementation phase, with equipment demand expected to grow several times before 2030, marking this technology as a key driver for the next generation of computing power [1][3] - Hybrid bonding technology is a critical enabling technology for breaking through computing power bottlenecks in the post-Moore era, driven by explosive growth in AI, high-performance computing (HPC), and high-bandwidth memory (HBM) [1][3] - The current market is dominated by overseas leaders, but there are clear opportunities for domestic alternatives [1] Group 2 - Hybrid bonding offers extreme interconnect density and performance breakthroughs, process compatibility, cost optimization potential, and flexibility in three-dimensional integration and heterogeneous design [2] - However, challenges such as defect control, alignment precision, thermal management, wafer warping, material compatibility, and process throughput must be addressed for successful mass production [2] Group 3 - The demand for hybrid bonding technology is transitioning from an advanced option to a core infrastructure in the AI era, with significant applications in storage and logic integration [3] - Major manufacturers like TSMC are expanding production in advance, with HBM4/5 and high-end AI chips expected to be the first to scale, indicating a robust growth trajectory for related equipment [3] Group 4 - The hybrid bonding equipment market is characterized by a clear pattern of "overseas dominance and domestic breakthroughs," with Dutch company BESI holding about 70% of the global market share [4] - Chinese equipment manufacturers are accelerating their catch-up efforts, with companies like Tuojing Technology launching mass production-level hybrid bonding equipment and receiving repeat orders [4] - Domestic equipment is rapidly entering the key tracks of 3D integration and advanced packaging, with market share expected to continue increasing due to rising precision and stability [4] Group 5 - BESI is the absolute leader in the global hybrid bonding equipment market, establishing a core position in high-performance computing with a complete range of equipment from traditional packaging to cutting-edge 2.5D/3D integration [5] - Its flagship product, Datacon 8800 CHAMEO ultra plus AC, achieves 100nm alignment precision and a throughput of 2000 CPH, indicating a shift from laboratory to mass production [5] - BESI's advanced packaging business demonstrates strong technical premium capabilities with a gross margin exceeding 65%, reflecting a successful transition to an AI-driven growth model [5]

Investment Rating - The report suggests a positive investment outlook for the hybrid bonding technology, highlighting its critical role in the AI era and advanced packaging market [7]. Core Insights - Hybrid bonding is identified as a key enabling technology for overcoming performance bottlenecks in the post-Moore era, driven by explosive demand in AI and high-performance computing (HPC) [7]. - The market for hybrid bonding equipment is expected to experience significant growth, with demand projected to increase several times by 2030, particularly in high-performance computing and memory applications [5][44]. - The report emphasizes the competitive landscape, noting that while overseas companies like BESI dominate the market, domestic players in China are making significant strides [5][57]. Summary by Sections Hybrid Bonding Overview - Hybrid bonding is an advanced packaging technology that combines dielectric bonding and metal interconnects, allowing for high-density, high-performance 3D integration [14][28]. - The technology enables interconnect distances below 10μm, significantly enhancing data transmission bandwidth compared to traditional methods [29]. Market Demand and Growth - The demand for hybrid bonding technology is transitioning from an advanced option to a core infrastructure in the AI era, with major manufacturers like TSMC and Samsung adopting it for next-generation products [5][33]. - The global hybrid bonding equipment market is projected to exceed $600 million by 2030, with the Chinese market expected to surpass $400 million [48]. Key Players and Competitive Landscape - BESI holds a dominant position in the hybrid bonding equipment market, with a market share of approximately 67% in 2023, and is expected to maintain around 70% in 2024 [57]. - Domestic companies such as Tuojing Technology and Baiao Chemical are rapidly advancing, with Tuojing Technology launching its first mass-production hybrid bonding equipment [5][57]. Applications and Future Trends - Hybrid bonding is primarily applied in 3D NAND and is expanding into high-performance computing scenarios, including HBM4 and HBM5 technologies [25][44]. - The report indicates that the technology is becoming essential for various applications, including AI chips and advanced memory solutions, with significant investments being made in new packaging facilities globally [43][44].

Group 1 - The semiconductor equipment market is experiencing significant growth driven by the demand for AI-related investments, particularly in advanced logic circuits, memory, and packaging technologies [2][3] - The global semiconductor equipment sales are projected to reach a record $133 billion in 2025, with a year-on-year growth of 13.7%, and expected to continue rising to $145 billion in 2026 and $156 billion in 2027 [2] - The wafer fabrication equipment (WFE) sector is anticipated to achieve a sales record of $104 billion in 2024, with an 11% increase to $115.7 billion in 2025, reflecting higher-than-expected investments in DRAM and HBM [2] Group 2 - Major global memory manufacturers are expanding production and upgrading technology, which is a key driver for semiconductor equipment demand [3][4] - Samsung and SK Hynix are accelerating memory capacity expansion, with Samsung focusing on high-end products and SK Hynix preparing to complete a new factory by 2027 [4] - By 2026, South Korea is expected to reclaim the second position in global chip equipment spending, reaching approximately $29.66 billion, a 27.2% increase from 2025 [4] Group 3 - The evolution of storage chips, particularly 3D NAND and DRAM, is driving demand for etching and deposition equipment, with significant increases in the number of layers and complexity of structures [5][6] - The demand for etching equipment is expected to rise sharply as 3D NAND layers increase from 32 to 128, with etching equipment usage rising from 34.9% to 48.4% [10] - The global spending on storage-related equipment is projected to reach $136 billion between 2026 and 2028, with over 40% attributed to 3D NAND investments [11] Group 4 - The demand for deposition equipment is also surging, with the need for more steps in the deposition process as the number of 3D NAND layers increases [11] - Advanced technologies such as atomic layer deposition (ALD) are becoming more critical, with ALD equipment's share in capital expenditures rising from 18% in the 2D era to 26% in the 3D era [11] - HBM technology is increasing the demand for lithography and hybrid bonding equipment due to the need for high-density interconnections and precision [12] Group 5 - Domestic companies are making significant progress in the production of core semiconductor equipment, including etching, deposition, and hybrid bonding devices [14][15] - Companies like Zhongwei, Northern Huachuang, and Yitang Semiconductor are leading in etching equipment, while Northern Huachuang and TuoJing Technology are notable in deposition equipment [14][15] - The hybrid bonding sector is also seeing advancements, with companies like Qinghe Crystal and TuoJing Technology developing innovative bonding solutions for various applications [16][17]