Core Viewpoint - The article highlights the significant advancements made by domestic semiconductor equipment manufacturers, particularly in the field of thin film deposition equipment, which has reached international leading levels, while acknowledging the existing gap in lithography technology compared to global leaders like ASML [1][4]. Group 1: Breakthrough Direction and Market Dynamics - In 2010, the domestic semiconductor equipment market was dominated by international giants, with over 90% market share, prompting companies like拓荆科技 to focus on PECVD equipment as a breakthrough point due to its large market scale [3][4]. - The push for domestic substitution policies has led to unprecedented support for local semiconductor equipment suppliers, with expectations for domestic wafer production capacity to double by 2027 [4][5]. - The ongoing geopolitical tensions have accelerated the push for domestic semiconductor equipment localization, benefiting the equipment sector in the medium to long term [5][6]. Group 2: Technological Advancements and Milestones - In 2011,拓荆科技 produced its first 12-inch PECVD equipment, marking a significant milestone in China's semiconductor equipment development [6][8]. - By 2015, the PF-300T PECVD equipment had achieved over 10,000 wafers processed at中芯国际, validating the reliability of domestic equipment for large-scale production [8][9]. - The company has successfully developed a comprehensive technology system covering PECVD, ALD, and SACVD, with a strong focus on R&D, resulting in over 1,200 patents filed [12][13]. Group 3: Industry Ecosystem and Collaboration - The collaboration between various entities, including national research institutions and leading semiconductor manufacturers, has been crucial for the success of domestic equipment suppliers like拓荆科技 [27][28]. - The domestic semiconductor equipment industry has seen a significant increase in localization rates, projected to reach 50% by 2025-2026, compared to less than 5% in 2010 [28][29]. - The competitive landscape among domestic manufacturers is robust, with companies like北方华创 and中微公司 also making strides in different technology routes [29][30]. Group 4: Market Trends and Future Outlook - The global semiconductor equipment market is expected to grow significantly, with the thin film deposition equipment market projected to reach $34 billion by 2025, driven by advancements in storage chips and packaging technologies [30][31]. - The rise of three-dimensional integration technologies is anticipated to create new revenue streams for companies like拓荆科技, with a projected market size of nearly 30 billion yuan in the next five years [31].

公众号记得加星标⭐️，第一时间看推送不会错过。 在半导体先进封装技术加速迭代的背景下，国产 D2W 混合键合设备首次被 Yole Group 报告收录。 Yole 报告收录，亿级市场空间 混合键合技术是从焊料凸块转向铜 - 铜直接键合的先进互连工艺，通过无凸点键合实现纳米级 精度互联，解决传统微凸点技术在高密度封装中的瓶颈问题。 根 据 Yole 公 开 数 据 显 示 ， 2020 全 球 混 合 键 合 设 备 市 场 规 模 达 3.2 亿 美 元 ， 预 计 2027 年 CoW(D2W)/WoW(W2W)市场规模将分别攀升至 2.3亿/5.1亿 美元，CAGR高达 69%/16% ，凸显该 领域强劲增长潜力。 随着 AI 算力需求爆发对高密度封装的需求增加，混合键合在 HBM、3D IC 等高端封 装场景的渗透率持续提升。以HBM市场应用为例，据国泰证券引用Yole 数据，2028 年混合 键合在HBM 市场渗透率将 从 2025 年的 1% 跃升至 36% 。 图源：Yo l e ,国泰证券 国际巨头混合键合领域布局： 图源：Yole《High-End Pe rformance Packaging ...

Core Viewpoint - The emergence of Tuojing Technology marks a significant step towards domestic production in the high-end semiconductor manufacturing sector, particularly in the film deposition equipment market, which has been dominated by international giants [2]. Group 1: Market Overview - The film deposition equipment sector accounts for over 20% of the wafer manufacturing equipment market, with Tuojing Technology capturing approximately 12% of the market share, translating to a revenue of 4.1 billion yuan in a market projected to reach 9.7 billion USD in 2024 [2]. - Tuojing Technology focuses on PECVD, ALD, and Gap Fill technologies, supporting over 100 types of medium film materials required for logic and memory chips [2]. Group 2: Technological Advancements - Chinese companies, represented by Tuojing Technology, are rapidly catching up in terms of process coverage and production equipment performance, achieving levels comparable to international counterparts [3]. - Tuojing Technology has undertaken 11 national major projects and has filed 1,640 patents, with 507 granted, showcasing its commitment to innovation and technology breakthroughs in the semiconductor film deposition field [3]. Group 3: Future Prospects - The company is preparing for future product generations, with 70% of its products being new or advanced process technologies, indicating a strong focus on innovation [4]. - The demand for semiconductor equipment in the three-dimensional integration field is expected to drive Tuojing Technology's growth, with existing orders for wafer-to-wafer hybrid bonding equipment and successful industrial applications of developed detection equipment [3].

Core Viewpoint -拓荆科技 is a leading enterprise in the domestic semiconductor thin film deposition equipment and hybrid bonding equipment market, focusing on advanced technologies and products to meet the growing demands of the semiconductor industry driven by AI and emerging sectors [1][2][3] Financial Performance - In Q1 2025, the company reported revenue of 709 million yuan, a year-on-year increase of 50.22%, but a net loss of 147 million yuan, with a basic earnings per share of -0.53 yuan [1] - The decline in gross margin is attributed to the high cost of new products and processes, which accounted for nearly 70% of the revenue during the quarter [2] Product Development and Market Position - The company is focusing on thin film deposition equipment and advanced bonding equipment for 3D integration, continuously expanding its product offerings to meet industry trends and customer demands [3][4] - The company has successfully developed and delivered several new products, including low dielectric constant SiCO film process equipment and Thermal-ALD devices, which have passed customer verification and are now in industrial application [4] Industry Outlook - The semiconductor industry is expected to grow significantly, with global sales projected to increase by 19% to reach 628 billion USD in 2024, and continue to maintain double-digit growth in 2025, potentially exceeding 1 trillion USD by 2030 [2] - The demand for semiconductor equipment is rising due to advancements in AI applications and the increasing performance requirements for semiconductor devices [3] Strategic Initiatives - The company is committed to deepening its core business and advancing technology products in cutting-edge fields, with plans for new R&D and industrialization bases to support future growth [4][5]

作为国产薄膜沉积设备龙头，拓荆科技(688072)受益于国内下游晶圆制造厂对国内半导体设备的需求增 加，营业收入维持高增长趋势。在5月27日2025年第一季度业绩说明会上，公司高管表示，目前公司在 手订单充足，今年整体经营性趋势非常健康，并将拓展海外市场。 据介绍，拓荆科技通过在薄膜沉积设备及三维集成领域的先进键合设备及配套的量检测设备的技术积累 和快速发展，拓荆科技较国内竞争对手形成显著先发优势，已经成为国内半导体设备行业的领军企业。 其中，在应用于三维集成领域的先进键合设备及配套量检测设备方面，去年公司实现产品销售收入 9566.85万元，同比增长48.78%，应用于晶圆对晶圆混合键合设备、芯片对晶圆键合前表面预处理设备 获得重复订单并扩大产业化应用，新推出的键合套准精度量测设备及键合强度检测设备通过客户验证。 去年拓荆科技研发投入就达到7.56亿元；今年一季度，拓荆科技研发投入合计1.57亿元，在营业收入占 比达到22.38%，占比在国内半导体设备上市公司中居前。 2024年，公司自主研发并推出了10余款新产品/新工艺设备，包括Flowable CVD(流动性化学气相沉 积)、PECVD Bianca、 ...

封装技术最早是以双列直插封装DIP为主的直插型封装。到了20世纪80年代，顺应电子设备系统小型化 和集成电路薄型化的要求，封装技术迎来第一次重大变革，从通孔插装进入到表面贴装时代，衍生出了 SOP（Small Out-line Pacakage，小外形封装）、LCC（Leadless Chip Carrier，无引脚芯片载体）以及 QFP（Quad Flat Package，扁平方形封装）等。20世纪90年代前中期，封装技术发生第二次重大变革， 以BGA（Ball Grid Array Package，球栅阵列封装）为代表的先进封装技术开始涌现，封装朝着高引脚 数量、高集成的方向迈进。20世纪90年代中期至2000年后，随着封装尺寸进一步缩小以及工作频率增 加，CSP（Chip-Scale Package，芯片级封装）、WLP（Wafer-Level Package，晶圆级封装）、SIP （System In a Package，系统级封装）、2.5D/3D封装等开始出现，由此半导体封装正式进入先进封装时 代。 传统封装主要是用引线框架承载芯片的封装形式，而先进封装引脚以面阵列引出，承载芯片大都采用高 性能多 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：本文编译自tomshardware，谢谢。 三星在韩国首尔举行的人工智能半导体论坛上透露，该公司计划在其HBM4中采用混合键合技术， 以降低发热量并实现超宽内存接口。相比之下，据EBN报道，该公司的竞争对手SK海力士可能会 推迟采用混合键合技术。 高带宽存储器 (HBM) 将多个存储设备堆叠在一个基片上。目前，HBM 堆栈中的存储芯片通常使 用微凸块（用于在堆叠芯片之间传输数据、电源和控制信号）连接在一起，并使用诸如模压底部填 充 (MR-MUF) 或非导电薄膜热压 (TC-NCF) 等技术进行键合。 这些芯片也通过嵌入每个芯片内部的硅通孔 (TSV) 进行垂直互连（通过每个 DRAM 芯片传输数 据、时钟、控制信号、电源和地线）。然而，随着 HBM 速度的提升和 DRAM 设备数量的增加， 微凸块会变得效率低下，因为它们会限制性能和功率效率。 这正是混合键合发挥作用的地方。混合键合是一种 3D 集成技术，通过键合铜与铜以及氧化物与氧 化物表面直接连接芯片，无需使用微凸块。混合键合支持小于 10 µm 的互连间距，与传统的基于 凸块的堆叠相比，可提供更低的电阻和 ...

事件: 拓荆科技4 月30 日公告2025 年一季报：2025Q1 实现收入7.09 亿元，同比增长50.22%；实现归母净利 润-1.47 亿元，上年同期为0.10 亿元；实现扣非归母净利润-1.80 亿元，上年同期为-0.44 亿元。 2024 年公司期间费用率为32.19%，同比减少2.15pct，其中销售费用为2.90 亿元，同比增长64.40%；管 理费用为2.10 亿元，同比增长11.25%；研发费用为7.56 亿元，同比增长31.26%；财务费用为0.65 亿 元，上年同期为-0.12 亿元。 薄膜沉积设备品类持续丰富，混合键合设备加速发展。1）产品进展方面，PECVD 系列产品是公司核 心产品，持续保持竞争优势；ALDSiCO、SiN、AlN 等工艺设备获得重复订单并已实现出货，持续扩大 量产规模；HDPCVD 系列产品自通过客户端验证后，逐步放量；SACVD 系列产品持续拓展应用领域， 量产规模不断扩大；FlowableCVD 系列产品取得突破性进展，2024 年实现首台产业化应用且复购设备 再次通过验证；晶圆对晶圆混合键合设备、芯片对晶圆键合前表面预处理设备获得重复订单并扩大产业 化应用， ...

拓荆科技(688072)4月30日披露2025年第一季度报告，报告期内，公司实现营业收入7.09亿元，同比增长 50.22%；实现净利润-1.47亿元；基本每股收益-0.53元。 拓荆科技是国内量产型PECVD(等离子体增强化学气相沉积)、ALD(原子层沉积)、SACVD(次常压化学 气相沉积)、HDPCVD(高密度等离子体增强化学气相沉积)、超高深宽比沟槽填充CVD等薄膜沉积设备 和混合键合设备的领军企业。 拓荆科技始终将自主创新视为发展的核心驱动，并持续进行高强度的研发投入，保持核心竞争优势。 2025年第一季度，公司研发投入1.59亿元，占营业收入的比例为22.38%。公司2022年至2024年研发投入 合计达到17.11亿元，占同期营业收入总额的20.09%。 在薄膜沉积设备方面，公司围绕先进存储芯片、先进逻辑芯片等制造领域的需求，持续推进多种型号高 产能、高性能薄膜设备的研发与产业化应用，并取得突破性进展，逐步进入规模量产阶段；在三维集成 领域设备方面，公司积极推进新一代先进键合产品及配套量检测产品的出货/验证，致力于为三维集成 领域提供全面的技术解决方案。 另外，公司2025年第一季度经营活动产生 ...

多种薄膜新工艺设备实现批量出货，关键材料持续突破。 公司拓展了芯片沟槽填充用Flowable CVD设 备，多台通过客户验证；基于新平台、新反应腔的PECVD Stack（ONO叠层）、ACHM等先进工艺设备 实现了大批量出货，通过客户验证；ALD SiCO、SiN、AlN等工艺设备实现大批量出货。目前公司推出 的PECVD、ALD、SACVD、HDPCVD及Flowable CVD薄膜设备可以支撑全部介质薄膜材料的约100多 种工艺应用。 点击招商研究小程序查看PDF报告原文 拓荆科技发布2024年报，24Q4利润快速释放，在手订单同比高增长。公司多种薄膜新工艺设备实现批 量出货，3D IC领域混合键合设备获得重复订单。 24Q4利润快速释放，在手订单同比高增长。 1）2024全年： 公司收入41亿元，同比+51.7%；归母净利 润6.88亿元，同比+3.86%；扣非净利润3.56亿元，同比+14.1%；截至2024年底，公司在手订单约94亿 元，同比+46.3%； 2）24Q4： 公司收入18.26亿元，同比+82%/环比+81%；毛利率39.3%，同 比-12.8pcts/环比持平，同比承压主要系新品或 ...