Core Viewpoint - The article discusses the evolution of semiconductor processes, highlighting the dual-track competition between advanced and mature processes, and the implications for global technology competition and opportunities for China [2][3]. Group 1: Price and Technology Insights - The price of chips decreases as the process size decreases, with 3nm chips priced around $20,000 per piece, expected to rise to over $30,000 for 2nm chips by 2026 [5][6]. - The price differences are driven by two main factors: the scarcity of production capacity and the complexity of technology, with advanced processes requiring significantly more steps and equipment [6][11]. - Major tech companies are adopting different strategies: Apple is taking a cautious approach, Nvidia focuses on cost-performance balance, while Qualcomm and MediaTek are aggressively pursuing next-generation processes [7][8]. Group 2: TSMC's Dominance - TSMC plays a crucial role in defining industry trends, with 3nm chips expected to account for nearly 30% of its revenue, and plans to ramp up production significantly in the coming years [9][10]. - The investment required for advanced production lines is substantial, with a 2nm line costing around $10 billion, reflecting the increasing number of necessary equipment [10][11]. Group 3: Technical Challenges - Key technical challenges in semiconductor processes include advancements in lithography, architectural transitions, and design-technology co-optimization (DTCO) [12][13]. - EUV lithography is currently the main technology, with High-NA technology not yet ready for widespread use due to maturity and cost issues [14][15]. - The transition from FinFET to GAA architecture is increasing the demand for ALD equipment, which is critical for the new structures [16]. Group 4: Global Competition Landscape - TSMC leads the semiconductor process competition, while Samsung and Intel face significant challenges, including equipment procurement strategies and financial losses [18][21]. - Samsung's aggressive early procurement of EUV equipment led to higher costs due to lower yield rates, while TSMC's cautious approach has proven more effective [20]. - Intel's financial struggles are impacting its ability to compete in advanced processes, raising concerns about its future in the foundry business [21]. Group 5: Opportunities and Challenges for China - China's semiconductor industry is focusing on mature processes (28nm and above), with companies like SMIC making significant progress in yield rates and production capacity [24][25]. - Despite advancements, challenges remain, including higher production costs and competition from TSMC, which has superior technology and customer quality [25]. - Long-term opportunities exist in the growing demand for automotive electronics and IoT, supported by government initiatives and investments [26]. Group 6: Future Directions - The semiconductor industry is expected to continue evolving beyond 2nm, with innovations like backside power delivery and CFET technology anticipated in the coming years [27]. - The industry is committed to gradual breakthroughs, focusing on both mature and advanced processes to strengthen its competitive position globally [28]. Conclusion - The competition in semiconductor technology is a comprehensive battle involving technical, capital, and market dynamics, with TSMC and China’s semiconductor industry navigating their respective paths [29].

Group 1 - The article discusses the evolution of semiconductor processes, highlighting the dual-track competition between advanced and mature processes, with significant implications for global technology competition [2][3]. - The price of chips generally increases as the process node decreases, with current 3nm chips priced around 20,000 yuan per piece, expected to rise to over 30,000 yuan for 2nm chips by 2026 [5][6]. - Different companies adopt varied strategies regarding process technology, with Apple focusing on a gradual transition, Nvidia prioritizing cost-performance balance, and Qualcomm and MediaTek actively pursuing next-generation processes [7][8]. Group 2 - TSMC plays a crucial role in defining industry trends, with projected 3nm chip production reaching 200,000 pieces next year and 2nm production lines entering risk production soon [9][10]. - The investment required for advanced production lines is substantial, with a 2nm line costing around $10 billion, significantly higher than previous nodes [11]. - Key technological challenges include advancements in lithography, architecture transitions, and design-technology co-optimization (DTCO), which are essential for the successful implementation of advanced processes [12][13]. Group 3 - The global semiconductor landscape shows TSMC leading, while Samsung and Intel face distinct challenges, such as Samsung's aggressive equipment procurement strategy leading to higher costs and Intel's financial struggles impacting its advanced process ambitions [18][21]. - The equipment market is competitive, particularly in the etching sector, where Lam Research and Tokyo Electron dominate, with Tokyo Electron having a unique advantage with its clean track equipment [22][23]. Group 4 - The competition in semiconductors is characterized by a dual-track system, with advanced processes led by TSMC and Samsung, while mature processes (28nm and above) present opportunities and challenges for Chinese manufacturers [24][25]. - Chinese companies like SMIC have made significant progress in mature processes, achieving a 95% yield in 28nm technology, but still face challenges such as higher production costs and reliance on foreign equipment [25][26]. - The future of semiconductor technology is expected to continue evolving, with advancements below 2nm anticipated, driven by innovations in materials and processes [27][28].