Core Insights - Glass has evolved from a simple carrier to a complete material platform for advanced packaging, aligning with trends such as chip integration, panelization, vertical integration, and hybrid bonding [5][9] - The unique properties of glass, including low coefficient of thermal expansion (CTE), excellent dimensional stability, and optical transparency, make it indispensable for meeting the mechanical, electrical, and thermal performance demands of next-generation packaging [9] Market Trends - The market for GCS substrates is expected to reach $460 million by 2030, with optimistic forecasts suggesting widespread adoption starting in 2027-2028 [2] - The glass interlayer market is projected to exceed $400 million by 2030 under conservative estimates, while stable glass carrier applications represent a market size of $500 million [2] Economic Impact - Revenue sources for glass carriers have shifted from board pricing to single-use pricing, with economic benefits depending on reuse rates, laser/UV debonding yields, quality rates, and edge damage avoidance [4] - Companies with deep glass expertise, such as Plan Optik, are well-positioned to benefit from bundling carrier, adhesive, and debonding technologies [4] Technological Advancements - Glass core substrates enhance profitability by integrating TGV (Through Glass Via) and fine RDL (Re-Distribution Layer) technologies, converting display panel capacity into profits [4] - The adoption of advanced techniques such as high-yield TGV drilling/etching, void-free copper filling, and adaptive panel lithography is crucial for maintaining competitive advantages [4] Industry Drivers - The data center and telecommunications sectors are the primary growth engines for glass applications in packaging, with automotive, defense, and high-end consumer electronics also contributing to growth [9] - Emerging supply chains in Asia, particularly in China, South Korea, and Japan, are key to scaling production and strengthening the global advanced packaging glass ecosystem [9]