无晶圆厂半导体
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韩国豪赌半导体:一口气建10做晶圆厂,加码Fabless
半导体行业观察· 2025-12-11 01:23
此外,还将扩大对化合物半导体(其是提高能效和物理人工智能的核心组件)以及先进封装(后处 理)技术开发(已成为一项关键技术)的支持。 公众号记得加星标⭐️,第一时间看推送不会错过。 为应对全球半导体领域的霸权竞争,韩国政府决定将国内无晶圆厂半导体产业规模扩大到目前的10 倍。 其目标是超越以存储半导体为中心的现有半导体产业结构,发展包括无晶圆厂和代工厂在内的系统半 导体,同时增强材料、组件和设备的竞争力,跃升为世界第二大半导体强国。 12月10日,贸易、工业和资源部长官金正冠在龙山总统府举行的"人工智能(AI)时代韩国半导体愿 景和发展战略简报会"上公布了这项半导体产业发展战略。此次简报会由总统李在明主持。 韩国政府计划到2047年投资超过700万亿韩元,新建10座晶圆厂(半导体生产设施),打造全球规模 最大、水平最高的半导体产业集群。政府一直在加快集群建设,今年2月在龙仁综合产业园区启动了 首座晶圆厂的建设,并于6月公布了龙仁国家产业园区的土地补偿方案。 政府还将确保掌握竞争对手无法匹敌的超高性能半导体技术。为此,政府计划在诸如高带宽存储器 (HBM)等存储领域保持优势,同时将预算投入集中于人工智能专用半导体 ...
圣邦股份正式递表冲刺港股IPO 深耕集成电路逾1200人从事研发
Chang Jiang Shang Bao· 2025-09-29 23:31
Core Viewpoint - Shengbang Co., Ltd. is steadily advancing its plan for a Hong Kong IPO, having submitted its listing application to the Hong Kong Stock Exchange on September 29, 2025, with the necessary approvals still pending [1][2]. Group 1: Company Overview - Shengbang Co., Ltd. specializes in the research, development, and sales of high-performance, high-quality analog integrated circuits, covering 34 categories and over 5,900 products [2]. - The company operates as a fabless semiconductor company, outsourcing wafer manufacturing, packaging, and testing to specialized firms, primarily TSMC and SMIC [2]. Group 2: Financial Performance - In 2024, Shengbang achieved a revenue of 3.347 billion yuan, a year-on-year increase of 27.96%, and a net profit of 500 million yuan, up 78.17% [4]. - For the first half of 2025, the company reported a revenue of 1.819 billion yuan, reflecting a 15.37% year-on-year growth, and a net profit of 200 million yuan, which is a 12.42% increase [4]. Group 3: Research and Development - Shengbang has significantly increased its R&D investment, with R&D expenses reaching 508 million yuan in the first half of 2025, accounting for 27.9% of its revenue [6]. - The company has a strong R&D team, with 1,219 personnel, representing 72.56% of its total workforce [6]. - As of June 2025, Shengbang has obtained 430 authorized patents, including 380 invention patents, and has registered 346 integrated circuit layout designs [5][6].