Core Insights - Samsung Electronics has reached a final version of the CHIPS Act incentive plan with the U.S. Department of Commerce, which removes plans for advanced packaging in Tyler, Texas that were included in an earlier memorandum [1] - Samsung is reconsidering the introduction of advanced packaging capacity in Tyler, with an expected additional investment of approximately $7 billion (about 502.63 billion RMB) [1] - The demand for advanced packaging technology is driven by advanced process chips like Tesla's AI6, aligning with Tesla's goal of localizing chip production in the U.S. [1] - This significant deal may encourage other clients to place foundry orders with Samsung's Tyler facility [1] - SK Hynix, another major South Korean semiconductor company, is also considering building a DRAM wafer fab in the U.S., which would create synergies with previously announced HBM advanced packaging facilities [1]