Group 1 - TSMC (Taiwan Semiconductor Manufacturing Company) is set to begin construction of its 1.4nm advanced process plant in Central Taiwan Science Park, with an estimated total investment of NT$1.2 trillion to NT$1.5 trillion [1] - The construction is expected to start in October, with various contractors already notified and bidding processes underway [1] - Environmental assessments for TSMC's 2nm plant in Hsinchu Science Park have been approved, with commitments to enhance the use of recycled water and ensure no impact on local water supply [1] Group 2 - TSMC's primary production site for the 1.4nm process will be the Taichung F25 plant, with plans for four buildings, the first of which is expected to complete risk trial production by the end of 2027 and commence mass production in the second half of 2028, potentially generating over NT$500 billion in revenue [2] - The first phase of the Central Taiwan plant will include two 1.4nm process buildings, with the second phase potentially advancing to 1nm process technology [2] - TSMC is also planning to invest in a 1nm advanced process facility in Tainan's Shalun Park, with an estimated capacity for 10 wafer fabs on a land area of 500 hectares [2]

Core Viewpoint - The article highlights the significant advancements and investments made by TSMC in the semiconductor industry, particularly in the United States, and the implications for its profitability and market position [2][4]. Group 1: TSMC's Financial Performance - TSMC reported a substantial after-tax net profit of 398.27 billion NTD in Q2, marking a year-on-year increase of over 60%, with a net profit margin of 42.7% [2]. - The company's investment in U.S. chip factories is showing promising results, with an after-tax net profit of 4.23 billion NTD from U.S. operations, although this is a small fraction of the total profit [2]. Group 2: U.S. Investments and Production Capacity - TSMC's total investment in the U.S. is projected to reach 165 billion USD, which remains significant even after accounting for subsidies from the U.S. CHIPS Act [4]. - The first U.S. factory, producing 4nm chips, has commenced operations with full capacity booked by clients like Apple and AMD [4]. - The second factory, expected to produce 3nm chips, is under construction and is anticipated to begin operations in Q3 of the following year [4]. Group 3: Profitability Milestones - TSMC's Arizona wafer plant, after four years and nearly 40 billion NTD in cumulative losses, is expected to achieve an after-tax net profit of 4.23 billion NTD by Q2 2025, with a total profit of 4.73 billion NTD in the first half of that year [4]. - This milestone indicates a shift towards profitability for TSMC's advanced manufacturing setup in the U.S., contrasting with the ongoing losses at Japan's Kumamoto plant [4].

以特斯拉 AI6 为代表的先进制程芯片存在对先进封装技术的天然需求。在泰勒市实现 AI6 的前端 + 后端一体化生产符合特斯拉在美国构建本地化芯片产能 的目标；而这笔大交易也可能带动其它客户向三星泰勒厂下达代工订单。 IT之家 7 月 30 日消息，三星电子在去年末与美国商务部达成了最终版本的《CHIPS》法案激励计划，相较同年 4 月的初步备忘录取消了有关在得克萨斯州 泰勒市建设 3D HBM 和 2.5D 封装先进封装的内容。 而根据韩国媒体 hankyung 的报道，在泰勒市晶圆厂获特斯拉大额先进制程订单和韩美贸易谈判进入关键阶段的双重背景下，三星电子重新考虑在泰勒市导 入先进封装产能，追加投资规模预计将达约 70 亿美元（IT之家注：现汇率约合 502.63 亿元人民币）。 而在另一方面，韩国的另一大半导体企业 SK 海力士也在考虑在美国建设 DRAM 晶圆厂，与此前宣布的 HBM 先进封装设施形成协同效应，避免需要外部 DRAM 供应才能完成 HBM 制造的局面。 ...

Group 1 - TSMC plans to increase its monthly production capacity of 2nm chips from 40,000 wafers at the end of this year to 100,000 wafers by next year, representing a 150% increase [1] - The demand from major clients such as Apple, AMD, and Intel for 2nm technology is exceptionally strong, leading to a supply shortage [1] - By 2027, TSMC aims to further expand its 2nm capacity to 200,000 wafers per month, potentially making it the largest node in terms of capacity among TSMC's advanced processes below 7nm [1]