公众号记得加星标⭐️，第一时间看推送不会错过。 近年来，随着芯片制程工艺不断向前演进，"摩尔定律"的迭代进度逐渐放缓。曾经依靠制程迭 代实现晶体管密度翻倍、性能提升的传统路径，如今受限于物理极限与成本激增的双重挑战， 单纯依赖制程突破的发展模式渐显乏力。 在此背景下，半导体行业开始积极探索"后摩尔时代"的破局方向，先进封装技术凭借独特价值迅速成 为业界焦点。尤其是随着AI芯片对超高算力、低延迟的迫切需求，以及Chiplet异构集成技术的兴 起，先进封装不再只是芯片的"保护壳"，更成为实现系统级性能跃升的关键载体。 与传统的封装技术相比，先进封装技术具有灵活性强、集成密度高、尺寸小、性能好等优势，主要包 括倒装芯片封装、晶圆级封装、系统级封装和2.5D、3D封装等技术。 据Yole Group预测，2030年全球先进封装市场规模将突破794亿美元，2024-2030年复合年增长率 （CAGR）达9.5%，AI与高性能计算需求成为拉动复苏的首要动能。市场潜力之下，行业厂商争相 布局，推动先进封装赛道成为驱动产业变革的新引擎。 代工三巨头，鏖战先进封装 在先进封装这一关键赛道，台积电、英特尔、三星等厂商作为先进封装 ...

Group 1 - The article emphasizes the importance of timely and professional information interpretation in investment decisions, focusing on extracting investment value from significant events and analyzing industry chain companies [1] - The company has established long-term partnerships with firms like HiSilicon and Zhaoyi Innovation, ranking among the top three in revenue within its niche [1] - The company plans to invest 2 billion yuan to establish an advanced packaging and testing enterprise, aiming to expand its 2.5D/3D packaging capacity [1]

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容编译自 semiengineering 由于封装集成了多种基材、粘合剂和特殊金属，制造商必须从头开始重新考虑精度。 在通过先进封装技术延续摩尔定律的竞赛中，精度的极限不再仅仅由光刻技术决定，而是越来越多 地由材料不可预测的行为决定。 如今，半导体封装已不再局限于硅和铜，而是涵盖了越来越多的聚合物、粘合剂、电介质、特殊金 属以及玻璃、金刚石和先进陶瓷等基板。每种材料都具有独特的热学、机械和电气特性，使集成变 得复杂。这些特性共同构成了一个环境，即使是最精心设计的工艺，翘曲、应力、污染和变化也可 能会对其造成破坏。 Brewer Science高级应用工程师 Amit Kumar 表示："封装堆叠的演变带来了越来越多的异构集成 挑战，例如界面粘附、化学兼容性、腐蚀、除气、基于缩放的电气和热挑战以及粒子导致的缺陷。 与前端晶圆制造的受控条件不同，在前端晶圆制造中，原子级公差已成为常态，而后端组装必须应 对异构集成的复杂现实。单个封装可能包含多个芯片、有机中介层、底部填充材料、再分布层 (RDL) 和热界面材料，所有这些材料在应力和热量作用下都会产生不同的相互作用。 ...

内容来源于智通财经APP 贝塔投资智库 为投资交易提供更有价值的服务 Counterpoint高级分析师William Li指出，随着先进封装技术在芯片性能提升中的关键作用日益凸显， 芯片设计商将日益依赖先进封装来提升方案性能。鉴于台积电目前的技术领先优势及稳固的客户关 系，预计该公司不仅在先进制程节点领域持续领跑， 未来在先进封装领域也将保持主导地位。 从同业对比看，第二季度多数其他晶圆代工厂商(含 IDM 外包份额)市场份额维持或微降： 德州仪器 (TXN.US)与英特尔(INTC.US)均稳定保持6%市场份额;英飞凌科技从6%微降至5%，三星则从5%下滑 至4%。 Counterpoint高级分析师Jake Lai分析，消费电子传统旺季效应、AI 应用订单加速及中国现有补贴政 策，将成为三季度主要驱动力。 点击蓝字，关注我们 智通财经APP获悉，根据Counterpoint Research数据， 台积电(TSM.US)在2025年自然年第二季度半导 体代工市场占有率飙升至38%，同比提升7个百分点，而去年同期为31%。这一增长源于行业整体晶圆 代工收入同比攀升19%， 主要受人工智能对先进制程及封装技 ...

Group 1 - The Chiayi Phase II park is entering the environmental assessment stage, with TSMC committing to retain advanced technology in Taiwan, specifically planning to establish a new generation advanced packaging factory in Chiayi [1] - The environmental impact statement estimates that the companies entering the Chiayi Phase II park will generate an annual revenue of NT$210 billion [1] - As of April 2023, the Chiayi park has six approved companies and two expansion projects, achieving a land rental rate of 100% [1] Group 2 - The Chiayi Phase II park covers approximately 89.58 hectares, with 41.66 hectares designated for production and 47.92 hectares for public facilities, focusing on emerging technologies such as B5G, 6G, AI, cybersecurity, heterogeneous packaging, net-zero, and quantum technology [2] - The average water usage for the project is estimated at 40,000 CMD (tons/day), with agreements in place for water supply and plans to utilize various water sources [2] - The estimated electricity demand for the park is 338,000 kW, with consent obtained from the local power company [2] Group 3 - The construction period for the Chiayi Phase II park is expected to be around five years, with an anticipated increase of 3,500 jobs during the operational phase [3]

Core Insights - The semiconductor packaging and testing technology has become a crucial element in overcoming the dual challenges of "physical limits" and "industrial chain disruptions" in the context of the global semiconductor industry's rapid transformation and geopolitical tensions [1] Group 1: Industry Trends - The advanced packaging sector is seen as a core pathway to continue Moore's Law, with technologies such as 2.5D/3D, Chiplet, and Fan-Out accelerating the integration of design and manufacturing [1] - The geopolitical landscape is reshaping supply chains, necessitating a dual approach of self-sufficiency and globalization for China's packaging industry [1] Group 2: Regional Developments - Jiangsu province, holding nearly half of the national packaging capacity, has become a significant hub for the semiconductor packaging industry, with the Yangtze River Delta region accounting for over 81% of the national total [2] - By 2024, Jiangsu's packaging revenue is projected to exceed 170 billion yuan, with key enterprises achieving breakthroughs in system-level packaging and 2.5D packaging technologies [2] Group 3: Market Dynamics - The domestic integrated circuit industry has seen a continuous increase in prosperity, with sales reaching 1,045.8 billion yuan, a year-on-year growth of 18% [3] - The advanced packaging market is growing at a rate that outpaces traditional packaging, driven by the demand for high-density, diversified, and miniaturized packaging solutions [3]

Core Insights - Intel is experiencing significant talent loss due to financial constraints, layoffs, and project cancellations, prompting competitors like Samsung Electronics to aggressively recruit skilled engineers from Intel [1][2][3] - Samsung is particularly targeting engineers with expertise in advanced packaging technology, glass substrates, and backend power delivery systems, which are critical for next-generation semiconductor projects [1][2] - The ongoing layoffs at Intel, which aim to reduce the workforce by 75,000, are seen as an opportunity for Samsung to acquire top talent in the semiconductor industry [1][3] Group 1 - Intel's recent layoffs and project cancellations have led to a talent exodus, with many engineers moving to Samsung Electronics and its subsidiaries [1][2] - Samsung is focusing on hiring experienced packaging process engineers, especially in areas where it lacks expertise, such as backend power delivery and glass substrates [2] - The departure of key engineers, including Intel's chief packaging engineer Gang Duan, highlights the severity of talent loss at Intel [2] Group 2 - Industry experts predict that Intel's ongoing reduction of investment in foundry-related projects will continue to result in talent outflow [3] - Intel's CEO has acknowledged that past investments in capacity exceeded demand, indicating a shift in the company's development strategy [3] - Samsung is advised to selectively recruit talent based on actual departmental needs rather than solely on their Intel background [3]

Group 1 - The core viewpoint highlights a strong performance in the semiconductor sector, with the STAR Market Semiconductor Materials and Equipment Index rising by 2.54% as of August 20, driven by significant gains in constituent stocks such as Xinyi Chang and Zhongke Feimeng [1] - The STAR Semiconductor ETF (588170) has shown a cumulative increase of 3.18% over the past week, with a recent price of 1.13 yuan, indicating a positive trend in investor sentiment [1] - The liquidity of the STAR Semiconductor ETF is robust, with a turnover rate of 29.2% and a trading volume of 135 million yuan, reflecting active market participation [1] Group 2 - Yole forecasts that the global advanced packaging market will grow from $37.8 billion in 2023 to $69.5 billion by 2029, driven primarily by demand in telecommunications and infrastructure, including AI and high-performance computing [2] - Open Source Securities emphasizes the advantages of diverse advanced packaging technologies, which can deliver high performance, low cost, compact size, and shorter cycles, presenting investment opportunities in domestic packaging manufacturers [2] - The STAR Semiconductor ETF (588170) and its linked funds focus on semiconductor equipment (59%) and materials (25%), highlighting the importance of domestic substitution in the semiconductor industry [2][3]

Core Viewpoint - The semiconductor industry is transitioning towards the "beyond Moore" era, driven by the increasing demand for efficient thermal management technologies in emerging fields such as 5G, AI, HPC, and data centers [2] Group 1: Conference Overview - The 2025 Advanced Packaging and Thermal Management Conference will focus on high-performance thermal management challenges, featuring three main forums: Advanced Packaging and Heterogeneous Integration Forum, High-Performance Thermal Management Innovation Forum, and Liquid Cooling Technology and Market Application Forum [3][4] - The conference aims to build a platform for industry-academia-research collaboration, promoting technological integration and providing innovative momentum for the semiconductor supply chain [3] Group 2: Conference Details - The conference is organized by Flink Qiming Chain and supported by the National Third Generation Semiconductor Technology Innovation Center (Suzhou) [4] - Scheduled for September 25-26, 2025, in Suzhou, Jiangsu, the conference expects around 500 participants [3] Group 3: Confirmed Speakers - Notable speakers include Professor Liang Jianbo from the National Third Generation Semiconductor Technology Innovation Center, who will discuss high thermal conductivity interface and packaging technology [7] - Other speakers represent various institutions, including the Chinese Academy of Sciences and universities, covering topics such as photothermal polyimide materials and advanced packaging applications [8][9] Group 4: Forum Topics - The forums will address key topics such as advanced packaging technology routes, cost optimization, and challenges in 2.5D/3D integration [17] - The High-Performance Thermal Management Forum will explore thermal interface materials, high-performance chip thermal management solutions, and the impact of Chiplet technology on thermal management [20][21] Group 5: Liquid Cooling Technology - The Liquid Cooling Technology Forum will discuss innovations and challenges in liquid cooling, including the standardization of cooling fluids and the application of immersion cooling in high-power density scenarios [23][24] - Topics will also cover the lifecycle cost analysis of liquid cooling systems and their integration in data centers and electric vehicles [25]

Group 1: Industry Developments - Advanced packaging technology is becoming crucial for extending Moore's Law, as traditional scaling methods face limitations due to rising costs in processes below 7nm [1][4] - The demand for advanced packaging is driven by high-performance computing, AI, data centers, autonomous driving, smartphones, and 5G communications [4][5] - Major global players like TSMC, Intel, and Samsung are prioritizing advanced packaging as a strategic focus [3][4] Group 2: Company Activities - Zhizheng Co., Ltd. plans to acquire Advanced Assembly Materials International Limited, a leading semiconductor lead frame supplier, through a significant asset swap and fundraising [1] - Huada Technology announced the establishment of a wholly-owned subsidiary for advanced packaging, indicating a trend among domestic chip companies to invest in this area [1][3] - Qizhong Technology aims to raise up to 850 million yuan for advanced packaging projects, while Baiwei Storage completed a private placement to fund its advanced packaging manufacturing expansion [3] Group 3: Equipment Demand - The shift towards advanced packaging is creating new demands for semiconductor equipment, with companies like ASMPT reporting a 50% year-on-year increase in orders for advanced packaging equipment [5] - The performance of advanced packaging equipment is critical, especially in complex scenarios like multi-layer stacking and hybrid bonding [5][6] - Domestic companies are striving to catch up, with projections of significant revenue growth for firms like Tuojing Technology, which anticipates a 52% to 58% increase in revenue by Q2 2025 [6]