12月10日，上峰投资2.34亿元的新质股权投资重点布局企业——粤芯半导体技术股份有限公司(简称"粤 芯半导体")披露了首次公开发行股票上市辅导工作完成报告，标志着这家国内重要的12英寸模拟芯片代 工企业正式进入IPO冲刺阶段。至此，包括长鑫科技、盛合晶微、上海超硅等上峰单项目投资亿元以上 的企业均已先后步入上市或重组上市进程。 作为大湾区首家实现量产的12英寸芯片制造企业，粤芯半导体聚焦消费类电子、汽车电子、工业控制、 物联网等领域的高端模拟芯片代工，以"定制化代工"策略构建差异化竞争力；目前粤芯已建成三期合计 月产7万片12英寸晶圆产能，系粤港澳大湾区半导体产业联盟理事长单位，广东省集成电路行业协会会 长单位。粤芯半导体冲刺IPO不仅是自身资本化的关键一步，也将为国内模拟芯片制造领域注入活力， 助力大湾区集成电路产业链的完善与升级。(秦声) ...

Core Viewpoint - Company signed a strategic cooperation agreement with Xiamen Municipal Government for a high-end analog integrated circuit chip manufacturing project, indicating a significant investment in semiconductor production [1][2]. Group 1: Project Overview - The project focuses on high-end analog integrated circuit chips with a total planned investment of 20 billion yuan [2]. - The planned production capacity is 45,000 wafers per month, aiming for an annual output of 540,000 wafers after completion of both phases [2]. Group 2: Investment Details - The company’s wholly-owned subsidiary, Xiamen Silan Micro, will collaborate with Xiamen Semiconductor Investment Group and Xiamen New Wing Technology to increase capital by 5.1 billion yuan [1]. - The investment cooperation agreement was signed to support the development of the 12-inch high-end analog integrated circuit chip manufacturing line [1].