Core Viewpoint - The automotive industry is transitioning from distributed to domain-centralized architectures, with Ethernet becoming the backbone for in-vehicle communication, leading to a surge in demand for automotive Ethernet chips [2][3]. Group 1: Market Demand and Product Development - The market for automotive Ethernet chips is expected to explode in the next one to two years due to the increasing consensus on building domestic supply chains and enhancing product competitiveness [3]. - The latest automotive Ethernet TSN switch chips, YT9908 and YT9911, support multiple TSN protocols and include advanced security features, indicating a focus on high-performance communication solutions [3]. - Currently, the usage of Ethernet chips in vehicles is limited, with approximately 10 PHY chips and 1 to 4 switch chips per vehicle, but this is projected to increase significantly as smart vehicle technology evolves [3][4]. Group 2: Technological Evolution and R&D Investment - The evolution of automotive electronic architectures is driven by the demand for high bandwidth, low latency, and reliable communication, particularly for advanced driving assistance systems and smart cabins [4]. - The company plans to accelerate the development of next-generation automotive chips by 2025 to support higher bandwidth and multi-domain integration, with R&D expenses projected to reach 294 million yuan in 2024, accounting for 74.1% of revenue [4][5]. Group 3: International Expansion and Market Trends - The company began its international expansion in 2023, achieving overseas revenue of 73.76 million yuan in 2024, a growth of 157.84% compared to 2023, with a focus on major automotive manufacturers in Europe [5]. - The domestic market for automotive communication chips, particularly Ethernet chips, has a low localization rate of about 5%, attributed to the recent standardization of Ethernet technology and the high safety requirements for automotive applications [6][7]. Group 4: Industry Collaboration and Integration - The relationship between automotive manufacturers and chip companies is evolving from a supply-demand dynamic to deeper collaboration, particularly in the development of automotive Ethernet chips [7][8]. - The changing perceptions of domestic chip manufacturers among automotive OEMs have improved, with increased acceptance of new products over recent years [8]. - The international landscape presents opportunities for domestic chip manufacturers to enhance self-sufficiency in the supply chain, although the core focus remains on technology, product quality, and service to capture market share [9].

备受全球瞩目的第21届上海国际汽车工业展览会（2025上海车展）于4月23日在国家会展中心（上海）盛大开幕。作为2025上海车展的主题论坛 之一，"2025汽车半导体生态大会暨中国车规芯片技术路演"定于4月25日-26日在国家会议中心（上海）隆重举办。 在企业发布环节，裕太微电子股份有限公司隆重发布了其第一款车规级TSN Switch产品——驭枢系列，即YT9908和YT9911系列总共四颗芯片，进一步 完善车载以太网产品矩阵，并向打破国际芯片巨头长期垄断车载高速通信芯片局面迈出重要一步。 裕太微车载事业部总经理郝世龙表示，汽车智能化是确定性趋势，将带动整个产业的数据量爆增。但其中需要新的通信网络能够与之相匹配，即 车载以太网。这好比一座城市变得越来越大，需要有更多高速公路和高架桥，而车载以太网是实体化的信息高速公路，车载TSN Switch芯片则是高 速公路枢纽，负责整个车内以太网节点的数据汇集、调度和转发。 "作为数据集散地，车载TSN Switch芯片的作用非常重要，一旦出现故障可能导致整车的行驶数据中断，以及给智能辅助驾驶和汽车安全等造成 非常大的风险。"郝世龙称，车载TSN Switch芯片研发难度 ...

本次股票发行后拟在科创板市场上市，该市场具有较高的投资风险。科创板公司 具有研发投入大、经营风险高、业绩不稳定、退市风险高等特点，投资者面临较 大的市场风险。投资者应充分了解科创板市场的投资风险及本公司所披露的风险 因素，审慎作出投资决定。 裕太微电子股份有限公司 Motorcomm Electronic Technology CO., LTD. 苏州市高新区科灵路 78 号 4 号楼 201 室 首次公开发行股票并在科创板上市 招股说明书 发行人实际控制人承诺本招股说明书不存在虚假记载、误导性陈述或重大遗 漏，并对其真实性、准确性、完整性承担个别和连带的法律责任。 保荐人（主承销商） （上海市广东路 689 号） 裕太微电子股份有限公司 招股说明书 声明及承诺 中国证监会、交易所对本次发行所作的任何决定或意见，均不表明其对注册 申请文件及所披露信息的真实性、准确性、完整性作出保证，也不表明其对发行 人的盈利能力、投资价值或者对投资者的收益作出实质性判断或保证。任何与之 相反的声明均属虚假不实陈述。 根据《证券法》的规定，股票依法发行后，发行人经营与收益的变化，由发 行人自行负责；投资者自主判断发行人的投资价 ...

本次股票发行后拟在科创板市场上市，该市场具有较高的投资风险。科创板公司 具有研发投入大、经营风险高、业绩不稳定、退市风险高等特点，投资者面临较 大的市场风险。投资者应充分了解科创板市场的投资风险及本公司所披露的风险 因素，审慎作出投资决定。 裕太微电子股份有限公司 Motorcomm Electronic Technology CO., LTD. 苏州市高新区科灵路 78 号 4 号楼 201 室 首次公开发行股票并在科创板上市 招股意向书 保荐人（主承销商） （上海市广东路 689 号） 裕太微电子股份有限公司 招股意向书 声明及承诺 中国证监会、交易所对本次发行所作的任何决定或意见，均不表明其对注册 申请文件及所披露信息的真实性、准确性、完整性作出保证，也不表明其对发行 人的盈利能力、投资价值或者对投资者的收益作出实质性判断或保证。任何与之 相反的声明均属虚假不实陈述。 根据《证券法》的规定，股票依法发行后，发行人经营与收益的变化，由发 行人自行负责；投资者自主判断发行人的投资价值，自主作出投资决策，自行承 担股票依法发行后因发行人经营与收益变化或者股票价格变动引致的投资风险。 发行人及全体董事、监事、高 ...