Core Insights - The ICCAD-Expo 2025 was successfully held in Chengdu, focusing on the theme "Open Innovation, Achieving the Future," featuring a series of activities including a summit forum, specialized forums, and an industry exhibition [2][4]. Event Overview - The event attracted over 2,000 domestic and international integrated circuit companies, with more than 6,300 guests including industry leaders and experts [2]. - The forum structure included 1 summit forum, 10 specialized forums, and 1 industry exhibition, creating a high-end communication platform for the integrated circuit industry [2]. Industry Insights - Professor Wei Shaojun presented a report indicating that the sales revenue of the entire industry is expected to reach 835.73 billion yuan by 2025, with a year-on-year growth rate of 29.4%, signaling a strong recovery [6]. - The report highlighted that the industry scale could exceed 1 trillion yuan by 2030, with Shanghai, Shenzhen, and Beijing leading in sales revenue [6]. Structural Challenges - The integrated circuit design industry faces structural challenges characterized by a "small, scattered, and weak" structure, with a product mix skewed towards low-end products [7]. - Communication and consumer electronics chips account for nearly two-thirds of sales, while computer chips only represent 7.7% of the market, significantly lower than the global average of about 25% [7]. Future Directions - The report emphasized the need for differentiated competition and avoiding homogenization to ensure sustainable industry development [7]. - The industry must focus on strengthening core technology and product competitiveness through systematic innovation to build a fully autonomous and reliable Chinese chip industry [7]. Forum Highlights - The summit forum featured 23 industry leaders discussing global trends, industry chain collaboration, and ecological construction in the integrated circuit sector [9]. - Topics included EDA and IP innovation, heterogeneous computing, DPU data center transformation, and AI integration, showcasing the technological forefront of the industry [9]. Specialized Forums - Ten specialized forums were held, with nearly 200 industry elites sharing insights on EDA innovation, automotive-grade chips, and generative AI [12]. Exhibition Overview - The exhibition showcased the entire integrated circuit industry chain, covering key areas such as IP licensing, EDA tools, and wafer manufacturing, with over 300 top semiconductor companies participating [14]. - The exhibition spanned 20,000 square meters and highlighted the strong gathering effect of the Chengdu-Chongqing region's integrated circuit industry [14]. Future Events - The next ICCAD-Expo 2026 will be held in Beijing, marking a continuation of the event's success and its role in promoting innovation and competitiveness in the integrated circuit industry [16].

Core Viewpoint - Hefei Chipmore Technology Co., Ltd. is issuing convertible bonds to unspecified investors, with a focus on meeting the suitability requirements for investors in the Sci-Tech Innovation Board [1][2]. Group 1: Convertible Bond Issuance - The company is issuing convertible bonds with redemption clauses, including maturity redemption and conditional redemption, with the redemption price determined by the board based on market conditions [2][3]. - The company has set a credit rating of "AA+" for the bonds, with a stable outlook, as assessed by Dongfang Jincheng [3][4]. Group 2: Risks and Considerations - Investors who do not meet the suitability requirements may face risks, including the inability to convert bonds into shares and potential losses if redemption prices are lower than the acquisition cost [2][3]. - The company has not provided guarantees for the bonds, which may lead to repayment risks if significant negative events affect its operational management and debt repayment capabilities [3][4]. Group 3: Business Development and Market Position - The company has been expanding its non-display advanced packaging technology since 2015, but its overall scale remains relatively small compared to leading competitors in the industry [6][7]. - The company faces risks from intensified market competition, particularly in the advanced packaging sector, where larger firms are actively investing [6][7]. Group 4: Fund Utilization and Project Risks - The funds raised will be used for projects including high-pin-count micro-sized bump packaging and advanced power and flip-chip packaging technology upgrades, which are expected to enhance the company's core competitiveness [7][8]. - There are risks associated with project implementation, including potential delays, market changes, and the possibility of not achieving expected profitability from the new projects [8][9]. Group 5: Measures to Mitigate Immediate Return Dilution - The company plans to implement various measures to protect investors' interests and mitigate the dilution of immediate returns from the bond issuance [10][11]. - The company has committed to strict governance and management practices to ensure effective use of raised funds and to enhance its profitability and core competitiveness [10][11].