Investment Rating - The report maintains a "Buy" rating for the company, indicating an expected stock price increase of over 15% relative to the industry index in the next six months [4][18]. Core Views - The company has experienced significant revenue growth in the first half of 2025, driven by the recovery in consumer electronics demand, particularly for large-size panels and AMOLED products, alongside the release of new production capacity from fundraising projects [2][3]. - The company's gross margin improved to 23.53% in 25H1, up 3.63 percentage points year-on-year, attributed to increased order volumes and an improved product mix [2]. - The report highlights the ongoing shift of the display driver chip packaging and testing business from Taiwan and South Korea to mainland China, benefiting domestic companies like the report's subject [3][9]. Financial Summary - The company reported a revenue of 866 million yuan in 25H1, a year-on-year increase of 28.58%, and a net profit of 96 million yuan, up 60.94% year-on-year [1][2]. - The projected revenues for the company are expected to grow from 1,238 million yuan in 2023 to 2,546 million yuan by 2027, with a compound annual growth rate (CAGR) of approximately 18% [1]. - The net profit is projected to increase from 196 million yuan in 2023 to 361 million yuan by 2027, with significant growth expected in 2025 and 2026 [1][9]. Industry Insights - The report notes that the recovery in consumer electronics is expected to continue, with a notable increase in shipments of mid-to-large size products such as PCs, tablets, and TVs [3]. - The domestic display driver chip industry is anticipated to benefit from increased production capacity and market share among local manufacturers, particularly in the AMOLED segment [3][9]. - The company is positioned to expand its high-end packaging and testing capacity, which is crucial for meeting the growing demand in the display driver chip market [3][9].

Investment Rating - The investment rating for the company is "Buy" (maintained) [1] Core Views - The company's profitability significantly improved in Q2 2025, with a notable recovery in profit margins and operational efficiency [1][8] - The non-display business continues to be a key focus for the company, with ongoing efforts to enhance its capabilities in power device packaging and smart manufacturing [5][8] - The display driver chip business remains strong, holding the leading position in the domestic market and third globally, benefiting from the ongoing demand for larger display technologies [8] Financial Performance - In H1 2025, the company achieved revenue of 1.0 billion yuan, a year-on-year increase of 6.6%, while net profit decreased by 38.8% [8] - Q2 2025 revenue reached 520 million yuan, up 6.3% year-on-year and 9.9% quarter-on-quarter, with a significant improvement in gross margin to 31.3% [8] - The company expects revenues for 2025-2027 to be 2.27 billion, 2.62 billion, and 3.04 billion yuan respectively, with net profits projected at 330 million, 400 million, and 510 million yuan [6][9] Business Segments - The display driver chip segment accounted for 92.1% of total revenue in H1 2025, with a strong market position supported by advanced packaging capabilities [8] - The non-display business, while facing challenges, is expected to improve in H2 2025, with specific growth anticipated in Cu Bump and DPS utilization rates [5][8]

Group 1 - The core viewpoint of the news is that Huicheng Co., Ltd. experienced a decline in stock price, dropping by 5.07% to 12.91 CNY per share, with a trading volume of 249 million CNY and a turnover rate of 2.25%, resulting in a total market capitalization of 10.847 billion CNY [1] - Huicheng Co., Ltd. is located in Hefei, Anhui Province, and was established on December 18, 2015. The company went public on August 18, 2022. Its main business focuses on the manufacturing of gold bumping, as well as integrated services in wafer testing and various packaging processes for display driver chips [1] - The revenue composition of Huicheng Co., Ltd. indicates that 90.25% comes from display driver chip testing and packaging, while other services account for 9.75% [1] Group 2 - From the perspective of major fund holdings, Changcheng Fund has one fund heavily invested in Huicheng Co., Ltd. The Changcheng Jiuheng Mixed A Fund (200001) held 226,200 shares in the second quarter, representing 3.52% of the fund's net value, making it the eighth largest holding. The estimated floating loss today is approximately 156,100 CNY [2] - The Changcheng Jiuheng Mixed A Fund (200001) was established on October 31, 2003, with a latest scale of 66.0927 million CNY. Year-to-date returns are 57.77%, ranking 537 out of 8,184 peers; the one-year return is 110.1%, ranking 258 out of 7,971; and since inception, the return is 599.25% [2]

Investment Rating - The report maintains a "Buy" rating for the company, indicating an expected stock price increase of over 15% relative to the industry index within the next six months [5][18]. Core Insights - The company has shown steady revenue growth in the first half of 2025, with a year-on-year increase of 6.63%, reaching a revenue of 996 million yuan. However, the net profit attributable to the parent company decreased by 38.78% year-on-year to 99 million yuan [1][2]. - The company's gross margin for the first half of 2025 was 27.65%, down 5.22 percentage points year-on-year, while the net margin was 9.96%, down 7.39 percentage points year-on-year. In Q2 2025, the gross margin improved to 31.27%, up 7.60 percentage points quarter-on-quarter [2]. - The company is benefiting from the ongoing shift in the panel industry, with a strong position in the display driver chip market, particularly in the advanced 28nm process technology [3][10]. Financial Summary - Revenue projections for the company are as follows: 1,629 million yuan in 2023, 1,959 million yuan in 2024, 2,250 million yuan in 2025, 2,632 million yuan in 2026, and 3,054 million yuan in 2027, reflecting growth rates of 23.7%, 20.3%, 14.8%, 17.0%, and 16.0% respectively [1][11]. - The net profit attributable to the parent company is expected to be 372 million yuan in 2023, decreasing to 313 million yuan in 2024, and then recovering to 420 million yuan by 2027 [1][11]. - The company's earnings per share (EPS) are projected to be 0.31 yuan in 2023, decreasing to 0.23 yuan in 2025, and then increasing to 0.35 yuan by 2027 [1][11]. Industry Outlook - The report anticipates continued demand growth in the display industry, particularly for AMOLED technology, which accounted for 18% of the company's revenue in the first half of 2025. The penetration rate of AMOLED is expected to rise further [3][10]. - The company is actively expanding its non-display testing services to create a second growth curve, enhancing its competitiveness in the semiconductor packaging market [4][9].

Core Viewpoint - Hefei Chipmore Technology Co., Ltd. is issuing convertible bonds to unspecified investors, with a focus on meeting the suitability requirements for investors in the Sci-Tech Innovation Board [1][2]. Group 1: Convertible Bond Issuance - The company is issuing convertible bonds with redemption clauses, including maturity redemption and conditional redemption, with the redemption price determined by the board based on market conditions [2][3]. - The company has set a credit rating of "AA+" for the bonds, with a stable outlook, as assessed by Dongfang Jincheng [3][4]. Group 2: Risks and Considerations - Investors who do not meet the suitability requirements may face risks, including the inability to convert bonds into shares and potential losses if redemption prices are lower than the acquisition cost [2][3]. - The company has not provided guarantees for the bonds, which may lead to repayment risks if significant negative events affect its operational management and debt repayment capabilities [3][4]. Group 3: Business Development and Market Position - The company has been expanding its non-display advanced packaging technology since 2015, but its overall scale remains relatively small compared to leading competitors in the industry [6][7]. - The company faces risks from intensified market competition, particularly in the advanced packaging sector, where larger firms are actively investing [6][7]. Group 4: Fund Utilization and Project Risks - The funds raised will be used for projects including high-pin-count micro-sized bump packaging and advanced power and flip-chip packaging technology upgrades, which are expected to enhance the company's core competitiveness [7][8]. - There are risks associated with project implementation, including potential delays, market changes, and the possibility of not achieving expected profitability from the new projects [8][9]. Group 5: Measures to Mitigate Immediate Return Dilution - The company plans to implement various measures to protect investors' interests and mitigate the dilution of immediate returns from the bond issuance [10][11]. - The company has committed to strict governance and management practices to ensure effective use of raised funds and to enhance its profitability and core competitiveness [10][11].

Core Viewpoint - Company Qizhong Technology plans to raise up to 850 million yuan through convertible bonds to invest in two projects aimed at enhancing its advanced packaging and testing capabilities for integrated circuits [1][5]. Investment Projects - The total investment for the high-pin-count micro-sized bump packaging and testing project is approximately 41.95 million yuan, with the company planning to use 41.9 million yuan from the raised funds [3]. - The advanced power and flip-chip packaging technology renovation project at Qizhong Technology (Suzhou) has a total investment of about 43.17 million yuan, with 43.1 million yuan expected to be funded from the new issuance [3]. - The combined total investment for both projects is around 85.11 million yuan, with the company intending to utilize 85 million yuan from the fundraising [3]. Business Focus and Market Position - Over half of the raised funds will be allocated to enhance the packaging and testing capacity for non-display chips, which currently contribute less than 10% to the company's revenue in 2024 [5]. - Qizhong Technology is one of the few domestic firms capable of large-scale production of various bump manufacturing technologies and has maintained a leading position in advanced packaging technology [6]. - The company reported a projected revenue of nearly 2 billion yuan in 2024, with its display driver chip packaging business expected to sell 1.845 billion units, generating 1.758 billion yuan in revenue, ranking third globally in this sector [6]. Financial Performance and Stock Status - Since its IPO in April 2023, Qizhong Technology's stock has underperformed, trading below its initial offering price of 12.1 yuan per share, with a notable drop to around 8 yuan [9]. - The company has experienced a decline in net profit, reporting 313 million yuan in 2024, a decrease of 15.71% year-on-year, attributed to rising costs such as equipment depreciation and employee compensation [10]. - The company plans to repurchase shares at a price not exceeding 16.61 yuan per share, with a total repurchase amount between 75 million and 150 million yuan [9].

定、退市风险高等特点，投资者面临较大的市场风险。投资者应充分了解科创板的投 资风险及本公司所披露的风险因素，审慎作出投资决定。 合肥颀中科技股份有限公司 Hefei Chipmore Technology Co.,Ltd. （合肥市新站区综合保税区内） 首次公开发行股票并在科创板上市 招股说明书 保荐人（主承销商） （北京市朝阳区安立路 66 号 4 号楼） 本次发行股票拟在科创板上市，科创板公司具有研发投入大、经营风险高、业绩不稳 合肥颀中科技股份有限公司 招股说明书 中国证监会、交易所对本次发行所作的任何决定或意见，均不表明其对 发行人注册申请文件及所披露信息的真实性、准确性、完整性作出保证，也 不表明其对发行人的盈利能力、投资价值或者对投资者的收益作出实质性判 断或保证。任何与之相反的声明均属虚假不实陈述。 根据《证券法》规定，股票依法发行后，发行人经营与收益的变化，由 发行人自行负责；投资者自主判断发行人的投资价值，自主作出投资决策， 自行承担股票依法发行后因发行人经营与收益变化或者股票价格变动引致的 投资风险。 | 发行股票类型 | 人民币普通股（A 股） | | | | --- | --- | - ...

定、退市风险高等特点，投资者面临较大的市场风险。投资者应充分了解科创板的投 资风险及本公司所披露的风险因素，审慎作出投资决定。 合肥颀中科技股份有限公司 Hefei Chipmore Technology Co.,Ltd. （合肥市新站区综合保税区内） 首次公开发行股票并在科创板上市 招股意向书 保荐人（主承销商） （北京市朝阳区安立路 66 号 4 号楼） 本次发行股票拟在科创板上市，科创板公司具有研发投入大、经营风险高、业绩不稳 合肥颀中科技股份有限公司 招股意向书 中国证监会、交易所对本次发行所作的任何决定或意见，均不表明其对 发行人注册申请文件及所披露信息的真实性、准确性、完整性作出保证，也 不表明其对发行人的盈利能力、投资价值或者对投资者的收益作出实质性判 断或保证。任何与之相反的声明均属虚假不实陈述。 根据《证券法》规定，股票依法发行后，发行人经营与收益的变化，由 发行人自行负责；投资者自主判断发行人的投资价值，自主作出投资决策， 自行承担股票依法发行后因发行人经营与收益变化或者股票价格变动引致的 投资风险。 | 发行股票类型 | 股） 人民币普通股（A | | | | | --- | --- | ...

本次发行股票拟在科创板上市，科创板公司具有研发投入大、经营风险高、业绩不稳 定、退市风险高等特点，投资者面临较大的市场风险。投资者应充分了解科创板的投 资风险及本公司所披露的风险因素，审慎作出投资决定。 合肥颀中科技股份有限公司 Hefei Chipmore Technology Co.,Ltd. （合肥市新站区综合保税区内） 首次公开发行股票并在科创板上市 招股说明书 合肥颀中科技股份有限公司 招股说明书（注册稿） 中国证监会、交易所对本次发行所作的任何决定或意见，均不表明其对 发行人注册申请文件及所披露信息的真实性、准确性、完整性作出保证，也 不表明其对发行人的盈利能力、投资价值或者对投资者的收益作出实质性判 断或保证。任何与之相反的声明均属虚假不实陈述。 根据《证券法》规定，股票依法发行后，发行人经营与收益的变化，由 发行人自行负责；投资者自主判断发行人的投资价值，自主作出投资决策， 自行承担股票依法发行后因发行人经营与收益变化或者股票价格变动引致的 投资风险。 | 发行股票类型 | 人民币普通股（A 股） | | --- | --- | | 发行股数 | 本次公开发行股票（全部为公司公开发行新股）的总 ...

定、退市风险高等特点，投资者面临较大的市场风险。投资者应充分了解科创板的投 资风险及本公司所披露的风险因素，审慎作出投资决定。 合肥颀中科技股份有限公司 Hefei Chipmore Technology Co.,Ltd. （合肥市新站区综合保税区内） 首次公开发行股票并在科创板上市 招股说明书 （注册稿） 声明：本公司的发行上市申请尚需经上海证券交易所和中国证监会履行相应程序。本招 股说明书不具有据以发行股票的法律效力，仅供预先披露之用。投资者应当以正式公告 的招股说明书全文作为作出投资决定的依据。 保荐机构（主承销商） （北京市朝阳区安立路 66 号 4 号楼） 本次发行股票拟在科创板上市，科创板公司具有研发投入大、经营风险高、业绩不稳 合肥颀中科技股份有限公司 招股说明书（注册稿） 中国证监会、交易所对本次发行所作的任何决定或意见，均不表明其对 发行人注册申请文件及所披露信息的真实性、准确性、完整性作出保证，也 不表明其对发行人的盈利能力、投资价值或者对投资者的收益作出实质性判 断或保证。任何与之相反的声明均属虚假不实陈述。 | 第一节 释义 … | | --- | | 一、普通名词释义 | | 二、专 ...