Core Insights - The article highlights a structural transformation in AI server design, emphasizing the shift from traditional cable-based architectures to cableless interconnect designs, particularly with NVIDIA's Rubin platform [2][3] - The transition to high-density interconnects and advanced materials in PCB design is identified as a key driver for enhancing server performance and efficiency [3][4] Group 1: AI Server Design Evolution - AI servers are moving towards a cableless architecture, which enhances signal integrity and transmission stability by utilizing multi-layer PCBs instead of traditional cabling [2] - The Rubin platform's design incorporates advanced materials and high-density interconnects, resulting in a more than twofold increase in PCB value compared to previous generations [3] Group 2: Material Upgrades and Supply Chain Dynamics - The demand for high-performance PCBs in AI servers is driving significant changes in upstream materials, particularly in fiberglass and copper foil, which are critical for dielectric and thermal stability [4] - Japanese company Nittobo is investing 15 billion yen to expand production of T-glass, which is expected to triple its capacity by the end of 2026, highlighting the increasing importance of advanced materials in PCB manufacturing [4] Group 3: Future Outlook - TrendForce anticipates that 2026 will mark a new starting point for PCBs, driven by technology content that enhances value [5]