Core Insights - The AI server design is undergoing a structural transformation, with the transition to cableless architecture and high-density interconnect (HDI) designs becoming central to the PCB industry's evolution [1][2] - The introduction of the Rubin platform marks a significant shift in PCB's role, emphasizing signal integrity and transmission stability as core design metrics [1][2] Group 1: PCB Design and Technology - The Rubin platform utilizes a cableless interconnect design, enhancing the PCB industry's status by shifting from traditional cable-based connections to multi-layer PCBs [1] - The new design materials include M8U grade for Switch Tray and M9 for Midplane, with PCB value per server increasing by over two times compared to previous generations [2] - The design logic of Rubin has become a common language in the industry, influencing other ASIC AI servers like Google TPU V7 and AWS Trainium3 [2] Group 2: Material Innovations - The demand for PCB performance in AI servers is driving significant changes in upstream materials, focusing on dielectric and thermal stability [2] - Nittobo is investing 15 billion yen to expand production of T-glass, which is expected to triple its capacity by the end of 2026, becoming a core material for ABF and BT substrates [2] - Low roughness HVLP4 copper foil is becoming mainstream due to the increasing impact of skin effect, leading to long-term supply tightness and a shift in bargaining power back to upstream material suppliers [3]

Core Insights - The article highlights a structural transformation in AI server design, emphasizing the shift from traditional cable-based architectures to cableless interconnect designs, particularly with NVIDIA's Rubin platform [2][3] - The transition to high-density interconnects and advanced materials in PCB design is identified as a key driver for enhancing server performance and efficiency [3][4] Group 1: AI Server Design Evolution - AI servers are moving towards a cableless architecture, which enhances signal integrity and transmission stability by utilizing multi-layer PCBs instead of traditional cabling [2] - The Rubin platform's design incorporates advanced materials and high-density interconnects, resulting in a more than twofold increase in PCB value compared to previous generations [3] Group 2: Material Upgrades and Supply Chain Dynamics - The demand for high-performance PCBs in AI servers is driving significant changes in upstream materials, particularly in fiberglass and copper foil, which are critical for dielectric and thermal stability [4] - Japanese company Nittobo is investing 15 billion yen to expand production of T-glass, which is expected to triple its capacity by the end of 2026, highlighting the increasing importance of advanced materials in PCB manufacturing [4] Group 3: Future Outlook - TrendForce anticipates that 2026 will mark a new starting point for PCBs, driven by technology content that enhances value [5]