Core Viewpoint - The article discusses the current state and future direction of photomask manufacturing, highlighting the challenges and potential strategies for managing photomask costs in the semiconductor industry. Cost Management and Challenges - Photomask costs have historically been a significant concern, but their relative impact on total wafer manufacturing costs may be decreasing as overall costs rise due to increased complexity in processes and tools [2] - The number of mask layers per device is increasing significantly, and with the adoption of EUV lithography, the lifespan of masks is decreasing, leading to more frequent replacements and higher ongoing costs [2] - Speed of production is often prioritized over cost, with strategies to reduce costs including improving yield, lowering material costs, and utilizing computational tools to minimize experimental waste [3] Market Sensitivity and Product Types - The acceptability of photomask costs varies by product type; for high-value products, the cost of masks can be seen as a necessary expense, while in price-sensitive markets, such as automotive, every cost is critical [4] - The industry is actively working to lower costs, but high photomask costs are not currently seen as a drag on the overall industry [4] Technological Changes and Future Directions - The introduction of high numerical aperture (NA) EUV will require significant changes in photomask manufacturing, including the potential shift to 6 x 12 inch masks, which will impact the entire supply chain [6][11] - The transition to larger masks will necessitate redesigning tools and processes, affecting everything from mask substrate manufacturing to etching and measurement tools [6][12] - The industry may face challenges in controlling mask resolution and may need to adopt multi-blank strategies, complicating the manufacturing process [7][11] Disruptive Innovations - The potential adoption of larger photomasks could lead to a significant transformation in the industry, impacting economic viability and tool chains [11][12] - The next generation of lithography platforms from ASML may unify mask formats across different NA systems, which could create substantial operational and capital challenges for mask manufacturers [12] - The introduction of AI and advanced computational methods in photomask processes could revolutionize the industry, allowing for better predictions and optimizations in lithography results [10]