Core Insights - The establishment of the Chengdu R&D and production base marks a significant step for the company in enhancing its core R&D capabilities and large-scale production capacity, solidifying its leading position in the global high-end semiconductor equipment sector [1][2] Group 1: Project Overview - The Chengdu project covers approximately 50 acres with a building area of about 70,000 square meters, aiming to be a comprehensive base for R&D and manufacturing, scheduled for completion and production by 2027 [2] - The total area of the company's future facilities will reach 750,000 square meters, enhancing its product R&D and manufacturing capabilities [2] Group 2: Strategic Goals - The Chengdu base is tasked with three core missions: technological breakthroughs, industry complementarity, and cluster leadership, focusing on key equipment technologies such as chemical vapor deposition and atomic layer deposition [2] - The company aims to cover 50% to 60% of the critical areas in integrated circuit equipment over the next five to ten years, aspiring to become a platform company for high-end equipment [1] Group 3: Recent Developments - In September, the company also announced the commencement of its South China headquarters R&D and production base, which will focus on large flat panel display equipment and expand into emerging micro-processing technologies [3] - The establishment of the Zhiwei Capital fund, with an initial scale of 1.5 billion yuan, aims to create an ecological investment system covering the semiconductor and emerging strategic fields [3] Group 4: Financial Performance - Since its establishment in 2004, the company has maintained an average annual revenue growth of over 35%, with a projected sales growth of 44.7% in 2024 compared to 2023 [4] - In the first half of 2025, the company's revenue is expected to reach 4.961 billion yuan, reflecting a year-on-year growth of 43.9% [4] - The R&D investment in the first half of 2025 is projected to be 1.492 billion yuan, representing a year-on-year increase of approximately 53.7%, with R&D expenditure accounting for about 30.07% of the company's revenue [4]

Core Viewpoint - The company plans to raise up to 4.6 billion yuan through a private placement to invest in high-end semiconductor equipment industrialization and advanced technology R&D projects, as well as to supplement working capital [1][2]. Group 1: Investment and Project Details - The company intends to invest 1.5 billion yuan in the high-end semiconductor equipment industrialization base, which is part of a project initially funded with 268 million yuan from its IPO [1]. - The new industrialization base will be located in Shenyang, Liaoning Province, and will include clean rooms, automated warehouses, and testing laboratories, incorporating advanced production technologies to create a scalable, intelligent, and digitalized facility [1][2]. Group 2: Business Growth and Market Demand - The company has experienced rapid growth in business scale due to strong downstream market demand, with revenue figures of 1.706 billion yuan in 2022, 2.705 billion yuan in 2023, and a projected 4.103 billion yuan in 2024, resulting in a compound annual growth rate of 55.08% [2]. - The current production capacity is expected to be insufficient to meet future customer orders, prompting the need for increased capacity through the new projects [2]. Group 3: Technological Advancements and Industry Impact - The project will focus on hardware innovation, control systems, software development, and high-performance film process development to enhance the R&D and optimization of new high-end film deposition equipment [3]. - This initiative aims to support the overall domestic transformation of the semiconductor industry chain and improve the security and autonomy of the domestic semiconductor supply chain [3].